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IC基板用銅電解メッキの世界市場2023年：酸メッキ、アルカリメッキ

■ 英語タイトル：Global Copper Electroplating for IC Substrates Market Research Report 2023

調査会社QYResearch社が発行したリサーチレポート（データ管理コード：QYR23MA3494）■ 発行会社/調査会社：QYResearch
■ 商品コード：QYR23MA3494
■ 発行日：2023年3月
■ 調査対象地域：グローバル
■ 産業分野：電子＆半導体
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■ レポート言語：英語
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*** レポート概要（サマリー）***

当調査資料はIC基板用銅電解メッキのグローバル市場について調査・分析し、世界のIC基板用銅電解メッキ市場概要、メーカー別競争状況、地域別生産量、地域別消費量、タイプ別セグメント分析（酸メッキ、アルカリメッキ）、用途別セグメント分析（半導体包装、PCB、その他）、主要企業のプロファイル、市場動向などに関する情報を掲載しています。主要企業としては、Heraeus、Tanaka、Sumitomo Metal Mining、MK Electron、AMETEK、MacDermid Enthone、Doublink Solders、Yantai Zhaojin Kanfort、Tatsuta Electric Wire & Cable、Kangqiang Electronics、The Prince & Izant、Guangzhou Sanfu New Material Technology、Shanghai Yongsheng Auxiliary Factory、Atotech、Jiangsu Mengde New Material Technologyなどが含まれています。IC基板用銅電解メッキのグローバル市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間中の年平均成長率はXXX％です。新型コロナとロシア・ウクライナ戦争による影響は、IC基板用銅電解メッキ市場規模を算出する際に考慮しました。

・IC基板用銅電解メッキ市場の概要
- 製品の定義
- IC基板用銅電解メッキの種類別セグメント
- 世界のIC基板用銅電解メッキ市場成長率のタイプ別分析（酸メッキ、アルカリメッキ）
- IC基板用銅電解メッキの用途別セグメント
- 世界のIC基板用銅電解メッキ市場成長率の用途別分析（半導体包装、PCB、その他）
- 世界市場の成長展望
- 世界のIC基板用銅電解メッキ生産量の推定と予測（2018年-2029年）
- 世界のIC基板用銅電解メッキ生産能力の推定と予測（2018年-2029年）
- IC基板用銅電解メッキの平均価格の推定と予測（2018年-2029年）
- 前提条件と制限事項

・メーカー別競争状況
- メーカー別市場シェア
- 世界の主要メーカー、業界ランキング分析
- メーカー別平均価格
- IC基板用銅電解メッキ市場の競争状況およびトレンド

・IC基板用銅電解メッキの地域別生産量
- IC基板用銅電解メッキ生産量の地域別推計と予測（2018年-2029年）
- 地域別IC基板用銅電解メッキ価格分析（2018年-2023年）
- 北米のIC基板用銅電解メッキ生産規模（2018年-2029年）
- ヨーロッパのIC基板用銅電解メッキ生産規模（2018年-2029年）
- 中国のIC基板用銅電解メッキ生産規模（2018年-2029年）
- 日本のIC基板用銅電解メッキ生産規模（2018年-2029年）
- 韓国のIC基板用銅電解メッキ生産規模（2018年-2029年）
- インドのIC基板用銅電解メッキ生産規模（2018年-2029年）

・IC基板用銅電解メッキの地域別消費量
- IC基板用銅電解メッキ消費量の地域別推計と予測（2018年-2029年）
- 北米のIC基板用銅電解メッキ消費量（2018年-2029年）
- 米国のIC基板用銅電解メッキ消費量（2018年-2029年）
- ヨーロッパのIC基板用銅電解メッキ消費量（2018年-2029年）
- アジア太平洋のIC基板用銅電解メッキ消費量（2018年-2029年）
- 中国のIC基板用銅電解メッキ消費量（2018年-2029年）
- 日本のIC基板用銅電解メッキ消費量（2018年-2029年）
- 韓国のIC基板用銅電解メッキ消費量（2018年-2029年）
- 東南アジアのIC基板用銅電解メッキ消費量（2018年-2029年）
- インドのIC基板用銅電解メッキ消費量（2018年-2029年）
- 中南米・中東・アフリカのIC基板用銅電解メッキ消費量（2018年-2029年）

