カテゴリ： IT/電子, MarketsandMarkets, 世界

3D IC・2.5D ICパッケージングのグローバル市場予測（～2028）：3Dウェーハレベルチップスケールパッケージング(WLCSP)、3Dスルーシリコンビア(TSV)、2.5D

■ 英語タイトル：3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028

調査会社MarketsandMarkets社が発行したリサーチレポート（データ管理コード：SE4844-23）■ 発行会社/調査会社：MarketsandMarkets
■ 商品コード：SE4844-23
■ 発行日：2023年5月2日
■ 調査対象地域：グローバル
■ 産業分野：半導体・電子
■ ページ数：218
■ レポート言語：英語
■ レポート形式：PDF
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★グローバルリサーチ資料[3D IC・2.5D ICパッケージングのグローバル市場予測（～2028）：3Dウェーハレベルチップスケールパッケージング(WLCSP)、3Dスルーシリコンビア(TSV)、2.5D]についてメールでお問い合わせはこちら
*** レポート概要（サマリー）***

MarketsandMarkets社は、世界の3D IC・2.5D ICパッケージング市場規模が2023年から2028年まで年平均10.7%成長し、2023年の493億ドルから2028年には820億ドルに達すると予測しています。当調査レポートは、3D IC・2.5D ICパッケージングの世界市場について調査・分析し、イントロダクション、調査手法、エグゼクティブサマリー、プレミアムインサイト、市場概要、パッケージング技術別（3Dウェーハレベルチップスケールパッケージング(WLCSP)、3Dスルーシリコンビア(TSV)、2.5D）分析、アプリケーション別（ロジック、イメージング＆オプトエレクトロニクス、メモリー、MEMS/センサー、その他）分析、エンドユーザー別（家電、工業、通信、自動車、その他）分析、地域別（北米、ヨーロッパ、アジア太平洋、その他地域）分析、競争状況などの内容がまとめられています。なお、参入企業情報として、Samsung (South Korea)、Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan)、Intel Corporation (US)、ASE Technology Holding Co., Ltd. (Taiwan)、Amkor Technology (US)などが含まれています。
・イントロダクション
・調査手法
・エグゼクティブサマリー
・プレミアムインサイト
・市場概要
・世界の3D IC・2.5D ICパッケージング市場規模：パッケージング技術別
　 - 3Dウェーハレベルチップスケールパッケージング(WLCSP)の市場規模
　 - 3Dスルーシリコンビア(TSV)パッケージングの市場規模
　 - 2.5Dパッケージングの市場規模
・世界の3D IC・2.5D ICパッケージング市場規模：アプリケーション別
　 - ロジックの市場規模
　 - イメージング＆オプトエレクトロニクスの市場規模
　 - メモリーの市場規模
　 - MEMS/センサーの市場規模
　 - その他アプリケーションの市場規模
・世界の3D IC・2.5D ICパッケージング市場規模：エンドユーザー別
　 - 家電における市場規模
　 - 工業における市場規模
　 - 通信における市場規模
　 - 自動車における市場規模
　 - その他エンドユーザーにおける市場規模
・世界の3D IC・2.5D ICパッケージング市場規模：地域別
　 - 北米の3D IC・2.5D ICパッケージング市場規模
　 - ヨーロッパの3D IC・2.5D ICパッケージング市場規模
　 - アジア太平洋の3D IC・2.5D ICパッケージング市場規模
　 - その他地域の3D IC・2.5D ICパッケージング市場規模
・競争状況
・企業情報

“3D IC・2.5D ICパッケージング市場は、2023年の493億米ドルから2028年には820億米ドルに達し、2023年から2028年までの年平均成長率は10.7％と予測されている”
3D IC・2.5D ICパッケージング市場の成長を促進する主な要因には、集積密度の向上や電子機器の小型化、家電やゲーム機器に対する需要の高まりなどがあります。

“3D TSVが提供する最高の相互接続密度が市場の需要を促進”
TSVは、シリコンウエハーの厚さ全体をスライスすることにより、3D ICのさまざまな層を結合する垂直相互接続のことです。TSVは、ICレイヤーをまたいだ、より効果的な信号伝送を可能にし、信号の移動距離を短縮することで、消費電力を抑え、性能を向上させます。

