カテゴリ： 世界, IT/電子, Market Monitor Global

電子パッケージングにおける薄膜基板のグローバル市場展望 2023年-2029年：リジッド薄膜基板、フレキシブル薄膜基板

■ 英語タイトル：Thin Film Substrates in Electronic Packaging Market, Global Outlook and Forecast 2023-2029

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■ 調査対象地域：グローバル、北米、アメリカ、ヨーロッパ、アジア、日本、中国、東南アジア、インド、南米、中東・アフリカなど
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★グローバルリサーチ資料[電子パッケージングにおける薄膜基板のグローバル市場展望 2023年-2029年：リジッド薄膜基板、フレキシブル薄膜基板]についてメールでお問い合わせはこちら
*** レポート概要（サマリー）***

当調査レポートは次の情報を含め、世界の電子パッケージングにおける薄膜基板市場規模と予測を収録しています。・世界の電子パッケージングにおける薄膜基板市場：売上、2018年-2023年、2024年-2029年
・世界の電子パッケージングにおける薄膜基板市場：販売量、2018年-2023年、2024年-2029年
・世界のトップ5企業、2022年

世界の電子パッケージングにおける薄膜基板市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。米国市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「リジッド薄膜基板」セグメントは今後6年間、000%のCAGRで2029年までに000Mドルに成長すると予測されています。

電子パッケージングにおける薄膜基板のグローバル主要企業は、KYOCERA、 Vishay、 CoorsTek、 MARUWA、 Tong Hsing Electronic Industries、 Murata Manufacturing、 ICP Technology、 Leatec Fine Ceramicsなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。

MARKET MONITOR GLOBAL（MMG）は、電子パッケージングにおける薄膜基板のメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。

【セグメント別市場分析】

世界の電子パッケージングにおける薄膜基板市場：タイプ別、2018年-2023年、2024年-2029年
世界の電子パッケージングにおける薄膜基板市場：タイプ別市場シェア、2022年
・リジッド薄膜基板、フレキシブル薄膜基板

世界の電子パッケージングにおける薄膜基板市場：用途別、2018年-2023年、2024年-2029年
世界の電子パッケージングにおける薄膜基板市場：用途別市場シェア、2022年
・パワー電子、ハイブリッドマイクロ電子、マルチチップモジュール、その他

世界の電子パッケージングにおける薄膜基板市場：地域・国別、2018年-2023年、2024年-2029年
世界の電子パッケージングにおける薄膜基板市場：地域別市場シェア、2022年
・北米：アメリカ、カナダ、メキシコ
・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
・アジア：中国、日本、韓国、東南アジア、インド
・南米：ブラジル、アルゼンチン
・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE

【競合分析】

また、当レポートは主要な市場参加者の分析を提供します。
・主要企業における電子パッケージングにおける薄膜基板のグローバル売上、2018年-2023年
・主要企業における電子パッケージングにおける薄膜基板のグローバル売上シェア、2022年
・主要企業における電子パッケージングにおける薄膜基板のグローバル販売量、2018年-2023年
・主要企業における電子パッケージングにおける薄膜基板のグローバル販売量シェア、2022年

さらに、当レポートは主要企業のプロファイルを提示します。
KYOCERA、 Vishay、 CoorsTek、 MARUWA、 Tong Hsing Electronic Industries、 Murata Manufacturing、 ICP Technology、 Leatec Fine Ceramics

*************************************************************

・調査・分析レポートの概要
電子パッケージングにおける薄膜基板市場の定義
市場セグメント
世界の電子パッケージングにおける薄膜基板市場概要
当レポートの特徴・ベネフィット
調査手法と情報源

・世界の電子パッケージングにおける薄膜基板市場規模
世界の電子パッケージングにおける薄膜基板市場規模：2022年 VS 2029年
世界の電子パッケージングにおける薄膜基板市場規模と予測 2018年-2029年

・競争状況
グローバルトップ企業
売上ベースでのグローバルトップ企業
企業別グローバルでの電子パッケージングにおける薄膜基板の売上
グローバルトップ3およびトップ5企業、2022年売上ベース
グローバル企業の電子パッケージングにおける薄膜基板製品タイプ
グローバルにおけるティア1、ティア2、ティア3企業