・種類別セグメント：酸メッキ、アルカリメッキ
- 世界のIC基板用銅電解メッキのタイプ別生産量（2018年-2023年）
- 世界のIC基板用銅電解メッキのタイプ別生産量（2024年-2029年）
- 世界のIC基板用銅電解メッキのタイプ別価格

・用途別セグメント：半導体包装、PCB、その他
- 世界のIC基板用銅電解メッキの用途別生産量（2018年-2023年）
- 世界のIC基板用銅電解メッキの用途別生産量（2024年-2029年）
- 世界のIC基板用銅電解メッキの用途別価格

・主要企業のプロファイル：企業情報、製品ポートフォリオ、生産量、価格、動向
Heraeus、Tanaka、Sumitomo Metal Mining、MK Electron、AMETEK、MacDermid Enthone、Doublink Solders、Yantai Zhaojin Kanfort、Tatsuta Electric Wire & Cable、Kangqiang Electronics、The Prince & Izant、Guangzhou Sanfu New Material Technology、Shanghai Yongsheng Auxiliary Factory、Atotech、Jiangsu Mengde New Material Technology

・産業チェーンと販売チャネルの分析
- IC基板用銅電解メッキ産業チェーン分析
- IC基板用銅電解メッキの主要原材料
- IC基板用銅電解メッキの販売チャネル
- IC基板用銅電解メッキのディストリビューター
- IC基板用銅電解メッキの主要顧客

・IC基板用銅電解メッキ市場ダイナミクス
- IC基板用銅電解メッキの業界動向
- IC基板用銅電解メッキ市場の成長ドライバ、課題、阻害要因

・調査の結論

・調査手法と情報源

The global Copper Electroplating for IC Substrates market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Copper Electroplating for IC Substrates is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Copper Electroplating for IC Substrates is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Copper Electroplating for IC Substrates include Heraeus, Tanaka, Sumitomo Metal Mining, MK Electron, AMETEK, MacDermid Enthone, Doublink Solders, Yantai Zhaojin Kanfort and Tatsuta Electric Wire & Cable, etc. In 2022, the world’s top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Copper Electroplating for IC Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Copper Electroplating for IC Substrates.
The Copper Electroplating for IC Substrates market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Copper Electroplating for IC Substrates market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Copper Electroplating for IC Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Heraeus
Tanaka
Sumitomo Metal Mining
MK Electron
AMETEK
MacDermid Enthone
Doublink Solders
Yantai Zhaojin Kanfort
Tatsuta Electric Wire & Cable
Kangqiang Electronics
The Prince & Izant
Guangzhou Sanfu New Material Technology
Shanghai Yongsheng Auxiliary Factory
Atotech
Jiangsu Mengde New Material Technology
Segment by Type
Acid Plating
Alkaline Plating
Segment by Application
Semiconductor Packaging
PCB
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Copper Electroplating for IC Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Copper Electroplating for IC Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Copper Electroplating for IC Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

