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3D ICパッケージのグローバル市場（2022年-2029年）：3DウエハーレベルCSP（WLCSP）、3D TSV

■ 英語タイトル：Global 3D IC Packaging Market Size study & Forecast, by Packaging Technology (3D wafer-level chip-scale packaging (WLCSP), 3D TSV), by End-User (Consumer Electronics, Aerospace and Defense, Medical Devices, Communications and Telecom, Automotive), and Regional Analysis, 2022-2029

調査会社Bizwit Research & Consulting社が発行したリサーチレポート（データ管理コード：BZW23FE0075）■ 発行会社/調査会社：Bizwit Research & Consulting
■ 商品コード：BZW23FE0075
■ 発行日：2023年1月29日
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■ 産業分野：IT
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*** レポート概要（サマリー）***

Bizwit Research社の市場調査書によると、2021年に約XX億ドルであった世界の3D ICパッケージ市場規模は、2022年から2029年の間に年平均XX％拡大すると予測されています。当書は、3D ICパッケージの世界市場を対象にし、エグゼクティブサマリー、市場定義・範囲、市場動向、産業分析、リスク分析（新型コロナウイルス感染症の影響）、パッケージング技術別（3DウエハーレベルCSP（WLCSP）、3D TSV）分析、エンドユーザー別（家電、航空宇宙・防衛、医療機器、通信、自動車）分析、地域別（北米、ヨーロッパ、アジア太平洋、中南米、その他地域）分析、競争分析、調査プロセスなどの項目について調査を行いました。なお、当書には、Taiwan Semiconductor Manufacturing Company Limited、Samsung Electronics Co., Ltd.、ASE Group、Amkor Technology、Intel Corporationなどの企業情報が含まれています。
・エグゼクティブサマリー
・市場定義・範囲
・市場動向
・産業分析
・リスク分析（新型コロナウイルス感染症の影響）
・世界3D ICパッケージ市場規模：パッケージング技術別
- 3DウエハーレベルCSP（WLCSP）における市場規模
- 3D TSVにおける市場規模
・世界3D ICパッケージ市場規模：エンドユーザー別
- 家電における市場規模
- 航空宇宙・防衛における市場規模
- 医療機器における市場規模
- 通信における市場規模
- 自動車における市場規模
・世界の3D ICパッケージ市場規模：地域別
- 北米の3D ICパッケージ市場
- ヨーロッパの3D ICパッケージ市場
- アジア太平洋の3D ICパッケージ市場
- 中南米の3D ICパッケージ市場
- その他地域の3D ICパッケージ市場
・競争分析
・調査プロセス

The global 3D IC Packaging Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX % over the forecast period 2022-2029. 3D IC Packaging is a packaging technology. It has major application across various end-user industries including Consumer Electronics, Aerospace and Defense, Medical Devices, Communications and Telecom, Automotive. In this methodology, active chips are integrated by die stacking for the shortest interconnect and smallest package footprint. Also, for numerous IC inside the same package. The 3D IC Packaging market is expanding because of factors such as the rising demand for electronic products and miniaturization of electronic devices.

According to Indian Brand Equity Foundation in 2022, the domestic electronic production in India has grown during 2014-2015 to 2020-2021 from USD 29 billion to USD 67 billion. The IT sector in India is one of the largest contributors with a 9% contribution to GDP. Also, according to the Statista in 2022, revenue in the global consumer electronics market accounts USD 1,062 billion. Whereas rising adoption of high-end computing servers and data centers and strategic initiatives by key-players create lucrative opportunities for the market. However, higher initial investment cost hampers the market growth throughout the forecast period of 2022-2029.

The key regions considered for the Global 3D IC Packaging Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. Asia Pacific is deemed as the dominated and fastest growing region in terms of revenue, owing to the increasing demand from end-use industries, growing penetration of market players and rising adoption of electronic and smart technologies. It includes presence of major companies across the region such as TSMC, SMIC, UMC, and South Korea’s Samsung. Taiwan’s leading chip foundry which boosts the market growth on the forecast period

Major market players included in this report are:
Taiwan Semiconductor Manufacturing Company Limited
Samsung Electronics Co., Ltd.
ASE Group
Amkor Technology
Intel Corporation
Siliconware Precision Industries Co. Ltd (SPIL)
GlobalFoundries
Invensas
Powertech Technology Inc.
Micron technology, Inc

