カテゴリ： GlobalInfoResearch, 世界, IT/電子

世界のPC用半導体包装基板市場2022年：市場規模予測（～2028年）

■ 英語タイトル：Global Semiconductor Package Substrate for PC Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

調査会社GlobalInfoResearch社が発行したリサーチレポート（データ管理コード：GIR22MY4620）■ 発行会社/調査会社：GlobalInfoResearch
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■ 発行日：2022年5月（※2025年版があります。お問い合わせください。）
■ 調査対象地域：グローバル
■ 産業分野：電子＆半導体
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*** レポート概要（サマリー）***

PC用半導体包装基板市場レポートは、世界の市場規模、地域および国レベルの市場規模、セグメント市場の成長性、市場シェア、競争環境、販売分析、国内および世界の市場プレーヤーの影響、バリューチェーンの最適化、最近の動向、機会分析、市場成長の戦略的な分析、製品発売、地域市場の拡大などに関する情報を提供します。
GlobalInfoResearchの最新の調査によると、世界のPC用半導体包装基板の市場規模は2021年のxxx米ドルから2028年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。

PC用半導体包装基板市場は種類と用途によって区分されます。2017年～2028年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。

種類別セグメントは次をカバーします。
・FC-BGA、FC-CSP、WB BGA、WB CSP

用途別セグメントは次のように区分されます。
・企業用、個人用

世界のPC用半導体包装基板市場の主要な市場プレーヤーは以下のとおりです。
・Samsung Electro-Mechanics、ASE Group、Millennium Circuits、LG Chem、Simmtech、Kyocera、Daeduck Electronics、Shinko Electric、Ibiden、Unimicron、Nanya、Shenzhen Rayming Technology、HOREXS Group、Kinsus、TTM Technologies、Qinhuangdao Zhen Ding Technology、Shennan Circuits Company、Shenzhen Pastprint Technology、Zhuhai ACCESS Semiconductor

地域別セグメントは次の地域・国をカバーします。
・北米（米国、カナダ、メキシコ）
・ヨーロッパ（ドイツ、フランス、イギリス、ロシア、イタリア）
・アジア太平洋（日本、中国、韓国、インド、東南アジア、オーストラリア）
・南アメリカ（ブラジル、アルゼンチン、コロンビア）
・中東およびアフリカ（サウジアラビア、UAE、エジプト、南アフリカ）

本調査レポートの内容は計15章あります。
・第1章では、PC用半導体包装基板製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。
・第2章では、主要なPC用半導体包装基板メーカーの企業概要、2019年～2022年までのPC用半導体包装基板の価格、販売量、売上、市場シェアを掲載しています。
・第3章では、主要なPC用半導体包装基板メーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。
・第4章では、2017年～2028年までの地域別PC用半導体包装基板の販売量、売上、成長性を示しています。
・第5、6章では、2017年～2028年までのPC用半導体包装基板の種類別と用途別の市場規模、市場シェアと成長率を掲載しています。
・第7、8、9、10、11章では、2017年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2028年までの主要地域でのPC用半導体包装基板市場予測を収録しています。
・第12章では、主要な原材料、主要なサプライヤー、およびPC用半導体包装基板の産業チェーンを掲載しています。
・第13、14、15章では、PC用半導体包装基板の販売チャネル、販売業者、顧客、調査結果と結論、付録、データソースなどについて説明します。

***** 目次(一部) *****

・市場概要
・メーカー情報（企業概要、製品概要、販売量、価格、売上）：Samsung Electro-Mechanics、ASE Group、Millennium Circuits、LG Chem、Simmtech、Kyocera、Daeduck Electronics、Shinko Electric、Ibiden、Unimicron、Nanya、Shenzhen Rayming Technology、HOREXS Group、Kinsus、TTM Technologies、Qinhuangdao Zhen Ding Technology、Shennan Circuits Company、Shenzhen Pastprint Technology、Zhuhai ACCESS Semiconductor
・メーカー別市場シェア
・地域別市場分析2017年-2028年
・種類別分析2017年-2028年：FC-BGA、FC-CSP、WB BGA、WB CSP
・用途別分析2017年-2028年：企業用、個人用
・PC用半導体包装基板の北米市場規模2017年-2028年：アメリカ、カナダ、メキシコ
・PC用半導体包装基板のヨーロッパ市場規模2017年-2028年：ドイツ、イギリス、フランス、ロシア、イタリア
・PC用半導体包装基板のアジア市場規模2017年-2028年：中国、日本、韓国、インド、東南アジア、オーストラリア
・PC用半導体包装基板の南米市場規模2017年-2028年：ブラジル、アルゼンチン
・PC用半導体包装基板の中東・アフリカ市場規模2017年-2028年：サウジアラビア、トルコ、エジプト、南アフリカ
・原材料および産業チェーン
・販売チャネル、流通業者・代理店、顧客リスト
・調査の結果・結論

