CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO Perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.3. Porter’s five forces analysis
3.3.1. Moderate to high bargaining power of suppliers
3.3.2. Moderate threat of new entrants
3.3.3. Moderate threat of substitutes
3.3.4. Moderate to high intensity of rivalry
3.3.5. Moderate to high bargaining power of buyers
3.4. Market dynamics
3.4.1. Drivers
3.4.1.1. Increase in demand for power electronics component across various industry verticals
3.4.1.2. Rise in need for power management devices
3.4.1.3. Rise in integration of power electronics components in electric vehicles
3.4.2. Restraints
3.4.2.1. Complex integration process of advanced electronics devices
3.4.3. Opportunities
3.4.3.1. Rise in demand for plug-in electric vehicles (PEVs)
3.4.3.2. Innovation in power metal–oxide–semiconductor field-effect transistor (MOSFET)
CHAPTER 4: POWER ELECTRONICS MARKET, BY DEVICE TYPE
4.1. Overview
4.1.1. Market size and forecast
4.2. Power Discrete
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market share analysis by country
4.3. Power Module
4.3.1. Key market trends, growth factors and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market share analysis by country
4.4. Power IC
4.4.1. Key market trends, growth factors and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market share analysis by country
CHAPTER 5: POWER ELECTRONICS MARKET, BY MATERIAL
5.1. Overview
5.1.1. Market size and forecast
5.2. Silicon Carbide
5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market share analysis by country
5.3. Gallium Nitride
5.3.1. Key market trends, growth factors and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market share analysis by country
5.4. Sapphire
5.4.1. Key market trends, growth factors and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market share analysis by country
5.5. Others
5.5.1. Key market trends, growth factors and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market share analysis by country
CHAPTER 6: POWER ELECTRONICS MARKET, BY APPLICATION
6.1. Overview
6.1.1. Market size and forecast
6.2. Power Management
6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market share analysis by country
6.3. UPS
6.3.1. Key market trends, growth factors and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market share analysis by country
6.4. Renewable
6.4.1. Key market trends, growth factors and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market share analysis by country
6.5. Others
6.5.1. Key market trends, growth factors and opportunities
6.5.2. Market size and forecast, by region
6.5.3. Market share analysis by country
CHAPTER 7: POWER ELECTRONICS MARKET, BY END USE
7.1. Overview
7.1.1. Market size and forecast
7.2. Telecommunication
7.2.1. Key market trends, growth factors and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market share analysis by country
7.3. Industrial
7.3.1. Key market trends, growth factors and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market share analysis by country
7.4. Automotive
7.4.1. Key market trends, growth factors and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market share analysis by country
7.5. Consumer Electronics
7.5.1. Key market trends, growth factors and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market share analysis by country
7.6. Military and Defense
7.6.1. Key market trends, growth factors and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market share analysis by country
7.7. Energy and Power
7.7.1. Key market trends, growth factors and opportunities
7.7.2. Market size and forecast, by region
7.7.3. Market share analysis by country
7.8. Others
7.8.1. Key market trends, growth factors and opportunities
7.8.2. Market size and forecast, by region
7.8.3. Market share analysis by country
CHAPTER 8: POWER ELECTRONICS MARKET, BY REGION
8.1. Overview
8.1.1. Market size and forecast By Region
8.2. North America
8.2.1. Key market trends, growth factors and opportunities
8.2.2. Market size and forecast, by Device Type
8.2.3. Market size and forecast, by Material
8.2.4. Market size and forecast, by Application
8.2.5. Market size and forecast, by End Use
8.2.6. Market size and forecast, by country
8.2.6.1. U.S.
8.2.6.1.1. Market size and forecast, by Device Type
8.2.6.1.2. Market size and forecast, by Material
8.2.6.1.3. Market size and forecast, by Application
8.2.6.1.4. Market size and forecast, by End Use
8.2.6.2. Canada
8.2.6.2.1. Market size and forecast, by Device Type
8.2.6.2.2. Market size and forecast, by Material
8.2.6.2.3. Market size and forecast, by Application
8.2.6.2.4. Market size and forecast, by End Use
8.2.6.3. Mexico
8.2.6.3.1. Market size and forecast, by Device Type
8.2.6.3.2. Market size and forecast, by Material
8.2.6.3.3. Market size and forecast, by Application
8.2.6.3.4. Market size and forecast, by End Use
8.3. Europe
8.3.1. Key market trends, growth factors and opportunities
8.3.2. Market size and forecast, by Device Type
8.3.3. Market size and forecast, by Material
8.3.4. Market size and forecast, by Application
8.3.5. Market size and forecast, by End Use
8.3.6. Market size and forecast, by country
8.3.6.1. UK
8.3.6.1.1. Market size and forecast, by Device Type
8.3.6.1.2. Market size and forecast, by Material
8.3.6.1.3. Market size and forecast, by Application
8.3.6.1.4. Market size and forecast, by End Use
8.3.6.2. Germany
8.3.6.2.1. Market size and forecast, by Device Type
8.3.6.2.2. Market size and forecast, by Material