“ADASと自律走行におけるICパッケージングの利用が市場成長を促進”
今日の自動車には、ECU、センサー、パワーモジュール、マイクロプロセッサー、DSP、先進運転支援システムなど、さまざまな技術デバイスが統合されており、3D IC・2.5D ICパッケージングによって、DRAM、NANDフラッシュ、NORフラッシュ、SSDストレージなどのメモリーの使用が可能になっています。3D ICの低消費電力と高密度実装が、自動車産業におけるメモリ・アプリケーションの成長を牽引しています。

“自動車産業によるMEMS/センサーの採用が市場成長を牽引”
自動車産業は、性能向上、コスト削減、信頼性向上のためにMEMSセンサを採用しています。例えば、自動車産業における慣性MEMSセンサとして、エアバッグ制御用のクラッシュセンシングがあります。エアバッグ制御用クラッシュセンシング、動的車両制御、横転検知、盗難防止システムなど、自動車のいくつかの高度な機能は、高性能、高速応答、低消費電力、小型化を保証する高度なパッケージングを備えたMEMSを要求しています。

“予測期間中、北米が第2位の市場シェアを占める見込み”
北米の3D IC・2.5D ICパッケージング市場は、さらに米国、カナダ、メキシコにセグメント化されており、Intel Corporation（米国）、Texas Instruments Inc.（米国）、Qualcomm Incorporated（米国）、Advanced Micro Devices, Inc.（米国）などの大手半導体企業の本拠地であるため、この地域は技術的に進んでいます。

3D IC・2.5D ICパッケージング市場における主要参入企業のプロファイルの内訳は以下の通りです。
– 企業タイプ別： ティア1：38%、ティア2：28%、ティア3：34%
– 役職別 Cレベル – 40%、ディレクターレベル – 30%、その他 – 30%
– 地域タイプ別 北米：35%、欧州：35%、アジア太平洋地域：20%、その他の地域：10%

3D IC・2.5D ICパッケージング市場の主要プレーヤーは、Samsung（韓国）、Taiwan Semiconductor Manufacturing Company, Ltd.（台湾）、Intel Corporation（米国）である。(台湾）、Intel Corporation（米国）、ASE Technology Holding Co. (Ltd.（台湾）、Amkor Technology（米国）などです。

調査範囲
この調査レポートは、3D IC・2.5D ICパッケージング市場を、パッケージング技術、用途、エンドユーザー、地域別に分類し、市場規模を予測しています。また、市場成長に影響を与える促進要因、阻害要因、機会、課題についても包括的にレビューしています。また、市場の量的側面に加えて質的側面もカバーしています。

レポートを購入する理由
本レポートは、3D IC・2.5D ICパッケージング市場全体と関連セグメントの最も近い概算収益に関する情報を提供し、同市場の市場リーダー/新規参入者に役立ちます。本レポートは、利害関係者が競争状況を理解し、市場での地位を強化し、適切な市場参入戦略を計画するためのより多くの洞察を得るのに役立ちます。また、市場動向を理解し、主要な市場促進要因、阻害要因、機会、課題に関する情報を提供します。

本レポートでは、以下のポイントに関する洞察を提供しています：
– 主な促進要因（電子製品における高度なアーキテクチャへのニーズの高まり；電子デバイスの集積度向上と小型化のトレンドの高まり；家電およびゲーム機器への需要の高まり）、阻害要因（集積度向上に起因する熱問題；3D ICパッケージの単価の高さ）、機会（ハイエンドコンピューティング/サーバー/データセンターの採用の高まり；IoTデバイスの小型化；スマートインフラおよびスマートシティプロジェクトの増加）、および課題（効果的なサプライチェーン管理；3D ICパッケージングにおける信頼性の課題）の分析
– 製品開発／イノベーション： 3D IC・2.5D ICパッケージング市場における今後の技術、研究開発活動、新製品発売に関する詳細な洞察
– 市場開発： 有利な市場に関する包括的な情報 – 当レポートでは、さまざまな地域の3D IC・2.5D ICパッケージング市場を分析
– 市場の多様化： 3D ICおよび2.5D ICパッケージング市場における新製品、未開拓地域、最近の開発、投資に関する詳細情報
競合評価： Samsung (韓国)、Taiwan Semiconductor Manufacturing Company, Ltd. (台湾)、Intel Corporation (米国)、Intel Corporation（米国）、ASE Technology Holding Co., Ltd.（台湾）、Amkor Technology（米国）などの主要企業の市場シェア、成長戦略、製品提供に関する詳細な評価