*** レポート目次（コンテンツ）***

1 Copper Electroplating for IC Substrates Market Overview
1.1 Product Definition
1.2 Copper Electroplating for IC Substrates Segment by Type
1.2.1 Global Copper Electroplating for IC Substrates Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Acid Plating
1.2.3 Alkaline Plating
1.3 Copper Electroplating for IC Substrates Segment by Application
1.3.1 Global Copper Electroplating for IC Substrates Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Semiconductor Packaging
1.3.3 PCB
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Copper Electroplating for IC Substrates Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Copper Electroplating for IC Substrates Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Copper Electroplating for IC Substrates Production Estimates and Forecasts (2018-2029)
1.4.4 Global Copper Electroplating for IC Substrates Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Copper Electroplating for IC Substrates Production Market Share by Manufacturers (2018-2023)
2.2 Global Copper Electroplating for IC Substrates Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Copper Electroplating for IC Substrates, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Copper Electroplating for IC Substrates Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Copper Electroplating for IC Substrates Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Copper Electroplating for IC Substrates, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Copper Electroplating for IC Substrates, Product Offered and Application
2.8 Global Key Manufacturers of Copper Electroplating for IC Substrates, Date of Enter into This Industry
2.9 Copper Electroplating for IC Substrates Market Competitive Situation and Trends
2.9.1 Copper Electroplating for IC Substrates Market Concentration Rate
2.9.2 Global 5 and 10 Largest Copper Electroplating for IC Substrates Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Copper Electroplating for IC Substrates Production by Region
3.1 Global Copper Electroplating for IC Substrates Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Copper Electroplating for IC Substrates Production Value by Region (2018-2029)
3.2.1 Global Copper Electroplating for IC Substrates Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Copper Electroplating for IC Substrates by Region (2024-2029)
3.3 Global Copper Electroplating for IC Substrates Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Copper Electroplating for IC Substrates Production by Region (2018-2029)
3.4.1 Global Copper Electroplating for IC Substrates Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Copper Electroplating for IC Substrates by Region (2024-2029)
3.5 Global Copper Electroplating for IC Substrates Market Price Analysis by Region (2018-2023)
3.6 Global Copper Electroplating for IC Substrates Production and Value, Year-over-Year Growth
3.6.1 North America Copper Electroplating for IC Substrates Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Copper Electroplating for IC Substrates Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Copper Electroplating for IC Substrates Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Copper Electroplating for IC Substrates Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Copper Electroplating for IC Substrates Production Value Estimates and Forecasts (2018-2029)
4 Copper Electroplating for IC Substrates Consumption by Region
4.1 Global Copper Electroplating for IC Substrates Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Copper Electroplating for IC Substrates Consumption by Region (2018-2029)
4.2.1 Global Copper Electroplating for IC Substrates Consumption by Region (2018-2023)
4.2.2 Global Copper Electroplating for IC Substrates Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Copper Electroplating for IC Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Copper Electroplating for IC Substrates Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Copper Electroplating for IC Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Copper Electroplating for IC Substrates Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Copper Electroplating for IC Substrates Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Copper Electroplating for IC Substrates Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Copper Electroplating for IC Substrates Production by Type (2018-2029)
5.1.1 Global Copper Electroplating for IC Substrates Production by Type (2018-2023)
5.1.2 Global Copper Electroplating for IC Substrates Production by Type (2024-2029)
5.1.3 Global Copper Electroplating for IC Substrates Production Market Share by Type (2018-2029)
5.2 Global Copper Electroplating for IC Substrates Production Value by Type (2018-2029)
5.2.1 Global Copper Electroplating for IC Substrates Production Value by Type (2018-2023)
5.2.2 Global Copper Electroplating for IC Substrates Production Value by Type (2024-2029)
5.2.3 Global Copper Electroplating for IC Substrates Production Value Market Share by Type (2018-2029)
5.3 Global Copper Electroplating for IC Substrates Price by Type (2018-2029)
6 Segment by Application
6.1 Global Copper Electroplating for IC Substrates Production by Application (2018-2029)
6.1.1 Global Copper Electroplating for IC Substrates Production by Application (2018-2023)
6.1.2 Global Copper Electroplating for IC Substrates Production by Application (2024-2029)
6.1.3 Global Copper Electroplating for IC Substrates Production Market Share by Application (2018-2029)
6.2 Global Copper Electroplating for IC Substrates Production Value by Application (2018-2029)
6.2.1 Global Copper Electroplating for IC Substrates Production Value by Application (2018-2023)
6.2.2 Global Copper Electroplating for IC Substrates Production Value by Application (2024-2029)
6.2.3 Global Copper Electroplating for IC Substrates Production Value Market Share by Application (2018-2029)
6.3 Global Copper Electroplating for IC Substrates Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Heraeus
7.1.1 Heraeus Copper Electroplating for IC Substrates Corporation Information
7.1.2 Heraeus Copper Electroplating for IC Substrates Product Portfolio
7.1.3 Heraeus Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Heraeus Main Business and Markets Served
7.1.5 Heraeus Recent Developments/Updates