Recent Developments in the Market:
 In May 2021: Intel intends to invest USD 3.5 billion in upgrading its Rio Rancho plant and increasing its workforce by more than 35% at the sprawling complex, one of the company’s three largest US manufacturing hubs. It is expanding its New Mexico operations to produce new generations of chips based on its Foveros 3D packaging technology, which could help the company reclaim its semiconductor industry leadership.
 In October 2021: Cadence Design Systems, Inc. has released the Integrity 3D-IC platform. It is the industry’s first high-capacity, all-in-one 3D-IC platform, combining 3D implementation, system analysis, and design planning into a single, unified cockpit.
Global 3D IC Packaging Market Report Scope:
Historical Data 2019-2020-2021
Base Year for Estimation 2021
Forecast period 2022-2029
Report Coverage Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered Packaging Technology, End-user, Region
Regional Scope North America; Europe; Asia Pacific; Latin America; Rest of the World
Customization Scope Free report customization (equivalent up to 8 analyst’s working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Packaging Technology:
3D wafer-level chip-scale packaging (WLCSP),
3D TSV

By End-user:
Consumer Electronics,
Aerospace and Defense,
Medical Devices,
Communications and Telecom,
Automotive

By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World

*** レポート目次（コンテンツ）***

Chapter 1. Executive Summary
1.1. Market Snapshot
1.2. Global & Segmental Market Estimates & Forecasts, 2019-2029 (USD Billion)
1.2.1. 3D IC Packaging Market, by Region, 2019-2029 (USD Billion)
1.2.2. 3D IC Packaging Market, by Packaging Technology, 2019-2029 (USD Billion)
1.2.3. 3D IC Packaging Market, by End-User, 2019-2029 (USD Billion)
1.3. Key Trends
1.4. Estimation Methodology
1.5. Research Assumption
Chapter 2. Global 3D IC Packaging Market Definition and Scope
2.1. Objective of the Study
2.2. Market Definition & Scope
2.2.1. Scope of the Study
2.2.2. Industry Evolution
2.3. Years Considered for the Study
2.4. Currency Conversion Rates
Chapter 3. Global 3D IC Packaging Market Dynamics
3.1. 3D IC Packaging Market Impact Analysis (2019-2029)
3.1.1. Market Drivers
3.1.1.1. Rising demand for electronic products
3.1.1.2. Miniaturization of Electronic Devices
3.1.2. Market Challenges
3.1.2.1. Higher initial investment cost
3.1.3. Market Opportunities
3.1.3.1. Rising adoption of high-end computing servers and data centres
3.1.3.2. Strategic Initiatives by key-players
Chapter 4. Global 3D IC Packaging Market Industry Analysis
4.1. Porter’s 5 Force Model
4.1.1. Bargaining Power of Suppliers
4.1.2. Bargaining Power of Buyers
4.1.3. Threat of New Entrants
4.1.4. Threat of Substitutes
4.1.5. Competitive Rivalry
4.2. Futuristic Approach to Porter’s 5 Force Model (2019-2029)
4.3. PEST Analysis
4.3.1. Political
4.3.2. Economical
4.3.3. Social
4.3.4. Technological
4.4. Investment Adoption Model
4.5. Analyst Recommendation & Conclusion
4.6. Top investment opportunity
4.7. Top winning strategies
Chapter 5. Risk Assessment: COVID-19 Impact
5.1. Assessment of the overall impact of COVID-19 on the industry
5.2. Pre COVID-19 and post COVID-19 Market scenario
Chapter 6. Global 3D IC Packaging Market, by Packaging Technology
6.1. Market Snapshot
6.2. Global 3D IC Packaging Market by Packaging Technology Performance – Potential Analysis
6.3. Global 3D IC Packaging Market Estimates & Forecasts by Packaging Technology 2019-2029 (USD Billion)
6.4. 3D IC Packaging Market, Sub Segment Analysis
6.4.1. 3D wafer-level chip-scale packaging (WLCSP),
6.4.2. 3D TSV
Chapter 7. Global 3D IC Packaging Market, by End-User
7.1. Market Snapshot
7.2. Global 3D IC Packaging Market by End-User, Performance – Potential Analysis
7.3. Global 3D IC Packaging Market Estimates & Forecasts by End-User 2019-2029 (USD Billion)
7.4. 3D IC Packaging Market, Sub Segment Analysis
7.4.1. Consumer Electronics,
7.4.2. Aerospace and Defense,
7.4.3. Medical Devices,
7.4.4. Communications and Telecom,
7.4.5. Automotive
Chapter 8. Global 3D IC Packaging Market, Regional Analysis
8.1. 3D IC Packaging Market, Regional Market Snapshot
8.2. North America 3D IC Packaging Market
8.2.1. U.S. 3D IC Packaging Market
8.2.1.1. Packaging Technology breakdown estimates & forecasts, 2019-2029
8.2.1.2. End-User breakdown estimates & forecasts, 2019-2029
8.2.2. Canada 3D IC Packaging Market
8.3. Europe 3D IC Packaging Market Snapshot
8.3.1. U.K. 3D IC Packaging Market
8.3.2. Germany 3D IC Packaging Market
8.3.3. France 3D IC Packaging Market
8.3.4. Spain 3D IC Packaging Market
8.3.5. Italy 3D IC Packaging Market
8.3.6. Rest of Europe 3D IC Packaging Market
8.4. Asia-Pacific 3D IC Packaging Market Snapshot
8.4.1. China 3D IC Packaging Market
8.4.2. India 3D IC Packaging Market
8.4.3. Japan 3D IC Packaging Market
8.4.4. Australia 3D IC Packaging Market
8.4.5. South Korea 3D IC Packaging Market
8.4.6. Rest of Asia Pacific 3D IC Packaging Market
8.5. Latin America 3D IC Packaging Market Snapshot
8.5.1. Brazil 3D IC Packaging Market
8.5.2. Mexico 3D IC Packaging Market
8.6. Rest of The World 3D IC Packaging Market