世界の市場調査レポート販売サイト（H&Iグローバルリサーチ株式会社運営）
*** レポート目次（コンテンツ）***

1 INTRODUCTION 27
1.1 STUDY OBJECTIVES 27
1.2 MARKET DEFINITION 27
1.2.1 INCLUSIONS AND EXCLUSIONS 28
1.3 STUDY SCOPE 28
FIGURE 1 3D IC AND 2.5D IC PACKAGING MARKET: SEGMENTATION 28
1.3.1 REGIONAL SCOPE 29
1.3.2 YEARS CONSIDERED 29
1.4 CURRENCY CONSIDERED 30
1.5 LIMITATIONS 30
1.6 STAKEHOLDERS 30
1.7 SUMMARY OF CHANGES 31
1.7.1 RECESSION IMPACT 31
2 RESEARCH METHODOLOGY 32
2.1 RESEARCH DATA 32
FIGURE 2 3D IC AND 2.5D IC PACKAGING MARKET: RESEARCH DESIGN 32
2.1.1 SECONDARY AND PRIMARY RESEARCH 34
2.1.2 SECONDARY DATA 34
2.1.2.1 Major secondary sources 35
2.1.2.2 Secondary sources 35
2.1.3 PRIMARY DATA 35
2.1.3.1 Breakdown of primaries 36
2.1.3.2 Key data from primary sources 37
2.1.3.3 Key industry insights 38
2.2 MARKET SIZE ESTIMATION 38
FIGURE 3 PROCESS FLOW OF MARKET SIZE ESTIMATION 38
2.2.1 BOTTOM-UP APPROACH 39
2.2.1.1 Estimating market size by bottom-up approach (demand side) 39
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 40
2.2.2 TOP-DOWN APPROACH 40
2.2.2.1 Estimating market size by top-down approach (supply side) 40
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 41
FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH (SUPPLY SIDE)—REVENUE GENERATED FROM 3D IC AND 2.5D IC PACKAGING SOLUTIONS AND SERVICES 41
2.3 DATA TRIANGULATION 42
FIGURE 7 DATA TRIANGULATION 42
2.4 RESEARCH ASSUMPTIONS 43
TABLE 1 ASSUMPTIONS FOR RESEARCH STUDY 43
2.4.1 RESEARCH LIMITATIONS 43
2.5 RISK ASSESSMENT 44
2.6 PARAMETERS CONSIDERED TO ANALYZE IMPACT OF RECESSION ON 3D IC AND 2.5D IC PACKAGING MARKET 44
3 EXECUTIVE SUMMARY 45
3.1 3D IC AND 2.5D IC PACKAGING MARKET: RECESSION IMPACT 46
FIGURE 8 RECESSION IMPACT: GDP GROWTH PROJECTION UNTIL 2023 FOR MAJOR ECONOMIES 46
FIGURE 9 RECESSION IMPACT ON 3D IC AND 2.5D IC PACKAGING MARKET, 2019–2028 (USD MILLION) 47
FIGURE 10 CONSUMER ELECTRONICS TO HOLD LARGEST MARKET SHARE AMONG END USERS IN 3D IC AND 2.5D IC PACKAGING MARKET 47
FIGURE 11 MEMORY TO HOLD LARGEST MARKET SHARE AMONG APPLICATIONS IN 3D IC AND 2.5D IC PACKAGING MARKET 48
FIGURE 12 2.5D PACKAGING TECHNOLOGY TO CONTINUE TO HOLD LARGEST MARKET SHARE IN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD 48
FIGURE 13 3D IC AND 2.5D IC PACKAGING MARKET IN ASIA PACIFIC TO EXHIBIT FASTEST GROWTH DURING FORECAST PERIOD 49
4 PREMIUM INSIGHTS 50
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET 50
FIGURE 14 INCREASED ADOPTION OF CONSUMER ELECTRONICS AND GAMING DEVICES TO BOOST MARKET GROWTH 50
4.2 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER 50
FIGURE 15 MILITARY & AEROSPACE TO REGISTER HIGHEST CAGR FROM 2023 TO 2028 50
4.3 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY 51
FIGURE 16 2.5D TO HOLD LARGEST SHARE OF 3D IC AND 2.5D IC PACKAGING MARKET IN 2028 51
4.4 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION 51
FIGURE 17 MEMORY TO HOLD LARGEST SHARE OF 3D IC AND 2.5D IC PACKAGING MARKET IN 2028 51
4.5 3D IC AND 2.5D IC PACKAGING MARKET IN ASIA PACIFIC, BY END USER AND COUNTRY 52
FIGURE 18 CONSUMER ELECTRONICS VERTICAL AND CHINA WERE LARGEST SHAREHOLDERS IN ASIA PACIFIC 3D IC AND 2.5D IC PACKAGING MARKET IN 2022 52
4.6 GEOGRAPHIC SNAPSHOT OF 3D IC AND 2.5D IC PACKAGING MARKET 53
FIGURE 19 3D IC AND 2.5D IC PACKAGING MARKET IN MEXICO EXPECTED TO GROW AT FASTEST RATE DURING FORECAST PERIOD 53
5 MARKET OVERVIEW 54
5.1 INTRODUCTION 54
5.2 MARKET DYNAMICS 54
FIGURE 20 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES: 3D IC AND 2.5D IC PACKAGING MARKET 54
5.2.1 DRIVERS 55
FIGURE 21 ANALYSIS OF IMPACT OF DRIVERS ON 3D IC AND 2.5D IC PACKAGING MARKET 55
5.2.1.1 Increasing need for advanced architecture in electronic products 55
5.2.1.2 Rising trend of increased integration density and miniaturization of electronic devices 55