The Semiconductor Package Substrate for PC market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global Semiconductor Package Substrate for PC market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of USD million by 2028 with a CAGR of % during forecast period 2022-2028. Enterprises Use accounting for % of the Semiconductor Package Substrate for PC global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While FC-BGA segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of Semiconductor Package Substrate for PC include Samsung Electro-Mechanics, ASE Group, Millennium Circuits, LG Chem, and Simmtech, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
Semiconductor Package Substrate for PC market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
FC-BGA
FC-CSP
WB BGA
WB CSP
Market segment by Application can be divided into
Enterprises Use
Personals Use
The key market players for global Semiconductor Package Substrate for PC market are listed below:
Samsung Electro-Mechanics
ASE Group
Millennium Circuits
LG Chem
Simmtech
Kyocera
Daeduck Electronics
Shinko Electric
Ibiden
Unimicron
Nanya
Shenzhen Rayming Technology
HOREXS Group
Kinsus
TTM Technologies
Qinhuangdao Zhen Ding Technology
Shennan Circuits Company
Shenzhen Pastprint Technology
Zhuhai ACCESS Semiconductor
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor Package Substrate for PC product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Semiconductor Package Substrate for PC, with price, sales, revenue and global market share of Semiconductor Package Substrate for PC from 2019 to 2022.
Chapter 3, the Semiconductor Package Substrate for PC competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor Package Substrate for PC breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and Semiconductor Package Substrate for PC market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of Semiconductor Package Substrate for PC.
Chapter 13, 14, and 15, to describe Semiconductor Package Substrate for PC sales channel, distributors, customers, research findings and conclusion, appendix and data source.