・タイプ別市場分析
タイプ区分：リジッド薄膜基板、フレキシブル薄膜基板
電子パッケージングにおける薄膜基板のタイプ別グローバル売上・予測

・用途別市場分析
用途区分：パワー電子、ハイブリッドマイクロ電子、マルチチップモジュール、その他
電子パッケージングにおける薄膜基板の用途別グローバル売上・予測

・地域別市場分析
地域別電子パッケージングにおける薄膜基板市場規模 2022年と2029年
地域別電子パッケージングにおける薄膜基板売上・予測
北米市場：アメリカ、カナダ、メキシコ
ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア
アジア市場：中国、日本、韓国、東南アジア、インド
南米市場：ブラジル、アルゼンチン
中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE

・主要企業のプロファイル（企業概要、事業概要、主要製品、売上、ニュースなど）
KYOCERA、 Vishay、 CoorsTek、 MARUWA、 Tong Hsing Electronic Industries、 Murata Manufacturing、 ICP Technology、 Leatec Fine Ceramics
...

Thin-film substrate technology uses semiconductor and microsystem technology processes to produce circuit boards on ceramic or organic materials.
This report aims to provide a comprehensive presentation of the global market for Thin Film Substrates in Electronic Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thin Film Substrates in Electronic Packaging. This report contains market size and forecasts of Thin Film Substrates in Electronic Packaging in global, including the following market information:
Global Thin Film Substrates in Electronic Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Thin Film Substrates in Electronic Packaging Market Sales, 2018-2023, 2024-2029, (K sqm)
Global top five Thin Film Substrates in Electronic Packaging companies in 2022 (%)
The global Thin Film Substrates in Electronic Packaging market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Rigid Thin-Film Substrates Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Thin Film Substrates in Electronic Packaging include KYOCERA, Vishay, CoorsTek, MARUWA, Tong Hsing Electronic Industries, Murata Manufacturing, ICP Technology and Leatec Fine Ceramics, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Thin Film Substrates in Electronic Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Thin Film Substrates in Electronic Packaging Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K sqm)
Global Thin Film Substrates in Electronic Packaging Market Segment Percentages, by Type, 2022 (%)
Rigid Thin-Film Substrates
Flexible Thin-Film Substrates
Global Thin Film Substrates in Electronic Packaging Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K sqm)
Global Thin Film Substrates in Electronic Packaging Market Segment Percentages, by Application, 2022 (%)
Power Electronics
Hybrid Microelectronics
Multi-Chip Modules
Others
Global Thin Film Substrates in Electronic Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K sqm)
Global Thin Film Substrates in Electronic Packaging Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Thin Film Substrates in Electronic Packaging revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Thin Film Substrates in Electronic Packaging revenues share in global market, 2022 (%)
Key companies Thin Film Substrates in Electronic Packaging sales in global market, 2018-2023 (Estimated), (K sqm)
Key companies Thin Film Substrates in Electronic Packaging sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
KYOCERA
Vishay
CoorsTek
MARUWA
Tong Hsing Electronic Industries
Murata Manufacturing
ICP Technology
Leatec Fine Ceramics
Outline of Major Chapters:
Chapter 1: Introduces the definition of Thin Film Substrates in Electronic Packaging, market overview.
Chapter 2: Global Thin Film Substrates in Electronic Packaging market size in revenue and volume.
Chapter 3: Detailed analysis of Thin Film Substrates in Electronic Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Thin Film Substrates in Electronic Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Thin Film Substrates in Electronic Packaging capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