7.2 Tanaka
7.2.1 Tanaka Copper Electroplating for IC Substrates Corporation Information
7.2.2 Tanaka Copper Electroplating for IC Substrates Product Portfolio
7.2.3 Tanaka Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Tanaka Main Business and Markets Served
7.2.5 Tanaka Recent Developments/Updates
7.3 Sumitomo Metal Mining
7.3.1 Sumitomo Metal Mining Copper Electroplating for IC Substrates Corporation Information
7.3.2 Sumitomo Metal Mining Copper Electroplating for IC Substrates Product Portfolio
7.3.3 Sumitomo Metal Mining Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Sumitomo Metal Mining Main Business and Markets Served
7.3.5 Sumitomo Metal Mining Recent Developments/Updates
7.4 MK Electron
7.4.1 MK Electron Copper Electroplating for IC Substrates Corporation Information
7.4.2 MK Electron Copper Electroplating for IC Substrates Product Portfolio
7.4.3 MK Electron Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.4.4 MK Electron Main Business and Markets Served
7.4.5 MK Electron Recent Developments/Updates
7.5 AMETEK
7.5.1 AMETEK Copper Electroplating for IC Substrates Corporation Information
7.5.2 AMETEK Copper Electroplating for IC Substrates Product Portfolio
7.5.3 AMETEK Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.5.4 AMETEK Main Business and Markets Served
7.5.5 AMETEK Recent Developments/Updates
7.6 MacDermid Enthone
7.6.1 MacDermid Enthone Copper Electroplating for IC Substrates Corporation Information
7.6.2 MacDermid Enthone Copper Electroplating for IC Substrates Product Portfolio
7.6.3 MacDermid Enthone Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.6.4 MacDermid Enthone Main Business and Markets Served
7.6.5 MacDermid Enthone Recent Developments/Updates
7.7 Doublink Solders
7.7.1 Doublink Solders Copper Electroplating for IC Substrates Corporation Information
7.7.2 Doublink Solders Copper Electroplating for IC Substrates Product Portfolio
7.7.3 Doublink Solders Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Doublink Solders Main Business and Markets Served
7.7.5 Doublink Solders Recent Developments/Updates
7.8 Yantai Zhaojin Kanfort
7.8.1 Yantai Zhaojin Kanfort Copper Electroplating for IC Substrates Corporation Information
7.8.2 Yantai Zhaojin Kanfort Copper Electroplating for IC Substrates Product Portfolio
7.8.3 Yantai Zhaojin Kanfort Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Yantai Zhaojin Kanfort Main Business and Markets Served
7.7.5 Yantai Zhaojin Kanfort Recent Developments/Updates
7.9 Tatsuta Electric Wire & Cable
7.9.1 Tatsuta Electric Wire & Cable Copper Electroplating for IC Substrates Corporation Information
7.9.2 Tatsuta Electric Wire & Cable Copper Electroplating for IC Substrates Product Portfolio
7.9.3 Tatsuta Electric Wire & Cable Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Tatsuta Electric Wire & Cable Main Business and Markets Served
7.9.5 Tatsuta Electric Wire & Cable Recent Developments/Updates
7.10 Kangqiang Electronics
7.10.1 Kangqiang Electronics Copper Electroplating for IC Substrates Corporation Information
7.10.2 Kangqiang Electronics Copper Electroplating for IC Substrates Product Portfolio
7.10.3 Kangqiang Electronics Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Kangqiang Electronics Main Business and Markets Served
7.10.5 Kangqiang Electronics Recent Developments/Updates
7.11 The Prince & Izant
7.11.1 The Prince & Izant Copper Electroplating for IC Substrates Corporation Information
7.11.2 The Prince & Izant Copper Electroplating for IC Substrates Product Portfolio
7.11.3 The Prince & Izant Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.11.4 The Prince & Izant Main Business and Markets Served
7.11.5 The Prince & Izant Recent Developments/Updates
7.12 Guangzhou Sanfu New Material Technology
7.12.1 Guangzhou Sanfu New Material Technology Copper Electroplating for IC Substrates Corporation Information
7.12.2 Guangzhou Sanfu New Material Technology Copper Electroplating for IC Substrates Product Portfolio
7.12.3 Guangzhou Sanfu New Material Technology Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Guangzhou Sanfu New Material Technology Main Business and Markets Served
7.12.5 Guangzhou Sanfu New Material Technology Recent Developments/Updates
7.13 Shanghai Yongsheng Auxiliary Factory
7.13.1 Shanghai Yongsheng Auxiliary Factory Copper Electroplating for IC Substrates Corporation Information
7.13.2 Shanghai Yongsheng Auxiliary Factory Copper Electroplating for IC Substrates Product Portfolio
7.13.3 Shanghai Yongsheng Auxiliary Factory Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Shanghai Yongsheng Auxiliary Factory Main Business and Markets Served
7.13.5 Shanghai Yongsheng Auxiliary Factory Recent Developments/Updates
7.14 Atotech
7.14.1 Atotech Copper Electroplating for IC Substrates Corporation Information
7.14.2 Atotech Copper Electroplating for IC Substrates Product Portfolio
7.14.3 Atotech Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Atotech Main Business and Markets Served
7.14.5 Atotech Recent Developments/Updates
7.15 Jiangsu Mengde New Material Technology
7.15.1 Jiangsu Mengde New Material Technology Copper Electroplating for IC Substrates Corporation Information
7.15.2 Jiangsu Mengde New Material Technology Copper Electroplating for IC Substrates Product Portfolio
7.15.3 Jiangsu Mengde New Material Technology Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Jiangsu Mengde New Material Technology Main Business and Markets Served
7.15.5 Jiangsu Mengde New Material Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Copper Electroplating for IC Substrates Industry Chain Analysis
8.2 Copper Electroplating for IC Substrates Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Copper Electroplating for IC Substrates Production Mode & Process
8.4 Copper Electroplating for IC Substrates Sales and Marketing
8.4.1 Copper Electroplating for IC Substrates Sales Channels
8.4.2 Copper Electroplating for IC Substrates Distributors
8.5 Copper Electroplating for IC Substrates Customers
9 Copper Electroplating for IC Substrates Market Dynamics
9.1 Copper Electroplating for IC Substrates Industry Trends
9.2 Copper Electroplating for IC Substrates Market Drivers
9.3 Copper Electroplating for IC Substrates Market Challenges
9.4 Copper Electroplating for IC Substrates Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

