世界の半導体ウエハー用ダイシングマシン市場2022年:市場規模予測(~2028年)

■ 英語タイトル:Global Dicing Machine for Semiconductor Wafers Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

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★グローバルリサーチ資料[世界の半導体ウエハー用ダイシングマシン市場2022年:市場規模予測(~2028年)]についてメールでお問い合わせはこちら
*** レポート概要(サマリー)***

半導体ウエハー用ダイシングマシン市場レポートは、世界の市場規模、地域および国レベルの市場規模、セグメント市場の成長性、市場シェア、競争環境、販売分析、国内および世界の市場プレーヤーの影響、バリューチェーンの最適化、最近の動向、機会分析、市場成長の戦略的な分析、製品発売、地域市場の拡大などに関する情報を提供します。
GlobalInfoResearchの最新の調査によると、世界の半導体ウエハー用ダイシングマシンの市場規模は2021年のxxx米ドルから2028年にはxxx米ドルと推定され、xxx%の成長率で成長すると予想されます。

半導体ウエハー用ダイシングマシン市場は種類と用途によって区分されます。2017年~2028年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。

種類別セグメントは次をカバーします。
・ダイシングソー、レーザーソー

用途別セグメントは次のように区分されます。
・IDM、ウェーハファウンドリー、OSAT

世界の半導体ウエハー用ダイシングマシン市場の主要な市場プレーヤーは以下のとおりです。
・DISCO、Tokyo Seimitsu、GL Tech、ASM、Synova、CETC Electronics Equipment、Shenyang Heyan Technology、Jiangsu Jingchuang Advanced Electronic Technology、Shenzhen Huateng Semi-Conductor Equipment、Shenzhen Tensun Precision Equipment

地域別セグメントは次の地域・国をカバーします。
・北米(米国、カナダ、メキシコ)
・ヨーロッパ(ドイツ、フランス、イギリス、ロシア、イタリア)
・アジア太平洋(日本、中国、韓国、インド、東南アジア、オーストラリア)
・南アメリカ(ブラジル、アルゼンチン、コロンビア)
・中東およびアフリカ(サウジアラビア、UAE、エジプト、南アフリカ)

本調査レポートの内容は計15章あります。
・第1章では、半導体ウエハー用ダイシングマシン製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。
・第2章では、主要な半導体ウエハー用ダイシングマシンメーカーの企業概要、2019年~2022年までの半導体ウエハー用ダイシングマシンの価格、販売量、売上、市場シェアを掲載しています。
・第3章では、主要な半導体ウエハー用ダイシングマシンメーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。
・第4章では、2017年~2028年までの地域別半導体ウエハー用ダイシングマシンの販売量、売上、成長性を示しています。
・第5、6章では、2017年~2028年までの半導体ウエハー用ダイシングマシンの種類別と用途別の市場規模、市場シェアと成長率を掲載しています。
・第7、8、9、10、11章では、2017年~2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年~2028年までの主要地域での半導体ウエハー用ダイシングマシン市場予測を収録しています。
・第12章では、主要な原材料、主要なサプライヤー、および半導体ウエハー用ダイシングマシンの産業チェーンを掲載しています。
・第13、14、15章では、半導体ウエハー用ダイシングマシンの販売チャネル、販売業者、顧客、調査結果と結論、付録、データソースなどについて説明します。