5.2.1.3 Growing demand for consumer electronics and gaming devices 56
FIGURE 22 NUMBER OF SMARTPHONE AND MOBILE PHONE USERS GLOBALLY, 2020–2025 (BILLION) 57
5.2.2 RESTRAINTS 57
FIGURE 23 ANALYSIS OF IMPACT OF RESTRAINTS ON 3D IC AND 2.5D IC PACKAGING MARKET 57
5.2.2.1 Thermal issues resulting from higher level of integration 57
5.2.2.2 High unit cost of 3D IC packages 58
5.2.3 OPPORTUNITIES 58
FIGURE 24 ANALYSIS OF IMPACT OF OPPORTUNITIES ON 3D IC AND 2.5D IC PACKAGING MARKET 58
5.2.3.1 Growing adoption of high-end computing, servers, and data centers 58
5.2.3.2 Miniaturization of IoT devices 59
5.2.3.3 Rising number of smart infrastructure and smart city projects 59
5.2.4 CHALLENGES 60
FIGURE 25 ANALYSIS OF IMPACT OF CHALLENGES ON 3D IC AND 2.5D IC PACKAGING MARKET 60
5.2.4.1 Effective supply chain management 60
5.2.4.2 Reliability challenges in 3D IC packaging 60
5.3 SUPPLY CHAIN ANALYSIS 61
FIGURE 26 SUPPLY CHAIN ANALYSIS: 3D IC AND 2.5D IC PACKAGING MARKET 61
5.4 3D IC AND 2.5D IC PACKAGING ECOSYSTEM 63
FIGURE 27 3D IC AND 2.5D IC PACKAGING ECOSYSTEM 63
5.5 REVENUE SHIFT AND NEW REVENUE POCKETS FOR 3D IC AND 2.5D IC PACKAGING MARKET 64
FIGURE 28 REVENUE SHIFT IN 3D IC AND 2.5D IC PACKAGING MARKET 64
5.6 AVERAGE SELLING PRICE ANALYSIS 64
TABLE 2 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS, 2022 (THOUSAND UNITS) 65
5.6.1 AVERAGE SELLING PRICE OF 3D IC AND 2.5D IC PACKAGING PRODUCTS/SOLUTIONS, BY KEY PLAYERS 65
FIGURE 29 AVERAGE SELLING PRICE OF 3D IC AND 2.5D IC PACKAGING PRODUCTS/SOLUTIONS, BY KEY PLAYERS 65
5.6.2 AVERAGE SELLING PRICE TREND 65
TABLE 3 AVERAGE SELLING PRICE: 3D IC AND 2.5D IC PACKAGING MARKET, 12-INCH EQUIVALENT WAFERS, (USD/THOUSAND UNITS) 65
FIGURE 30 AVERAGE SELLING PRICE: 3D IC AND 2.5D IC PACKAGING MARKET, BY WAFER (USD/THOUSAND UNITS) 66
5.7 TECHNOLOGY TRENDS 66
5.7.1 FAN-OUT WAFER-LEVEL PACKAGING 66
5.7.2 FAN-OUT PANEL-LEVEL PACKAGING 67
5.8 PORTER’S FIVE FORCES ANALYSIS 67
TABLE 4 3D IC AND 2.5D IC PACKAGING MARKET: PORTER’S FIVE FORCES ANALYSIS 67
FIGURE 31 PORTER’S FIVE FORCES ANALYSIS 68
5.8.1 THREAT OF NEW ENTRANTS 69
5.8.2 THREAT OF SUBSTITUTES 69
5.8.3 BARGAINING POWER OF SUPPLIERS 69
5.8.4 BARGAINING POWER OF BUYERS 69
5.8.5 INTENSITY OF COMPETITIVE RIVALRY 70
5.9 KEY STAKEHOLDERS AND BUYING PROCESS AND/ OR BUYING CRITERIA 70
5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS 70
FIGURE 32 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END USERS 70
TABLE 5 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 VERTICALS (%) 71
5.9.2 BUYING CRITERIA 71
FIGURE 33 KEY BUYING CRITERIA FOR TOP THREE VERTICALS 71
TABLE 6 KEY BUYING CRITERIA FOR TOP THREE VERTICALS 71
5.10 CASE STUDY ANALYSIS 72
5.10.1 CLOSED-LOOP MONITORING AND CONTROL BASED ON THERMAL BEHAVIOR REDUCED WAFER REJECTION 72
5.10.2 SPTS’S DRIE TECHNOLOGY STRENGTHENED IMEC’S SILICON ETCH PLATFORM 72
5.11 TRADE ANALYSIS 72
5.11.1 IMPORT SCENARIO 73
TABLE 7 IMPORT DATA, BY COUNTRY, 2018–2022 (USD MILLION) 73
5.11.2 EXPORT SCENARIO 73
TABLE 8 EXPORT DATA, BY COUNTRY, 2018–2022 (USD MILLION) 74
5.12 PATENT ANALYSIS 75
TABLE 9 NOTABLE PATENTS RELATED TO 3D IC AND 2.5D IC PACKAGING MARKET, 2020–2023 75
FIGURE 34 NUMBER OF PATENTS GRANTED PER YEAR, 2013–2022 79
TABLE 10 NUMBER OF PATENTS REGISTERED RELATED TO 3D IC AND 2.5D IC PACKAGING MARKET IN LAST 10 YEARS 79
FIGURE 35 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS 80
5.13 KEY CONFERENCES AND EVENTS, 2023–2024 80
TABLE 11 3D IC AND 2.5D IC PACKAGING MARKET: KEY CONFERENCES AND EVENTS 80
5.14 STANDARDS AND REGULATORY LANDSCAPE 81
5.14.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 81
TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 81
TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 82
TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 82