List of Tables
Table 1. Global Copper Electroplating for IC Substrates Market Value by Type, (US$ Million) & (2022 VS 2029)
Table 2. Global Copper Electroplating for IC Substrates Market Value by Application, (US$ Million) & (2022 VS 2029)
Table 3. Global Copper Electroplating for IC Substrates Production Capacity (K Units) by Manufacturers in 2022
Table 4. Global Copper Electroplating for IC Substrates Production by Manufacturers (2018-2023) & (K Units)
Table 5. Global Copper Electroplating for IC Substrates Production Market Share by Manufacturers (2018-2023)
Table 6. Global Copper Electroplating for IC Substrates Production Value by Manufacturers (2018-2023) & (US$ Million)
Table 7. Global Copper Electroplating for IC Substrates Production Value Share by Manufacturers (2018-2023)
Table 8. Global Copper Electroplating for IC Substrates Industry Ranking 2021 VS 2022 VS 2023
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Copper Electroplating for IC Substrates as of 2022)
Table 10. Global Market Copper Electroplating for IC Substrates Average Price by Manufacturers (US$/Unit) & (2018-2023)
Table 11. Manufacturers Copper Electroplating for IC Substrates Production Sites and Area Served
Table 12. Manufacturers Copper Electroplating for IC Substrates Product Types
Table 13. Global Copper Electroplating for IC Substrates Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global Copper Electroplating for IC Substrates Production Value by Region: 2018 VS 2022 VS 2029 (US$ Million)
Table 16. Global Copper Electroplating for IC Substrates Production Value (US$ Million) by Region (2018-2023)
Table 17. Global Copper Electroplating for IC Substrates Production Value Market Share by Region (2018-2023)
Table 18. Global Copper Electroplating for IC Substrates Production Value (US$ Million) Forecast by Region (2024-2029)
Table 19. Global Copper Electroplating for IC Substrates Production Value Market Share Forecast by Region (2024-2029)
Table 20. Global Copper Electroplating for IC Substrates Production Comparison by Region: 2018 VS 2022 VS 2029 (K Units)
Table 21. Global Copper Electroplating for IC Substrates Production (K Units) by Region (2018-2023)
Table 22. Global Copper Electroplating for IC Substrates Production Market Share by Region (2018-2023)
Table 23. Global Copper Electroplating for IC Substrates Production (K Units) Forecast by Region (2024-2029)
Table 24. Global Copper Electroplating for IC Substrates Production Market Share Forecast by Region (2024-2029)
Table 25. Global Copper Electroplating for IC Substrates Market Average Price (US$/Unit) by Region (2018-2023)
Table 26. Global Copper Electroplating for IC Substrates Market Average Price (US$/Unit) by Region (2024-2029)
Table 27. Global Copper Electroplating for IC Substrates Consumption Growth Rate by Region: 2018 VS 2022 VS 2029 (K Units)
Table 28. Global Copper Electroplating for IC Substrates Consumption by Region (2018-2023) & (K Units)
Table 29. Global Copper Electroplating for IC Substrates Consumption Market Share by Region (2018-2023)
Table 30. Global Copper Electroplating for IC Substrates Forecasted Consumption by Region (2024-2029) & (K Units)
Table 31. Global Copper Electroplating for IC Substrates Forecasted Consumption Market Share by Region (2018-2023)
Table 32. North America Copper Electroplating for IC Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
Table 33. North America Copper Electroplating for IC Substrates Consumption by Country (2018-2023) & (K Units)
Table 34. North America Copper Electroplating for IC Substrates Consumption by Country (2024-2029) & (K Units)
Table 35. Europe Copper Electroplating for IC Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
Table 36. Europe Copper Electroplating for IC Substrates Consumption by Country (2018-2023) & (K Units)
Table 37. Europe Copper Electroplating for IC Substrates Consumption by Country (2024-2029) & (K Units)
Table 38. Asia Pacific Copper Electroplating for IC Substrates Consumption Growth Rate by Region: 2018 VS 2022 VS 2029 (K Units)
Table 39. Asia Pacific Copper Electroplating for IC Substrates Consumption by Region (2018-2023) & (K Units)
Table 40. Asia Pacific Copper Electroplating for IC Substrates Consumption by Region (2024-2029) & (K Units)
Table 41. Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
Table 42. Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption by Country (2018-2023) & (K Units)
Table 43. Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption by Country (2024-2029) & (K Units)