***** 目次(一部) *****

・市場概要
- 半導体ウエハー用ダイシングマシンの概要
- 種類別分析(2017年vs2021年vs2028年):ダイシングソー、レーザーソー
- 用途別分析(2017年vs2021年vs2028年):IDM、ウェーハファウンドリー、OSAT
- 世界の半導体ウエハー用ダイシングマシン市場規模・予測
- 世界の半導体ウエハー用ダイシングマシン生産能力分析
- 市場の成長要因・阻害要因・動向
・メーカー情報(企業概要、製品概要、販売量、価格、売上)
- DISCO、Tokyo Seimitsu、GL Tech、ASM、Synova、CETC Electronics Equipment、Shenyang Heyan Technology、Jiangsu Jingchuang Advanced Electronic Technology、Shenzhen Huateng Semi-Conductor Equipment、Shenzhen Tensun Precision Equipment
・メーカー別市場シェア・市場集中度
・地域別市場分析2017年-2028年
・種類別分析2017年-2028年:ダイシングソー、レーザーソー
・用途別分析2017年-2028年:IDM、ウェーハファウンドリー、OSAT
・半導体ウエハー用ダイシングマシンの北米市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模:アメリカ、カナダ、メキシコなど
・半導体ウエハー用ダイシングマシンのヨーロッパ市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模:ドイツ、イギリス、フランス、ロシア、イタリアなど
・半導体ウエハー用ダイシングマシンのアジア市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模:中国、日本、韓国、インド、東南アジア、オーストラリアなど
・半導体ウエハー用ダイシングマシンの南米市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模:ブラジル、アルゼンチンなど
・半導体ウエハー用ダイシングマシンの中東・アフリカ市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模:サウジアラビア、トルコ、エジプト、南アフリカなど
・原材料および産業チェーン
・販売チャネル、流通業者・代理店、顧客リスト
・調査の結果・結論

The Dicing Machine for Semiconductor Wafers market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global Dicing Machine for Semiconductor Wafers market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of USD million by 2028 with a CAGR of % during forecast period 2022-2028. IDM accounting for % of the Dicing Machine for Semiconductor Wafers global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While Dicing Saws segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of Dicing Machine for Semiconductor Wafers include DISCO, Tokyo Seimitsu, GL Tech, ASM, and Synova, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
Dicing Machine for Semiconductor Wafers market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
Dicing Saws
Laser Saws
Market segment by Application can be divided into
IDM
Wafer Foundry
OSAT
The key market players for global Dicing Machine for Semiconductor Wafers market are listed below:
DISCO
Tokyo Seimitsu
GL Tech
ASM
Synova
CETC Electronics Equipment
Shenyang Heyan Technology
Jiangsu Jingchuang Advanced Electronic Technology
Shenzhen Huateng Semi-Conductor Equipment
Shenzhen Tensun Precision Equipment
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Dicing Machine for Semiconductor Wafers product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Dicing Machine for Semiconductor Wafers, with price, sales, revenue and global market share of Dicing Machine for Semiconductor Wafers from 2019 to 2022.
Chapter 3, the Dicing Machine for Semiconductor Wafers competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Dicing Machine for Semiconductor Wafers breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and Dicing Machine for Semiconductor Wafers market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of Dicing Machine for Semiconductor Wafers.
Chapter 13, 14, and 15, to describe Dicing Machine for Semiconductor Wafers sales channel, distributors, customers, research findings and conclusion, appendix and data source.