*** レポート目次（コンテンツ）***

1 Market Overview
1.1 Semiconductor Package Substrate for PC Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Semiconductor Package Substrate for PC Revenue by Type: 2017 Versus 2021 Versus 2028
1.2.2 FC-BGA
1.2.3 FC-CSP
1.2.4 WB BGA
1.2.5 WB CSP
1.3 Market Analysis by Application
1.3.1 Overview: Global Semiconductor Package Substrate for PC Revenue by Application: 2017 Versus 2021 Versus 2028
1.3.2 Enterprises Use
1.3.3 Personals Use
1.4 Global Semiconductor Package Substrate for PC Market Size & Forecast
1.4.1 Global Semiconductor Package Substrate for PC Sales in Value (2017 & 2021 & 2028)
1.4.2 Global Semiconductor Package Substrate for PC Sales in Volume (2017-2028)
1.4.3 Global Semiconductor Package Substrate for PC Price (2017-2028)
1.5 Global Semiconductor Package Substrate for PC Production Capacity Analysis
1.5.1 Global Semiconductor Package Substrate for PC Total Production Capacity (2017-2028)
1.5.2 Global Semiconductor Package Substrate for PC Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 Semiconductor Package Substrate for PC Market Drivers
1.6.2 Semiconductor Package Substrate for PC Market Restraints
1.6.3 Semiconductor Package Substrate for PC Trends Analysis
2 Manufacturers Profiles
2.1 Samsung Electro-Mechanics
2.1.1 Samsung Electro-Mechanics Details
2.1.2 Samsung Electro-Mechanics Major Business
2.1.3 Samsung Electro-Mechanics Semiconductor Package Substrate for PC Product and Services
2.1.4 Samsung Electro-Mechanics Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.2 ASE Group
2.2.1 ASE Group Details
2.2.2 ASE Group Major Business
2.2.3 ASE Group Semiconductor Package Substrate for PC Product and Services
2.2.4 ASE Group Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.3 Millennium Circuits
2.3.1 Millennium Circuits Details
2.3.2 Millennium Circuits Major Business
2.3.3 Millennium Circuits Semiconductor Package Substrate for PC Product and Services
2.3.4 Millennium Circuits Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.4 LG Chem
2.4.1 LG Chem Details
2.4.2 LG Chem Major Business
2.4.3 LG Chem Semiconductor Package Substrate for PC Product and Services
2.4.4 LG Chem Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.5 Simmtech
2.5.1 Simmtech Details
2.5.2 Simmtech Major Business
2.5.3 Simmtech Semiconductor Package Substrate for PC Product and Services
2.5.4 Simmtech Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.6 Kyocera
2.6.1 Kyocera Details
2.6.2 Kyocera Major Business
2.6.3 Kyocera Semiconductor Package Substrate for PC Product and Services
2.6.4 Kyocera Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.7 Daeduck Electronics
2.7.1 Daeduck Electronics Details
2.7.2 Daeduck Electronics Major Business
2.7.3 Daeduck Electronics Semiconductor Package Substrate for PC Product and Services
2.7.4 Daeduck Electronics Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.8 Shinko Electric
2.8.1 Shinko Electric Details
2.8.2 Shinko Electric Major Business
2.8.3 Shinko Electric Semiconductor Package Substrate for PC Product and Services
2.8.4 Shinko Electric Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.9 Ibiden
2.9.1 Ibiden Details
2.9.2 Ibiden Major Business
2.9.3 Ibiden Semiconductor Package Substrate for PC Product and Services
2.9.4 Ibiden Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.10 Unimicron
2.10.1 Unimicron Details
2.10.2 Unimicron Major Business
2.10.3 Unimicron Semiconductor Package Substrate for PC Product and Services
2.10.4 Unimicron Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.11 Nanya
2.11.1 Nanya Details
2.11.2 Nanya Major Business
2.11.3 Nanya Semiconductor Package Substrate for PC Product and Services
2.11.4 Nanya Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.12 Shenzhen Rayming Technology
2.12.1 Shenzhen Rayming Technology Details
2.12.2 Shenzhen Rayming Technology Major Business
2.12.3 Shenzhen Rayming Technology Semiconductor Package Substrate for PC Product and Services
2.12.4 Shenzhen Rayming Technology Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.13 HOREXS Group
2.13.1 HOREXS Group Details
2.13.2 HOREXS Group Major Business
2.13.3 HOREXS Group Semiconductor Package Substrate for PC Product and Services
2.13.4 HOREXS Group Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.14 Kinsus
2.14.1 Kinsus Details
2.14.2 Kinsus Major Business
2.14.3 Kinsus Semiconductor Package Substrate for PC Product and Services
2.14.4 Kinsus Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.15 TTM Technologies
2.15.1 TTM Technologies Details
2.15.2 TTM Technologies Major Business
2.15.3 TTM Technologies Semiconductor Package Substrate for PC Product and Services
2.15.4 TTM Technologies Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.16 Qinhuangdao Zhen Ding Technology
2.16.1 Qinhuangdao Zhen Ding Technology Details
2.16.2 Qinhuangdao Zhen Ding Technology Major Business
2.16.3 Qinhuangdao Zhen Ding Technology Semiconductor Package Substrate for PC Product and Services
2.16.4 Qinhuangdao Zhen Ding Technology Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.17 Shennan Circuits Company
2.17.1 Shennan Circuits Company Details
2.17.2 Shennan Circuits Company Major Business
2.17.3 Shennan Circuits Company Semiconductor Package Substrate for PC Product and Services
2.17.4 Shennan Circuits Company Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.18 Shenzhen Pastprint Technology
2.18.1 Shenzhen Pastprint Technology Details
2.18.2 Shenzhen Pastprint Technology Major Business
2.18.3 Shenzhen Pastprint Technology Semiconductor Package Substrate for PC Product and Services
2.18.4 Shenzhen Pastprint Technology Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.19 Zhuhai ACCESS Semiconductor
2.19.1 Zhuhai ACCESS Semiconductor Details
2.19.2 Zhuhai ACCESS Semiconductor Major Business
2.19.3 Zhuhai ACCESS Semiconductor Semiconductor Package Substrate for PC Product and Services