Table 44. Global Copper Electroplating for IC Substrates Production (K Units) by Type (2018-2023)
Table 45. Global Copper Electroplating for IC Substrates Production (K Units) by Type (2024-2029)
Table 46. Global Copper Electroplating for IC Substrates Production Market Share by Type (2018-2023)
Table 47. Global Copper Electroplating for IC Substrates Production Market Share by Type (2024-2029)
Table 48. Global Copper Electroplating for IC Substrates Production Value (US$ Million) by Type (2018-2023)
Table 49. Global Copper Electroplating for IC Substrates Production Value (US$ Million) by Type (2024-2029)
Table 50. Global Copper Electroplating for IC Substrates Production Value Share by Type (2018-2023)
Table 51. Global Copper Electroplating for IC Substrates Production Value Share by Type (2024-2029)
Table 52. Global Copper Electroplating for IC Substrates Price (US$/Unit) by Type (2018-2023)
Table 53. Global Copper Electroplating for IC Substrates Price (US$/Unit) by Type (2024-2029)
Table 54. Global Copper Electroplating for IC Substrates Production (K Units) by Application (2018-2023)
Table 55. Global Copper Electroplating for IC Substrates Production (K Units) by Application (2024-2029)
Table 56. Global Copper Electroplating for IC Substrates Production Market Share by Application (2018-2023)
Table 57. Global Copper Electroplating for IC Substrates Production Market Share by Application (2024-2029)
Table 58. Global Copper Electroplating for IC Substrates Production Value (US$ Million) by Application (2018-2023)
Table 59. Global Copper Electroplating for IC Substrates Production Value (US$ Million) by Application (2024-2029)
Table 60. Global Copper Electroplating for IC Substrates Production Value Share by Application (2018-2023)
Table 61. Global Copper Electroplating for IC Substrates Production Value Share by Application (2024-2029)
Table 62. Global Copper Electroplating for IC Substrates Price (US$/Unit) by Application (2018-2023)
Table 63. Global Copper Electroplating for IC Substrates Price (US$/Unit) by Application (2024-2029)
Table 64. Heraeus Copper Electroplating for IC Substrates Corporation Information
Table 65. Heraeus Specification and Application
Table 66. Heraeus Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 67. Heraeus Main Business and Markets Served
Table 68. Heraeus Recent Developments/Updates
Table 69. Tanaka Copper Electroplating for IC Substrates Corporation Information
Table 70. Tanaka Specification and Application
Table 71. Tanaka Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 72. Tanaka Main Business and Markets Served
Table 73. Tanaka Recent Developments/Updates
Table 74. Sumitomo Metal Mining Copper Electroplating for IC Substrates Corporation Information
Table 75. Sumitomo Metal Mining Specification and Application
Table 76. Sumitomo Metal Mining Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 77. Sumitomo Metal Mining Main Business and Markets Served
Table 78. Sumitomo Metal Mining Recent Developments/Updates
Table 79. MK Electron Copper Electroplating for IC Substrates Corporation Information
Table 80. MK Electron Specification and Application
Table 81. MK Electron Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 82. MK Electron Main Business and Markets Served
Table 83. MK Electron Recent Developments/Updates
Table 84. AMETEK Copper Electroplating for IC Substrates Corporation Information
Table 85. AMETEK Specification and Application
Table 86. AMETEK Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 87. AMETEK Main Business and Markets Served
Table 88. AMETEK Recent Developments/Updates
Table 89. MacDermid Enthone Copper Electroplating for IC Substrates Corporation Information
Table 90. MacDermid Enthone Specification and Application
Table 91. MacDermid Enthone Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 92. MacDermid Enthone Main Business and Markets Served
Table 93. MacDermid Enthone Recent Developments/Updates
Table 94. Doublink Solders Copper Electroplating for IC Substrates Corporation Information
Table 95. Doublink Solders Specification and Application
Table 96. Doublink Solders Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 97. Doublink Solders Main Business and Markets Served
Table 98. Doublink Solders Recent Developments/Updates
Table 99. Yantai Zhaojin Kanfort Copper Electroplating for IC Substrates Corporation Information
Table 100. Yantai Zhaojin Kanfort Specification and Application