*** レポート目次(コンテンツ)***

1 Market Overview
1.1 Dicing Machine for Semiconductor Wafers Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Dicing Machine for Semiconductor Wafers Revenue by Type: 2017 Versus 2021 Versus 2028
1.2.2 Dicing Saws
1.2.3 Laser Saws
1.3 Market Analysis by Application
1.3.1 Overview: Global Dicing Machine for Semiconductor Wafers Revenue by Application: 2017 Versus 2021 Versus 2028
1.3.2 IDM
1.3.3 Wafer Foundry
1.3.4 OSAT
1.4 Global Dicing Machine for Semiconductor Wafers Market Size & Forecast
1.4.1 Global Dicing Machine for Semiconductor Wafers Sales in Value (2017 & 2021 & 2028)
1.4.2 Global Dicing Machine for Semiconductor Wafers Sales in Volume (2017-2028)
1.4.3 Global Dicing Machine for Semiconductor Wafers Price (2017-2028)
1.5 Global Dicing Machine for Semiconductor Wafers Production Capacity Analysis
1.5.1 Global Dicing Machine for Semiconductor Wafers Total Production Capacity (2017-2028)
1.5.2 Global Dicing Machine for Semiconductor Wafers Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 Dicing Machine for Semiconductor Wafers Market Drivers
1.6.2 Dicing Machine for Semiconductor Wafers Market Restraints
1.6.3 Dicing Machine for Semiconductor Wafers Trends Analysis
2 Manufacturers Profiles
2.1 DISCO
2.1.1 DISCO Details
2.1.2 DISCO Major Business
2.1.3 DISCO Dicing Machine for Semiconductor Wafers Product and Services
2.1.4 DISCO Dicing Machine for Semiconductor Wafers Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.2 Tokyo Seimitsu
2.2.1 Tokyo Seimitsu Details
2.2.2 Tokyo Seimitsu Major Business
2.2.3 Tokyo Seimitsu Dicing Machine for Semiconductor Wafers Product and Services
2.2.4 Tokyo Seimitsu Dicing Machine for Semiconductor Wafers Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.3 GL Tech
2.3.1 GL Tech Details
2.3.2 GL Tech Major Business
2.3.3 GL Tech Dicing Machine for Semiconductor Wafers Product and Services
2.3.4 GL Tech Dicing Machine for Semiconductor Wafers Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.4 ASM
2.4.1 ASM Details
2.4.2 ASM Major Business
2.4.3 ASM Dicing Machine for Semiconductor Wafers Product and Services
2.4.4 ASM Dicing Machine for Semiconductor Wafers Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.5 Synova
2.5.1 Synova Details
2.5.2 Synova Major Business
2.5.3 Synova Dicing Machine for Semiconductor Wafers Product and Services
2.5.4 Synova Dicing Machine for Semiconductor Wafers Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.6 CETC Electronics Equipment
2.6.1 CETC Electronics Equipment Details
2.6.2 CETC Electronics Equipment Major Business
2.6.3 CETC Electronics Equipment Dicing Machine for Semiconductor Wafers Product and Services
2.6.4 CETC Electronics Equipment Dicing Machine for Semiconductor Wafers Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.7 Shenyang Heyan Technology
2.7.1 Shenyang Heyan Technology Details
2.7.2 Shenyang Heyan Technology Major Business
2.7.3 Shenyang Heyan Technology Dicing Machine for Semiconductor Wafers Product and Services
2.7.4 Shenyang Heyan Technology Dicing Machine for Semiconductor Wafers Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.8 Jiangsu Jingchuang Advanced Electronic Technology
2.8.1 Jiangsu Jingchuang Advanced Electronic Technology Details
2.8.2 Jiangsu Jingchuang Advanced Electronic Technology Major Business
2.8.3 Jiangsu Jingchuang Advanced Electronic Technology Dicing Machine for Semiconductor Wafers Product and Services
2.8.4 Jiangsu Jingchuang Advanced Electronic Technology Dicing Machine for Semiconductor Wafers Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.9 Shenzhen Huateng Semi-Conductor Equipment
2.9.1 Shenzhen Huateng Semi-Conductor Equipment Details
2.9.2 Shenzhen Huateng Semi-Conductor Equipment Major Business
2.9.3 Shenzhen Huateng Semi-Conductor Equipment Dicing Machine for Semiconductor Wafers Product and Services
2.9.4 Shenzhen Huateng Semi-Conductor Equipment Dicing Machine for Semiconductor Wafers Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.10 Shenzhen Tensun Precision Equipment
2.10.1 Shenzhen Tensun Precision Equipment Details
2.10.2 Shenzhen Tensun Precision Equipment Major Business
2.10.3 Shenzhen Tensun Precision Equipment Dicing Machine for Semiconductor Wafers Product and Services
2.10.4 Shenzhen Tensun Precision Equipment Dicing Machine for Semiconductor Wafers Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 Dicing Machine for Semiconductor Wafers Breakdown Data by Manufacturer
3.1 Global Dicing Machine for Semiconductor Wafers Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
3.2 Global Dicing Machine for Semiconductor Wafers Revenue by Manufacturer (2019, 2020, 2021, and 2022)
3.3 Key Manufacturer Market Position in Dicing Machine for Semiconductor Wafers
3.4 Market Concentration Rate
3.4.1 Top 3 Dicing Machine for Semiconductor Wafers Manufacturer Market Share in 2021
3.4.2 Top 6 Dicing Machine for Semiconductor Wafers Manufacturer Market Share in 2021
3.5 Global Dicing Machine for Semiconductor Wafers Production Capacity by Company: 2021 VS 2022