5.14.2 KEY REGULATIONS AND STANDARDS 83
5.14.2.1 North America 83
5.14.2.2 Europe 83
5.14.2.3 Asia Pacific 84
5.14.2.4 Regulations 84
5.14.2.5 Standards 84
6 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY 86
6.1 INTRODUCTION 87
FIGURE 36 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY 87
TABLE 15 COMPARISON BETWEEN 2.5D AND 3D IC TECHNOLOGIES 88
FIGURE 37 MARKET FOR 3D WLCSP TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 88
TABLE 16 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 89
TABLE 17 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 89
6.2 3D WAFER-LEVEL CHIP-SCALE PACKAGING (WLCSP) 89
6.2.1 USE OF 3D WLCSP IN CONSUMER ELECTRONICS TO DRIVE MARKET 89
TABLE 18 3D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 90
TABLE 19 3D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 90
6.3 3D THROUGH-SILICON VIA (TSV) 91
6.3.1 HIGHEST INTERCONNECT DENSITY OFFERED BY 3D TSV TO FUEL DEMAND 91
TABLE 20 3D TSV: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 91
TABLE 21 3D TSV: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 92
6.4 2.5D 92
6.4.1 REDUCED COST BENEFIT OFFERED BY 2.5D IC PACKAGING TO DRIVE MARKET 92
TABLE 22 2.5D: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 93
TABLE 23 2.5D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 93
7 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION 94
7.1 INTRODUCTION 95
FIGURE 38 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION 95
FIGURE 39 MEMS/SENSORS TO RECORD HIGHEST CAGR DURING FORECAST PERIOD 95
TABLE 24 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 96
TABLE 25 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 96
7.2 LOGIC 97
7.2.1 GROWING PENETRATION OF IOT TO DRIVE MARKET 97
TABLE 26 LOGIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 97
TABLE 27 LOGIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 98
7.3 IMAGING & OPTOELECTRONICS 98
7.3.1 RISING DEMAND FOR SECURITY AND REAL-TIME MONITORING IN AUTOMOBILES TO DRIVE MARKET 98
FIGURE 40 MILITARY & AEROSPACE MARKET TO GROW AT HIGHEST CAGR FROM 2023 TO 2028 99
TABLE 28 IMAGING & OPTOELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 99
TABLE 29 IMAGING & OPTOELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 100
7.4 MEMORY 100
7.4.1 INCREASED USE OF ARTIFICIAL INTELLIGENCE AND MACHINE LEARNING TO DRIVE MARKET 100
TABLE 30 MEMORY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 101
TABLE 31 MEMORY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 101
7.5 MEMS/SENSORS 101
7.5.1 ADOPTION OF MEMS/SENSORS BY AUTOMOTIVE INDUSTRY TO DRIVE MARKET 101
TABLE 32 MEMS/SENSORS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 102
TABLE 33 MEMS/SENSORS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 102
7.6 LEDS 103
7.6.1 USE OF LEDS IN FIBER OPTICS TO DRIVE MARKET 103
TABLE 34 LEDS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 103
TABLE 35 LEDS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 104
7.7 OTHERS 104
TABLE 36 OTHERS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 105
TABLE 37 OTHERS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 105
8 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER 106
8.1 INTRODUCTION 107
FIGURE 41 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER 107
FIGURE 42 MILITARY & AEROSPACE MARKET TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 107
TABLE 38 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 108
TABLE 39 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 108
8.2 CONSUMER ELECTRONICS 109
8.2.1 INCREASING MEMORY REQUIREMENTS IN CONSUMER ELECTRONICS TO FUEL MARKET 109
TABLE 40 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 109
TABLE 41 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 110
TABLE 42 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 110