2.19.4 Zhuhai ACCESS Semiconductor Semiconductor Package Substrate for PC Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 Semiconductor Package Substrate for PC Breakdown Data by Manufacturer
3.1 Global Semiconductor Package Substrate for PC Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
3.2 Global Semiconductor Package Substrate for PC Revenue by Manufacturer (2019, 2020, 2021, and 2022)
3.3 Key Manufacturer Market Position in Semiconductor Package Substrate for PC
3.4 Market Concentration Rate
3.4.1 Top 3 Semiconductor Package Substrate for PC Manufacturer Market Share in 2021
3.4.2 Top 6 Semiconductor Package Substrate for PC Manufacturer Market Share in 2021
3.5 Global Semiconductor Package Substrate for PC Production Capacity by Company: 2021 VS 2022
3.6 Manufacturer by Geography: Head Office and Semiconductor Package Substrate for PC Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global Semiconductor Package Substrate for PC Market Size by Region
4.1.1 Global Semiconductor Package Substrate for PC Sales in Volume by Region (2017-2028)
4.1.2 Global Semiconductor Package Substrate for PC Revenue by Region (2017-2028)
4.2 North America Semiconductor Package Substrate for PC Revenue (2017-2028)
4.3 Europe Semiconductor Package Substrate for PC Revenue (2017-2028)
4.4 Asia-Pacific Semiconductor Package Substrate for PC Revenue (2017-2028)
4.5 South America Semiconductor Package Substrate for PC Revenue (2017-2028)
4.6 Middle East and Africa Semiconductor Package Substrate for PC Revenue (2017-2028)
5 Market Segment by Type
5.1 Global Semiconductor Package Substrate for PC Sales in Volume by Type (2017-2028)
5.2 Global Semiconductor Package Substrate for PC Revenue by Type (2017-2028)
5.3 Global Semiconductor Package Substrate for PC Price by Type (2017-2028)
6 Market Segment by Application
6.1 Global Semiconductor Package Substrate for PC Sales in Volume by Application (2017-2028)
6.2 Global Semiconductor Package Substrate for PC Revenue by Application (2017-2028)
6.3 Global Semiconductor Package Substrate for PC Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
7.1 North America Semiconductor Package Substrate for PC Sales by Type (2017-2028)
7.2 North America Semiconductor Package Substrate for PC Sales by Application (2017-2028)
7.3 North America Semiconductor Package Substrate for PC Market Size by Country
7.3.1 North America Semiconductor Package Substrate for PC Sales in Volume by Country (2017-2028)
7.3.2 North America Semiconductor Package Substrate for PC Revenue by Country (2017-2028)
7.3.3 United States Market Size and Forecast (2017-2028)
7.3.4 Canada Market Size and Forecast (2017-2028)
7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
8.1 Europe Semiconductor Package Substrate for PC Sales by Type (2017-2028)
8.2 Europe Semiconductor Package Substrate for PC Sales by Application (2017-2028)
8.3 Europe Semiconductor Package Substrate for PC Market Size by Country
8.3.1 Europe Semiconductor Package Substrate for PC Sales in Volume by Country (2017-2028)
8.3.2 Europe Semiconductor Package Substrate for PC Revenue by Country (2017-2028)
8.3.3 Germany Market Size and Forecast (2017-2028)
8.3.4 France Market Size and Forecast (2017-2028)
8.3.5 United Kingdom Market Size and Forecast (2017-2028)
8.3.6 Russia Market Size and Forecast (2017-2028)
8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
9.1 Asia-Pacific Semiconductor Package Substrate for PC Sales by Type (2017-2028)
9.2 Asia-Pacific Semiconductor Package Substrate for PC Sales by Application (2017-2028)
9.3 Asia-Pacific Semiconductor Package Substrate for PC Market Size by Region
9.3.1 Asia-Pacific Semiconductor Package Substrate for PC Sales in Volume by Region (2017-2028)
9.3.2 Asia-Pacific Semiconductor Package Substrate for PC Revenue by Region (2017-2028)
9.3.3 China Market Size and Forecast (2017-2028)
9.3.4 Japan Market Size and Forecast (2017-2028)
9.3.5 Korea Market Size and Forecast (2017-2028)
9.3.6 India Market Size and Forecast (2017-2028)
9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
10.1 South America Semiconductor Package Substrate for PC Sales by Type (2017-2028)
10.2 South America Semiconductor Package Substrate for PC Sales by Application (2017-2028)
10.3 South America Semiconductor Package Substrate for PC Market Size by Country
10.3.1 South America Semiconductor Package Substrate for PC Sales in Volume by Country (2017-2028)
10.3.2 South America Semiconductor Package Substrate for PC Revenue by Country (2017-2028)
10.3.3 Brazil Market Size and Forecast (2017-2028)
10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa Semiconductor Package Substrate for PC Sales by Type (2017-2028)
11.2 Middle East & Africa Semiconductor Package Substrate for PC Sales by Application (2017-2028)
11.3 Middle East & Africa Semiconductor Package Substrate for PC Market Size by Country
11.3.1 Middle East & Africa Semiconductor Package Substrate for PC Sales in Volume by Country (2017-2028)
11.3.2 Middle East & Africa Semiconductor Package Substrate for PC Revenue by Country (2017-2028)
11.3.3 Turkey Market Size and Forecast (2017-2028)
11.3.4 Egypt Market Size and Forecast (2017-2028)
11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
12.1 Raw Material of Semiconductor Package Substrate for PC and Key Manufacturers
12.2 Manufacturing Costs Percentage of Semiconductor Package Substrate for PC
12.3 Semiconductor Package Substrate for PC Production Process
12.4 Semiconductor Package Substrate for PC Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 Semiconductor Package Substrate for PC Typical Distributors
13.3 Semiconductor Package Substrate for PC Typical Customers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Research Process and Data Source
15.3 Disclaimer



*** 免責事項 ***
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