3.6 Manufacturer by Geography: Head Office and Dicing Machine for Semiconductor Wafers Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global Dicing Machine for Semiconductor Wafers Market Size by Region
4.1.1 Global Dicing Machine for Semiconductor Wafers Sales in Volume by Region (2017-2028)
4.1.2 Global Dicing Machine for Semiconductor Wafers Revenue by Region (2017-2028)
4.2 North America Dicing Machine for Semiconductor Wafers Revenue (2017-2028)
4.3 Europe Dicing Machine for Semiconductor Wafers Revenue (2017-2028)
4.4 Asia-Pacific Dicing Machine for Semiconductor Wafers Revenue (2017-2028)
4.5 South America Dicing Machine for Semiconductor Wafers Revenue (2017-2028)
4.6 Middle East and Africa Dicing Machine for Semiconductor Wafers Revenue (2017-2028)
5 Market Segment by Type
5.1 Global Dicing Machine for Semiconductor Wafers Sales in Volume by Type (2017-2028)
5.2 Global Dicing Machine for Semiconductor Wafers Revenue by Type (2017-2028)
5.3 Global Dicing Machine for Semiconductor Wafers Price by Type (2017-2028)
6 Market Segment by Application
6.1 Global Dicing Machine for Semiconductor Wafers Sales in Volume by Application (2017-2028)
6.2 Global Dicing Machine for Semiconductor Wafers Revenue by Application (2017-2028)
6.3 Global Dicing Machine for Semiconductor Wafers Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
7.1 North America Dicing Machine for Semiconductor Wafers Sales by Type (2017-2028)
7.2 North America Dicing Machine for Semiconductor Wafers Sales by Application (2017-2028)
7.3 North America Dicing Machine for Semiconductor Wafers Market Size by Country
7.3.1 North America Dicing Machine for Semiconductor Wafers Sales in Volume by Country (2017-2028)
7.3.2 North America Dicing Machine for Semiconductor Wafers Revenue by Country (2017-2028)
7.3.3 United States Market Size and Forecast (2017-2028)
7.3.4 Canada Market Size and Forecast (2017-2028)
7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
8.1 Europe Dicing Machine for Semiconductor Wafers Sales by Type (2017-2028)
8.2 Europe Dicing Machine for Semiconductor Wafers Sales by Application (2017-2028)
8.3 Europe Dicing Machine for Semiconductor Wafers Market Size by Country
8.3.1 Europe Dicing Machine for Semiconductor Wafers Sales in Volume by Country (2017-2028)
8.3.2 Europe Dicing Machine for Semiconductor Wafers Revenue by Country (2017-2028)
8.3.3 Germany Market Size and Forecast (2017-2028)
8.3.4 France Market Size and Forecast (2017-2028)
8.3.5 United Kingdom Market Size and Forecast (2017-2028)
8.3.6 Russia Market Size and Forecast (2017-2028)
8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
9.1 Asia-Pacific Dicing Machine for Semiconductor Wafers Sales by Type (2017-2028)
9.2 Asia-Pacific Dicing Machine for Semiconductor Wafers Sales by Application (2017-2028)
9.3 Asia-Pacific Dicing Machine for Semiconductor Wafers Market Size by Region
9.3.1 Asia-Pacific Dicing Machine for Semiconductor Wafers Sales in Volume by Region (2017-2028)
9.3.2 Asia-Pacific Dicing Machine for Semiconductor Wafers Revenue by Region (2017-2028)
9.3.3 China Market Size and Forecast (2017-2028)
9.3.4 Japan Market Size and Forecast (2017-2028)
9.3.5 Korea Market Size and Forecast (2017-2028)
9.3.6 India Market Size and Forecast (2017-2028)
9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
10.1 South America Dicing Machine for Semiconductor Wafers Sales by Type (2017-2028)
10.2 South America Dicing Machine for Semiconductor Wafers Sales by Application (2017-2028)
10.3 South America Dicing Machine for Semiconductor Wafers Market Size by Country
10.3.1 South America Dicing Machine for Semiconductor Wafers Sales in Volume by Country (2017-2028)
10.3.2 South America Dicing Machine for Semiconductor Wafers Revenue by Country (2017-2028)
10.3.3 Brazil Market Size and Forecast (2017-2028)
10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa Dicing Machine for Semiconductor Wafers Sales by Type (2017-2028)
11.2 Middle East & Africa Dicing Machine for Semiconductor Wafers Sales by Application (2017-2028)
11.3 Middle East & Africa Dicing Machine for Semiconductor Wafers Market Size by Country
11.3.1 Middle East & Africa Dicing Machine for Semiconductor Wafers Sales in Volume by Country (2017-2028)
11.3.2 Middle East & Africa Dicing Machine for Semiconductor Wafers Revenue by Country (2017-2028)
11.3.3 Turkey Market Size and Forecast (2017-2028)
11.3.4 Egypt Market Size and Forecast (2017-2028)
11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
12.1 Raw Material of Dicing Machine for Semiconductor Wafers and Key Manufacturers
12.2 Manufacturing Costs Percentage of Dicing Machine for Semiconductor Wafers
12.3 Dicing Machine for Semiconductor Wafers Production Process
12.4 Dicing Machine for Semiconductor Wafers Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 Dicing Machine for Semiconductor Wafers Typical Distributors
13.3 Dicing Machine for Semiconductor Wafers Typical Customers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Research Process and Data Source
15.3 Disclaimer