*** レポート目次（コンテンツ）***

1 Introduction to Research & Analysis Reports
1.1 Thin Film Substrates in Electronic Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Thin Film Substrates in Electronic Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Thin Film Substrates in Electronic Packaging Overall Market Size
2.1 Global Thin Film Substrates in Electronic Packaging Market Size: 2022 VS 2029
2.2 Global Thin Film Substrates in Electronic Packaging Revenue, Prospects & Forecasts: 2018-2029
2.3 Global Thin Film Substrates in Electronic Packaging Sales: 2018-2029
3 Company Landscape
3.1 Top Thin Film Substrates in Electronic Packaging Players in Global Market
3.2 Top Global Thin Film Substrates in Electronic Packaging Companies Ranked by Revenue
3.3 Global Thin Film Substrates in Electronic Packaging Revenue by Companies
3.4 Global Thin Film Substrates in Electronic Packaging Sales by Companies
3.5 Global Thin Film Substrates in Electronic Packaging Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 Thin Film Substrates in Electronic Packaging Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers Thin Film Substrates in Electronic Packaging Product Type
3.8 Tier 1, Tier 2 and Tier 3 Thin Film Substrates in Electronic Packaging Players in Global Market
3.8.1 List of Global Tier 1 Thin Film Substrates in Electronic Packaging Companies
3.8.2 List of Global Tier 2 and Tier 3 Thin Film Substrates in Electronic Packaging Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global Thin Film Substrates in Electronic Packaging Market Size Markets, 2022 & 2029
4.1.2 Rigid Thin-Film Substrates
4.1.3 Flexible Thin-Film Substrates
4.2 By Type – Global Thin Film Substrates in Electronic Packaging Revenue & Forecasts
4.2.1 By Type – Global Thin Film Substrates in Electronic Packaging Revenue, 2018-2023
4.2.2 By Type – Global Thin Film Substrates in Electronic Packaging Revenue, 2024-2029
4.2.3 By Type – Global Thin Film Substrates in Electronic Packaging Revenue Market Share, 2018-2029
4.3 By Type – Global Thin Film Substrates in Electronic Packaging Sales & Forecasts
4.3.1 By Type – Global Thin Film Substrates in Electronic Packaging Sales, 2018-2023
4.3.2 By Type – Global Thin Film Substrates in Electronic Packaging Sales, 2024-2029
4.3.3 By Type – Global Thin Film Substrates in Electronic Packaging Sales Market Share, 2018-2029
4.4 By Type – Global Thin Film Substrates in Electronic Packaging Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global Thin Film Substrates in Electronic Packaging Market Size, 2022 & 2029
5.1.2 Power Electronics
5.1.3 Hybrid Microelectronics
5.1.4 Multi-Chip Modules
5.1.5 Others
5.2 By Application – Global Thin Film Substrates in Electronic Packaging Revenue & Forecasts
5.2.1 By Application – Global Thin Film Substrates in Electronic Packaging Revenue, 2018-2023
5.2.2 By Application – Global Thin Film Substrates in Electronic Packaging Revenue, 2024-2029
5.2.3 By Application – Global Thin Film Substrates in Electronic Packaging Revenue Market Share, 2018-2029
5.3 By Application – Global Thin Film Substrates in Electronic Packaging Sales & Forecasts
5.3.1 By Application – Global Thin Film Substrates in Electronic Packaging Sales, 2018-2023
5.3.2 By Application – Global Thin Film Substrates in Electronic Packaging Sales, 2024-2029
5.3.3 By Application – Global Thin Film Substrates in Electronic Packaging Sales Market Share, 2018-2029
5.4 By Application – Global Thin Film Substrates in Electronic Packaging Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region – Global Thin Film Substrates in Electronic Packaging Market Size, 2022 & 2029
6.2 By Region – Global Thin Film Substrates in Electronic Packaging Revenue & Forecasts
6.2.1 By Region – Global Thin Film Substrates in Electronic Packaging Revenue, 2018-2023
6.2.2 By Region – Global Thin Film Substrates in Electronic Packaging Revenue, 2024-2029
6.2.3 By Region – Global Thin Film Substrates in Electronic Packaging Revenue Market Share, 2018-2029
6.3 By Region – Global Thin Film Substrates in Electronic Packaging Sales & Forecasts
6.3.1 By Region – Global Thin Film Substrates in Electronic Packaging Sales, 2018-2023
6.3.2 By Region – Global Thin Film Substrates in Electronic Packaging Sales, 2024-2029
6.3.3 By Region – Global Thin Film Substrates in Electronic Packaging Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country – North America Thin Film Substrates in Electronic Packaging Revenue, 2018-2029
6.4.2 By Country – North America Thin Film Substrates in Electronic Packaging Sales, 2018-2029
6.4.3 US Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.4.4 Canada Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.4.5 Mexico Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.5 Europe
6.5.1 By Country – Europe Thin Film Substrates in Electronic Packaging Revenue, 2018-2029
6.5.2 By Country – Europe Thin Film Substrates in Electronic Packaging Sales, 2018-2029