Chapter 9. Competitive Intelligence
9.1. Top Market Strategies
9.2. Company Profiles
9.2.1. Taiwan Semiconductor Manufacturing Company Limited
9.2.1.1. Key Information
9.2.1.2. Overview
9.2.1.3. Financial (Subject to Data Availability)
9.2.1.4. Product Summary
9.2.1.5. Recent Developments
9.2.2. Samsung Electronics Co., Ltd.
9.2.3. ASE Group
9.2.4. Amkor Technology
9.2.5. Intel Corporation
9.2.6. Siliconware Precision Industries Co. Ltd (SPIL)
9.2.7. GlobalFoundries
9.2.8. Invensas
9.2.9. Powertech Technology Inc.
9.2.10. Micron technology ,Inc
Chapter 10. Research Process
10.1. Research Process
10.1.1. Data Mining
10.1.2. Analysis
10.1.3. Market Estimation
10.1.4. Validation
10.1.5. Publishing
10.2. Research Attributes
10.3. Research Assumption

List of Tables
TABLE 1. Global 3D IC Packaging Market, report scope
TABLE 2. Global 3D IC Packaging Market estimates & forecasts by Region 2019-2029 (USD Billion)
TABLE 3. Global 3D IC Packaging Market estimates & forecasts by Packaging Technology 2019-2029 (USD Billion)
TABLE 4. Global 3D IC Packaging Market estimates & forecasts by End-User 2019-2029 (USD Billion)
TABLE 5. Global 3D IC Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
TABLE 6. Global 3D IC Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
TABLE 7. Global 3D IC Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
TABLE 8. Global 3D IC Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
TABLE 9. Global 3D IC Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
TABLE 10. Global 3D IC Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
TABLE 11. Global 3D IC Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
TABLE 12. Global 3D IC Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
TABLE 13. Global 3D IC Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
TABLE 14. Global 3D IC Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
TABLE 15. U.S. 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 16. U.S. 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 17. U.S. 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 18. Canada 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 19. Canada 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 20. Canada 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 21. UK 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 22. UK 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 23. UK 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 24. Germany 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 25. Germany 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 26. Germany 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 27. France 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 28. France 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 29. France 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 30. Italy 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 31. Italy 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 32. Italy 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 33. Spain 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 34. Spain 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 35. Spain 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 36. RoE 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 37. RoE 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 38. RoE 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 39. China 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 40. China 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 41. China 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 42. India 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 43. India 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 44. India 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 45. Japan 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 46. Japan 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 47. Japan 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 48. South Korea 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 49. South Korea 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 50. South Korea 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 51. Australia 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 52. Australia 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 53. Australia 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 54. RoAPAC 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 55. RoAPAC 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 56. RoAPAC 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 57. Brazil 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 58. Brazil 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 59. Brazil 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 60. Mexico 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 61. Mexico 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 62. Mexico 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 63. RoLA 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 64. RoLA 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 65. RoLA 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 66. Row 3D IC Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
TABLE 67. Row 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 68. Row 3D IC Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
TABLE 69. List of secondary sources, used in the study of global 3D IC Packaging Market
TABLE 70. List of primary sources, used in the study of global 3D IC Packaging Market
TABLE 71. Years considered for the study
TABLE 72. Exchange rates considered
List of tables and figures and dummy in nature, final lists may vary in the final deliverable


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