List of Tables
Table 1. Global Dicing Machine for Semiconductor Wafers Revenue by Type, (USD Million), 2017 & 2021 & 2028
Table 2. Global Dicing Machine for Semiconductor Wafers Revenue by Application, (USD Million), 2017 & 2021 & 2028
Table 3. DISCO Basic Information, Manufacturing Base and Competitors
Table 4. DISCO Major Business
Table 5. DISCO Dicing Machine for Semiconductor Wafers Product and Services
Table 6. DISCO Dicing Machine for Semiconductor Wafers Sales (Units), Price (US$/Unit), Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
Table 7. Tokyo Seimitsu Basic Information, Manufacturing Base and Competitors
Table 8. Tokyo Seimitsu Major Business
Table 9. Tokyo Seimitsu Dicing Machine for Semiconductor Wafers Product and Services
Table 10. Tokyo Seimitsu Dicing Machine for Semiconductor Wafers Sales (Units), Price (US$/Unit), Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
Table 11. GL Tech Basic Information, Manufacturing Base and Competitors
Table 12. GL Tech Major Business
Table 13. GL Tech Dicing Machine for Semiconductor Wafers Product and Services
Table 14. GL Tech Dicing Machine for Semiconductor Wafers Sales (Units), Price (US$/Unit), Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
Table 15. ASM Basic Information, Manufacturing Base and Competitors
Table 16. ASM Major Business
Table 17. ASM Dicing Machine for Semiconductor Wafers Product and Services
Table 18. ASM Dicing Machine for Semiconductor Wafers Sales (Units), Price (US$/Unit), Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
Table 19. Synova Basic Information, Manufacturing Base and Competitors
Table 20. Synova Major Business
Table 21. Synova Dicing Machine for Semiconductor Wafers Product and Services
Table 22. Synova Dicing Machine for Semiconductor Wafers Sales (Units), Price (US$/Unit), Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
Table 23. CETC Electronics Equipment Basic Information, Manufacturing Base and Competitors
Table 24. CETC Electronics Equipment Major Business
Table 25. CETC Electronics Equipment Dicing Machine for Semiconductor Wafers Product and Services
Table 26. CETC Electronics Equipment Dicing Machine for Semiconductor Wafers Sales (Units), Price (US$/Unit), Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
Table 27. Shenyang Heyan Technology Basic Information, Manufacturing Base and Competitors
Table 28. Shenyang Heyan Technology Major Business
Table 29. Shenyang Heyan Technology Dicing Machine for Semiconductor Wafers Product and Services
Table 30. Shenyang Heyan Technology Dicing Machine for Semiconductor Wafers Sales (Units), Price (US$/Unit), Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
Table 31. Jiangsu Jingchuang Advanced Electronic Technology Basic Information, Manufacturing Base and Competitors
Table 32. Jiangsu Jingchuang Advanced Electronic Technology Major Business
Table 33. Jiangsu Jingchuang Advanced Electronic Technology Dicing Machine for Semiconductor Wafers Product and Services
Table 34. Jiangsu Jingchuang Advanced Electronic Technology Dicing Machine for Semiconductor Wafers Sales (Units), Price (US$/Unit), Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
Table 35. Shenzhen Huateng Semi-Conductor Equipment Basic Information, Manufacturing Base and Competitors
Table 36. Shenzhen Huateng Semi-Conductor Equipment Major Business
Table 37. Shenzhen Huateng Semi-Conductor Equipment Dicing Machine for Semiconductor Wafers Product and Services