8.3.6.2.3. Market size and forecast, by Application
8.3.6.2.4. Market size and forecast, by End Use
8.3.6.3. France
8.3.6.3.1. Market size and forecast, by Device Type
8.3.6.3.2. Market size and forecast, by Material
8.3.6.3.3. Market size and forecast, by Application
8.3.6.3.4. Market size and forecast, by End Use
8.3.6.4. Rest of Europe
8.3.6.4.1. Market size and forecast, by Device Type
8.3.6.4.2. Market size and forecast, by Material
8.3.6.4.3. Market size and forecast, by Application
8.3.6.4.4. Market size and forecast, by End Use
8.4. Asia-Pacific
8.4.1. Key market trends, growth factors and opportunities
8.4.2. Market size and forecast, by Device Type
8.4.3. Market size and forecast, by Material
8.4.4. Market size and forecast, by Application
8.4.5. Market size and forecast, by End Use
8.4.6. Market size and forecast, by country
8.4.6.1. China
8.4.6.1.1. Market size and forecast, by Device Type
8.4.6.1.2. Market size and forecast, by Material
8.4.6.1.3. Market size and forecast, by Application
8.4.6.1.4. Market size and forecast, by End Use
8.4.6.2. Japan
8.4.6.2.1. Market size and forecast, by Device Type
8.4.6.2.2. Market size and forecast, by Material
8.4.6.2.3. Market size and forecast, by Application
8.4.6.2.4. Market size and forecast, by End Use
8.4.6.3. India
8.4.6.3.1. Market size and forecast, by Device Type
8.4.6.3.2. Market size and forecast, by Material
8.4.6.3.3. Market size and forecast, by Application
8.4.6.3.4. Market size and forecast, by End Use
8.4.6.4. South Korea
8.4.6.4.1. Market size and forecast, by Device Type
8.4.6.4.2. Market size and forecast, by Material
8.4.6.4.3. Market size and forecast, by Application
8.4.6.4.4. Market size and forecast, by End Use
8.4.6.5. Rest of Asia-Pacific
8.4.6.5.1. Market size and forecast, by Device Type
8.4.6.5.2. Market size and forecast, by Material
8.4.6.5.3. Market size and forecast, by Application
8.4.6.5.4. Market size and forecast, by End Use
8.5. LAMEA
8.5.1. Key market trends, growth factors and opportunities
8.5.2. Market size and forecast, by Device Type
8.5.3. Market size and forecast, by Material
8.5.4. Market size and forecast, by Application
8.5.5. Market size and forecast, by End Use
8.5.6. Market size and forecast, by country
8.5.6.1. Latin America
8.5.6.1.1. Market size and forecast, by Device Type
8.5.6.1.2. Market size and forecast, by Material
8.5.6.1.3. Market size and forecast, by Application
8.5.6.1.4. Market size and forecast, by End Use
8.5.6.2. Middle East
8.5.6.2.1. Market size and forecast, by Device Type
8.5.6.2.2. Market size and forecast, by Material
8.5.6.2.3. Market size and forecast, by Application
8.5.6.2.4. Market size and forecast, by End Use
8.5.6.3. Africa
8.5.6.3.1. Market size and forecast, by Device Type
8.5.6.3.2. Market size and forecast, by Material
8.5.6.3.3. Market size and forecast, by Application
8.5.6.3.4. Market size and forecast, by End Use
CHAPTER 9: COMPETITIVE LANDSCAPE
9.1. Introduction
9.2. Top winning strategies
9.3. Product mapping of top 10 player
9.4. Competitive dashboard
9.5. Competitive heatmap
9.6. Top player positioning, 2022
CHAPTER 10: COMPANY PROFILES
10.1. ABB, Ltd.
10.1.1. Company overview
10.1.2. Key executives
10.1.3. Company snapshot
10.1.4. Operating business segments
10.1.5. Product portfolio
10.1.6. Business performance
10.1.7. Key strategic moves and developments
10.2. Fuji Electric Co., Ltd.
10.2.1. Company overview
10.2.2. Key executives
10.2.3. Company snapshot
10.2.4. Operating business segments
10.2.5. Product portfolio
10.2.6. Business performance
10.2.7. Key strategic moves and developments
10.3. Infineon Technologies AG
10.3.1. Company overview
10.3.2. Key executives
10.3.3. Company snapshot
10.3.4. Operating business segments
10.3.5. Product portfolio
10.3.6. Business performance
10.3.7. Key strategic moves and developments
10.4. Microsemi Corporation
10.4.1. Company overview
10.4.2. Key executives
10.4.3. Company snapshot
10.4.4. Operating business segments
10.4.5. Product portfolio
10.4.6. Business performance
10.4.7. Key strategic moves and developments
10.5. Mitsubishi Electric Corporation
10.5.1. Company overview
10.5.2. Key executives
10.5.3. Company snapshot
10.5.4. Operating business segments
10.5.5. Product portfolio
10.5.6. Business performance
10.5.7. Key strategic moves and developments
10.6. Renesas Electronics Corporation
10.6.1. Company overview
10.6.2. Key executives
10.6.3. Company snapshot
10.6.4. Operating business segments
10.6.5. Product portfolio
10.6.6. Business performance
10.6.7. Key strategic moves and developments
10.7. Rockwell Automation, Inc.
10.7.1. Company overview
10.7.2. Key executives
10.7.3. Company snapshot
10.7.4. Operating business segments
10.7.5. Product portfolio
10.7.6. Business performance
10.8. STMicroelectronics N.V.
10.8.1. Company overview
10.8.2. Key executives
10.8.3. Company snapshot
10.8.4. Operating business segments
10.8.5. Product portfolio
10.8.6. Business performance
10.8.7. Key strategic moves and developments
10.9. Texas Instruments Incorporated
10.9.1. Company overview
10.9.2. Key executives
10.9.3. Company snapshot
10.9.4. Operating business segments
10.9.5. Product portfolio
10.9.6. Business performance
10.9.7. Key strategic moves and developments
10.10. Toshiba Corporation
10.10.1. Company overview
10.10.2. Key executives
10.10.3. Company snapshot
10.10.4. Operating business segments
10.10.5. Product portfolio
10.10.6. Business performance
10.10.7. Key strategic moves and developments
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