Table 101. Yantai Zhaojin Kanfort Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 102. Yantai Zhaojin Kanfort Main Business and Markets Served
Table 103. Yantai Zhaojin Kanfort Recent Developments/Updates
Table 104. Tatsuta Electric Wire & Cable Copper Electroplating for IC Substrates Corporation Information
Table 105. Tatsuta Electric Wire & Cable Specification and Application
Table 106. Tatsuta Electric Wire & Cable Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 107. Tatsuta Electric Wire & Cable Main Business and Markets Served
Table 108. Tatsuta Electric Wire & Cable Recent Developments/Updates
Table 109. Kangqiang Electronics Copper Electroplating for IC Substrates Corporation Information
Table 110. Kangqiang Electronics Specification and Application
Table 111. Kangqiang Electronics Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 112. Kangqiang Electronics Main Business and Markets Served
Table 113. Kangqiang Electronics Recent Developments/Updates
Table 114. The Prince & Izant Copper Electroplating for IC Substrates Corporation Information
Table 115. The Prince & Izant Specification and Application
Table 116. The Prince & Izant Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 117. The Prince & Izant Main Business and Markets Served
Table 118. The Prince & Izant Recent Developments/Updates
Table 119. Guangzhou Sanfu New Material Technology Copper Electroplating for IC Substrates Corporation Information
Table 120. Guangzhou Sanfu New Material Technology Specification and Application
Table 121. Guangzhou Sanfu New Material Technology Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 122. Guangzhou Sanfu New Material Technology Main Business and Markets Served
Table 123. Guangzhou Sanfu New Material Technology Recent Developments/Updates
Table 124. Shanghai Yongsheng Auxiliary Factory Copper Electroplating for IC Substrates Corporation Information
Table 125. Shanghai Yongsheng Auxiliary Factory Specification and Application
Table 126. Shanghai Yongsheng Auxiliary Factory Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 127. Shanghai Yongsheng Auxiliary Factory Main Business and Markets Served
Table 128. Shanghai Yongsheng Auxiliary Factory Recent Developments/Updates
Table 129. Atotech Copper Electroplating for IC Substrates Corporation Information
Table 130. Atotech Specification and Application
Table 131. Atotech Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 132. Atotech Main Business and Markets Served
Table 133. Atotech Recent Developments/Updates
Table 134. Atotech Copper Electroplating for IC Substrates Corporation Information
Table 135. Jiangsu Mengde New Material Technology Specification and Application
Table 136. Jiangsu Mengde New Material Technology Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 137. Jiangsu Mengde New Material Technology Main Business and Markets Served
Table 138. Jiangsu Mengde New Material Technology Recent Developments/Updates
Table 139. Key Raw Materials Lists
Table 140. Raw Materials Key Suppliers Lists
Table 141. Copper Electroplating for IC Substrates Distributors List
Table 142. Copper Electroplating for IC Substrates Customers List
Table 143. Copper Electroplating for IC Substrates Market Trends
Table 144. Copper Electroplating for IC Substrates Market Drivers
Table 145. Copper Electroplating for IC Substrates Market Challenges
Table 146. Copper Electroplating for IC Substrates Market Restraints
Table 147. Research Programs/Design for This Report
Table 148. Key Data Information from Secondary Sources
Table 149. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Copper Electroplating for IC Substrates
Figure 2. Global Copper Electroplating for IC Substrates Market Value by Type, (US$ Million) & (2022 VS 2029)
Figure 3. Global Copper Electroplating for IC Substrates Market Share by Type: 2022 VS 2029
Figure 4. Acid Plating Product Picture
Figure 5. Alkaline Plating Product Picture
Figure 6. Global Copper Electroplating for IC Substrates Market Value by Application, (US$ Million) & (2022 VS 2029)
Figure 7. Global Copper Electroplating for IC Substrates Market Share by Application: 2022 VS 2029
Figure 8. Semiconductor Packaging
Figure 9. PCB
Figure 10. Others
Figure 11. Global Copper Electroplating for IC Substrates Production Value (US$ Million), 2018 VS 2022 VS 2029
Figure 12. Global Copper Electroplating for IC Substrates Production Value (US$ Million) & (2018-2029)
Figure 13. Global Copper Electroplating for IC Substrates Production (K Units) & (2018-2029)