6.5.3 Germany Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.5.4 France Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.5.5 U.K. Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.5.6 Italy Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.5.7 Russia Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.5.8 Nordic Countries Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.5.9 Benelux Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.6 Asia
6.6.1 By Region – Asia Thin Film Substrates in Electronic Packaging Revenue, 2018-2029
6.6.2 By Region – Asia Thin Film Substrates in Electronic Packaging Sales, 2018-2029
6.6.3 China Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.6.4 Japan Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.6.5 South Korea Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.6.6 Southeast Asia Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.6.7 India Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.7 South America
6.7.1 By Country – South America Thin Film Substrates in Electronic Packaging Revenue, 2018-2029
6.7.2 By Country – South America Thin Film Substrates in Electronic Packaging Sales, 2018-2029
6.7.3 Brazil Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.7.4 Argentina Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa Thin Film Substrates in Electronic Packaging Revenue, 2018-2029
6.8.2 By Country – Middle East & Africa Thin Film Substrates in Electronic Packaging Sales, 2018-2029
6.8.3 Turkey Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.8.4 Israel Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.8.5 Saudi Arabia Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
6.8.6 UAE Thin Film Substrates in Electronic Packaging Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 KYOCERA
7.1.1 KYOCERA Company Summary
7.1.2 KYOCERA Business Overview
7.1.3 KYOCERA Thin Film Substrates in Electronic Packaging Major Product Offerings
7.1.4 KYOCERA Thin Film Substrates in Electronic Packaging Sales and Revenue in Global (2018-2023)
7.1.5 KYOCERA Key News & Latest Developments
7.2 Vishay
7.2.1 Vishay Company Summary
7.2.2 Vishay Business Overview
7.2.3 Vishay Thin Film Substrates in Electronic Packaging Major Product Offerings
7.2.4 Vishay Thin Film Substrates in Electronic Packaging Sales and Revenue in Global (2018-2023)
7.2.5 Vishay Key News & Latest Developments
7.3 CoorsTek
7.3.1 CoorsTek Company Summary
7.3.2 CoorsTek Business Overview
7.3.3 CoorsTek Thin Film Substrates in Electronic Packaging Major Product Offerings
7.3.4 CoorsTek Thin Film Substrates in Electronic Packaging Sales and Revenue in Global (2018-2023)
7.3.5 CoorsTek Key News & Latest Developments
7.4 MARUWA
7.4.1 MARUWA Company Summary
7.4.2 MARUWA Business Overview
7.4.3 MARUWA Thin Film Substrates in Electronic Packaging Major Product Offerings
7.4.4 MARUWA Thin Film Substrates in Electronic Packaging Sales and Revenue in Global (2018-2023)
7.4.5 MARUWA Key News & Latest Developments
7.5 Tong Hsing Electronic Industries
7.5.1 Tong Hsing Electronic Industries Company Summary
7.5.2 Tong Hsing Electronic Industries Business Overview
7.5.3 Tong Hsing Electronic Industries Thin Film Substrates in Electronic Packaging Major Product Offerings
7.5.4 Tong Hsing Electronic Industries Thin Film Substrates in Electronic Packaging Sales and Revenue in Global (2018-2023)
7.5.5 Tong Hsing Electronic Industries Key News & Latest Developments
7.6 Murata Manufacturing
7.6.1 Murata Manufacturing Company Summary
7.6.2 Murata Manufacturing Business Overview
7.6.3 Murata Manufacturing Thin Film Substrates in Electronic Packaging Major Product Offerings
7.6.4 Murata Manufacturing Thin Film Substrates in Electronic Packaging Sales and Revenue in Global (2018-2023)
7.6.5 Murata Manufacturing Key News & Latest Developments
7.7 ICP Technology
7.7.1 ICP Technology Company Summary
7.7.2 ICP Technology Business Overview
7.7.3 ICP Technology Thin Film Substrates in Electronic Packaging Major Product Offerings
7.7.4 ICP Technology Thin Film Substrates in Electronic Packaging Sales and Revenue in Global (2018-2023)
7.7.5 ICP Technology Key News & Latest Developments
7.8 Leatec Fine Ceramics
7.8.1 Leatec Fine Ceramics Company Summary
7.8.2 Leatec Fine Ceramics Business Overview
7.8.3 Leatec Fine Ceramics Thin Film Substrates in Electronic Packaging Major Product Offerings
7.8.4 Leatec Fine Ceramics Thin Film Substrates in Electronic Packaging Sales and Revenue in Global (2018-2023)
7.8.5 Leatec Fine Ceramics Key News & Latest Developments
8 Global Thin Film Substrates in Electronic Packaging Production Capacity, Analysis
8.1 Global Thin Film Substrates in Electronic Packaging Production Capacity, 2018-2029
8.2 Thin Film Substrates in Electronic Packaging Production Capacity of Key Manufacturers in Global Market
8.3 Global Thin Film Substrates in Electronic Packaging Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Thin Film Substrates in Electronic Packaging Supply Chain Analysis
10.1 Thin Film Substrates in Electronic Packaging Industry Value Chain
10.2 Thin Film Substrates in Electronic Packaging Upstream Market
10.3 Thin Film Substrates in Electronic Packaging Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Thin Film Substrates in Electronic Packaging Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer



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