TABLE 43 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 110
8.3 INDUSTRIAL 111
8.3.1 RISING ADOPTION OF INDUSTRY 4.0 TO DRIVE MARKET 111
TABLE 44 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 111
TABLE 45 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 112
TABLE 46 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 112
TABLE 47 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 112
8.4 TELECOMMUNICATIONS 113
8.4.1 GROWING USE CASES OF 5G TECHNOLOGY TO FUEL MARKET 113
TABLE 48 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 113
TABLE 49 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 114
TABLE 50 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 114
TABLE 51 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 114
8.5 AUTOMOTIVE 115
8.5.1 USE OF IC PACKAGING IN ADAS AND AUTONOMOUS DRIVING TO FUEL MARKET 115
TABLE 52 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 115
TABLE 53 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 116
TABLE 54 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 116
TABLE 55 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 116
8.6 MILITARY & AEROSPACE 117
8.6.1 NEED FOR RELIABLE AND SECURE COMMUNICATION TO FUEL MARKET 117
TABLE 56 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 117
TABLE 57 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 118
TABLE 58 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 118
TABLE 59 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 118
8.7 MEDICAL DEVICES 119
8.7.1 CAPABILITY TO INCORPORATE MANY SENSORS INTO SINGLE PACKAGE TO FUEL MARKET DEMAND FOR IC PACKAGING 119
TABLE 60 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 119
TABLE 61 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 120
TABLE 62 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 120
TABLE 63 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 120
9 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION 121
9.1 INTRODUCTION 122
FIGURE 43 ASIA PACIFIC TO WITNESS HIGHEST CAGR IN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD 122
TABLE 64 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2019–2022 (USD MILLION) 122
TABLE 65 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2023–2028 (USD MILLION) 123
9.2 NORTH AMERICA 123
FIGURE 44 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT 124
TABLE 66 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 124
TABLE 67 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 125
TABLE 68 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 125
TABLE 69 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 125
FIGURE 45 CONSUMER ELECTRONICS TO HOLD LARGEST MARKET SHARE IN NORTH AMERICAN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD 126
9.2.1 US 126
9.2.1.1 US to lead 3D IC and 2.5D IC packaging market in North America 126
TABLE 70 US: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 127
TABLE 71 US: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 127
9.2.2 CANADA 127
9.2.2.1 Establishment of Canada’s Semiconductor Council to drive regional market 127
TABLE 72 CANADA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 129
TABLE 73 CANADA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 129
9.2.3 MEXICO 129
9.2.3.1 Automotive industry in Mexico to fuel market 129
TABLE 74 MEXICO: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 130
TABLE 75 MEXICO: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 130
9.3 EUROPE 131
FIGURE 46 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT 132
TABLE 76 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 133
TABLE 77 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 133
TABLE 78 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 133