Figure 14. Global Copper Electroplating for IC Substrates Average Price (US$/Unit) & (2018-2029)
Figure 15. Copper Electroplating for IC Substrates Report Years Considered
Figure 16. Copper Electroplating for IC Substrates Production Share by Manufacturers in 2022
Figure 17. Copper Electroplating for IC Substrates Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2018 VS 2022
Figure 18. The Global 5 and 10 Largest Players: Market Share by Copper Electroplating for IC Substrates Revenue in 2022
Figure 19. Global Copper Electroplating for IC Substrates Production Value by Region: 2018 VS 2022 VS 2029 (US$ Million)
Figure 20. Global Copper Electroplating for IC Substrates Production Value Market Share by Region: 2018 VS 2022 VS 2029
Figure 21. Global Copper Electroplating for IC Substrates Production Comparison by Region: 2018 VS 2022 VS 2029 (K Units)
Figure 22. Global Copper Electroplating for IC Substrates Production Market Share by Region: 2018 VS 2022 VS 2029
Figure 23. North America Copper Electroplating for IC Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 24. Europe Copper Electroplating for IC Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 25. China Copper Electroplating for IC Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 26. Japan Copper Electroplating for IC Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 27. South Korea Copper Electroplating for IC Substrates Production Value (US$ Million) Growth Rate (2018-2029)
Figure 28. Global Copper Electroplating for IC Substrates Consumption by Region: 2018 VS 2022 VS 2029 (K Units)
Figure 29. Global Copper Electroplating for IC Substrates Consumption Market Share by Region: 2018 VS 2022 VS 2029
Figure 30. North America Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 31. North America Copper Electroplating for IC Substrates Consumption Market Share by Country (2018-2029)
Figure 32. Canada Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 33. U.S. Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 34. Europe Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 35. Europe Copper Electroplating for IC Substrates Consumption Market Share by Country (2018-2029)
Figure 36. Germany Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 37. France Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 38. U.K. Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 39. Italy Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 40. Russia Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 41. Asia Pacific Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 42. Asia Pacific Copper Electroplating for IC Substrates Consumption Market Share by Regions (2018-2029)
Figure 43. China Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 44. Japan Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 45. South Korea Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 46. China Taiwan Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 47. Southeast Asia Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 48. India Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 49. Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 50. Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption Market Share by Country (2018-2029)
Figure 51. Mexico Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 52. Brazil Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 53. Turkey Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 54. GCC Countries Copper Electroplating for IC Substrates Consumption and Growth Rate (2018-2023) & (K Units)
Figure 55. Global Production Market Share of Copper Electroplating for IC Substrates by Type (2018-2029)
Figure 56. Global Production Value Market Share of Copper Electroplating for IC Substrates by Type (2018-2029)
Figure 57. Global Copper Electroplating for IC Substrates Price (US$/Unit) by Type (2018-2029)
Figure 58. Global Production Market Share of Copper Electroplating for IC Substrates by Application (2018-2029)
Figure 59. Global Production Value Market Share of Copper Electroplating for IC Substrates by Application (2018-2029)
Figure 60. Global Copper Electroplating for IC Substrates Price (US$/Unit) by Application (2018-2029)
Figure 61. Copper Electroplating for IC Substrates Value Chain
Figure 62. Copper Electroplating for IC Substrates Production Process
Figure 63. Channels of Distribution (Direct Vs Distribution)
Figure 64. Distributors Profiles
Figure 65. Bottom-up and Top-down Approaches for This Report
Figure 66. Data Triangulation


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