TABLE 79 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 134
9.3.1 UK 134
9.3.1.1 Increased use of 5G networks to fuel market 134
TABLE 80 UK: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 135
TABLE 81 UK: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 135
9.3.2 GERMANY 135
9.3.2.1 Automotive industry to drive market 135
TABLE 82 GERMANY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 136
TABLE 83 GERMANY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 136
9.3.3 FRANCE 137
9.3.3.1 Highly developed transportation and communication networks to drive market 137
TABLE 84 FRANCE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 137
TABLE 85 FRANCE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 138
9.3.4 REST OF EUROPE 138
TABLE 86 REST OF EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 139
TABLE 87 REST OF EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 139
9.4 ASIA PACIFIC 140
FIGURE 47 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT 141
TABLE 88 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 142
TABLE 89 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 142
TABLE 90 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 142
TABLE 91 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 143
FIGURE 48 MILITARY & AEROSPACE SEGMENT IN ASIA PACIFIC MARKET TO RECORD HIGHEST CAGR DURING FORECAST PERIOD 143
9.4.1 CHINA 144
9.4.1.1 Increased semiconductor manufacturing to drive market 144
TABLE 92 CHINA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 144
TABLE 93 CHINA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 145
9.4.2 JAPAN 145
9.4.2.1.1 Increased production of consumer electronics and automobiles to drive market 145
TABLE 94 JAPAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 146
TABLE 95 JAPAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 146
9.4.3 TAIWAN 146
9.4.3.1 Presence of many key OSAT companies to fuel market 146
TABLE 96 TAIWAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 147
TABLE 97 TAIWAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 147
9.4.4 SOUTH KOREA 147
9.4.4.1 High manufacturing capacity to drive market 147
TABLE 98 SOUTH KOREA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 148
TABLE 99 SOUTH KOREA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 148
9.4.5 REST OF ASIA PACIFIC 148
TABLE 100 REST OF ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 149
TABLE 101 REST OF ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 149
9.5 ROW 150
TABLE 102 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2019–2022 (USD MILLION) 150
TABLE 103 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2023–2028 (USD MILLION) 150
TABLE 104 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 150
TABLE 105 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 151
9.5.1 MIDDLE EAST & AFRICA 151
TABLE 106 MIDDLE EAST & AFRICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 151
TABLE 107 MIDDLE EAST & AFRICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 152
9.5.2 SOUTH AMERICA 152
TABLE 108 SOUTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 152
TABLE 109 SOUTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 153
10 COMPETITIVE LANDSCAPE 154
10.1 INTRODUCTION 154
10.2 KEY PLAYER STRATEGIES/RIGHT TO WIN 155
TABLE 110 OVERVIEW OF STRATEGIES DEPLOYED BY KEY PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET 155
10.2.1 PRODUCT PORTFOLIO 156
10.2.2 REGIONAL FOCUS 156
10.2.3 ORGANIC/INORGANIC GROWTH STRATEGIES 156
10.3 MARKET SHARE ANALYSIS, 2022 156
TABLE 111 3D IC AND 2.5D IC PACKAGING MARKET SHARE ANALYSIS (2022) 157
10.4 REVENUE ANALYSIS OF TOP PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET 158
FIGURE 49 FIVE-YEAR REVENUE ANALYSIS OF TOP PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET 158
10.5 KEY COMPANY EVALUATION QUADRANT, 2022 159
10.5.1 STARS 159
10.5.2 PERVASIVE PLAYERS 159
10.5.3 EMERGING LEADERS 159
10.5.4 PARTICIPANTS 159
FIGURE 50 3D IC AND 2.5D IC PACKAGING MARKET (GLOBAL): KEY COMPANY EVALUATION QUADRANT, 2022 160
10.6 COMPETITIVE BENCHMARKING 161
10.6.1 COMPANY FOOTPRINT, BY PACKAGING TECHNOLOGY 161
10.6.2 COMPANY FOOTPRINT, BY REGION 161
10.6.3 OVERALL COMPANY FOOTPRINT 162
10.7 STARTUP/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES) EVALUATION QUADRANT, 2022 162
TABLE 112 3D IC AND 2.5D IC PACKAGING MARKET: LIST OF KEY STARTUPS/SMES 162
10.7.1 COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES 163
10.7.1.1 Company footprint, by packaging technology 163
10.7.1.2 Company footprint, by region 163
10.7.2 PROGRESSIVE COMPANIES 163
10.7.3 RESPONSIVE COMPANIES 163
10.7.4 DYNAMIC COMPANIES 163
10.7.5 STARTING BLOCKS 163
FIGURE 51 3D IC AND 2.5D IC PACKAGING MARKET (GLOBAL): STARTUPS/SMES EVALUATION QUADRANT, 2022 164
10.8 COMPETITIVE SITUATION AND TRENDS 165
10.8.1 PRODUCT LAUNCHES AND DEVELOPMENTS 165
TABLE 113 3D IC AND 2.5D IC PACKAGING MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2019–2023 165
10.8.2 DEALS 166
TABLE 114 3D IC AND 2.5D IC PACKAGING MARKET: DEALS, 2019–2023 166
11 COMPANY PROFILES 169
11.1 INTRODUCTION 169
11.2 KEY PLAYERS 170
(Business overview, Products/Services/Solutions offered, Recent Developments, MNM view)*
11.2.1 SAMSUNG 170
TABLE 115 SAMSUNG: BUSINESS OVERVIEW 170
FIGURE 52 SAMSUNG: COMPANY SNAPSHOT 171
11.2.2 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED 174
TABLE 116 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: BUSINESS OVERVIEW 174
FIGURE 53 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.: COMPANY SNAPSHOT 175
11.2.3 INTEL CORPORATION 178
TABLE 117 INTEL CORPORATION: BUSINESS OVERVIEW 178
FIGURE 54 INTEL CORPORATION: COMPANY SNAPSHOT 179
11.2.4 ASE TECHNOLOGY HOLDING CO., LTD. 181
TABLE 118 ASE TECHNOLOGY HOLDING CO., LTD: BUSINESS OVERVIEW 181
FIGURE 55 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY SNAPSHOT 182
11.2.5 AMKOR TECHNOLOGY 184
TABLE 119 AMKOR TECHNOLOGY: BUSINESS OVERVIEW 184
FIGURE 56 AMKOR TECHNOLOGY: COMPANY SNAPSHOT 185
11.2.6 BROADCOM 188
TABLE 120 BROADCOM: BUSINESS OVERVIEW 188
FIGURE 57 BROADCOM: COMPANY SNAPSHOT 189
11.2.7 TEXAS INSTRUMENTS INC. 191
TABLE 121 TEXAS INSTRUMENTS INC.: BUSINESS OVERVIEW 191
FIGURE 58 TEXAS INSTRUMENTS INC.: COMPANY SNAPSHOT 192
11.2.8 UNITED MICROELECTRONICS CORPORATION 194
TABLE 122 UNITED MICROELECTRONICS CORPORATION: BUSINESS OVERVIEW 194
FIGURE 59 UNITED MICROELECTRONICS CORPORATION: COMPANY SNAPSHOT 195
11.2.9 JCET GROUP CO., LTD. 197
TABLE 123 JCET GROUP CO., LTD.: BUSINESS OVERVIEW 197
FIGURE 60 JCET GROUP CO., LTD.: COMPANY SNAPSHOT 197
11.2.10 POWERTECH TECHNOLOGY INC. 200
TABLE 124 POWERTECH TECHNOLOGY INC.: BUSINESS OVERVIEW 200
FIGURE 61 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT 201
*Details on Business overview, Products/Services/Solutions offered, Recent Developments, MNM view might not be captured in case of unlisted companies.
11.3 OTHER PLAYERS 203
11.3.1 CADENCE DESIGN SYSTEMS, INC. 203
11.3.2 SILICONWARE PRECISION INDUSTRIES CO., LTD. 204
11.3.3 ADVANCED MICRO DEVICES, INC. 205
11.3.4 TEZZARON 206
11.3.5 TELEDYNE TECHNOLOGIES INCORPORATED 207
11.3.6 FUJITSU 208
11.3.7 XPERI INC. 209
11.3.8 MONOLITHIC 3D INC. 210
11.3.9 DECA TECHNOLOGIES 211
11.3.10 3M 212
11.3.11 GLOBALFOUNDRIES INC. 213
11.3.12 NHANCED SEMICONDUCTORS 214
11.3.13 MOLDEX3D 215
11.3.14 CEREBRAS 216
11.3.15 AYAR LABS, INC. 217
12 APPENDIX 218
12.1 DISCUSSION GUIDE 218
12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 221
12.3 CUSTOMIZATION OPTIONS 223
12.4 RELATED REPORTS 223
12.5 AUTHOR DETAILS 224



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