Table 38. Shenzhen Huateng Semi-Conductor Equipment Dicing Machine for Semiconductor Wafers Sales (Units), Price (US$/Unit), Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
Table 39. Shenzhen Tensun Precision Equipment Basic Information, Manufacturing Base and Competitors
Table 40. Shenzhen Tensun Precision Equipment Major Business
Table 41. Shenzhen Tensun Precision Equipment Dicing Machine for Semiconductor Wafers Product and Services
Table 42. Shenzhen Tensun Precision Equipment Dicing Machine for Semiconductor Wafers Sales (Units), Price (US$/Unit), Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
Table 43. Global Dicing Machine for Semiconductor Wafers Sales by Manufacturer (2019, 2020, 2021, and 2022) & (Units)
Table 44. Global Dicing Machine for Semiconductor Wafers Revenue by Manufacturer (2019, 2020, 2021, and 2022) & (USD Million)
Table 45. Market Position of Manufacturers in Dicing Machine for Semiconductor Wafers, (Tier 1, Tier 2, and Tier 3), Based on Revenue in 2021
Table 46. Global Dicing Machine for Semiconductor Wafers Production Capacity by Company, (Units): 2020 VS 2021
Table 47. Head Office and Dicing Machine for Semiconductor Wafers Production Site of Key Manufacturer
Table 48. Dicing Machine for Semiconductor Wafers New Entrant and Capacity Expansion Plans
Table 49. Dicing Machine for Semiconductor Wafers Mergers & Acquisitions in the Past Five Years
Table 50. Global Dicing Machine for Semiconductor Wafers Sales by Region (2017-2022) & (Units)
Table 51. Global Dicing Machine for Semiconductor Wafers Sales by Region (2023-2028) & (Units)
Table 52. Global Dicing Machine for Semiconductor Wafers Revenue by Region (2017-2022) & (USD Million)
Table 53. Global Dicing Machine for Semiconductor Wafers Revenue by Region (2023-2028) & (USD Million)
Table 54. Global Dicing Machine for Semiconductor Wafers Sales by Type (2017-2022) & (Units)
Table 55. Global Dicing Machine for Semiconductor Wafers Sales by Type (2023-2028) & (Units)
Table 56. Global Dicing Machine for Semiconductor Wafers Revenue by Type (2017-2022) & (USD Million)
Table 57. Global Dicing Machine for Semiconductor Wafers Revenue by Type (2023-2028) & (USD Million)
Table 58. Global Dicing Machine for Semiconductor Wafers Price by Type (2017-2022) & (US$/Unit)
Table 59. Global Dicing Machine for Semiconductor Wafers Price by Type (2023-2028) & (US$/Unit)
Table 60. Global Dicing Machine for Semiconductor Wafers Sales by Application (2017-2022) & (Units)
Table 61. Global Dicing Machine for Semiconductor Wafers Sales by Application (2023-2028) & (Units)
Table 62. Global Dicing Machine for Semiconductor Wafers Revenue by Application (2017-2022) & (USD Million)
Table 63. Global Dicing Machine for Semiconductor Wafers Revenue by Application (2023-2028) & (USD Million)
Table 64. Global Dicing Machine for Semiconductor Wafers Price by Application (2017-2022) & (US$/Unit)
Table 65. Global Dicing Machine for Semiconductor Wafers Price by Application (2023-2028) & (US$/Unit)
Table 66. North America Dicing Machine for Semiconductor Wafers Sales by Country (2017-2022) & (Units)
Table 67. North America Dicing Machine for Semiconductor Wafers Sales by Country (2023-2028) & (Units)
Table 68. North America Dicing Machine for Semiconductor Wafers Revenue by Country (2017-2022) & (USD Million)
Table 69. North America Dicing Machine for Semiconductor Wafers Revenue by Country (2023-2028) & (USD Million)
Table 70. North America Dicing Machine for Semiconductor Wafers Sales by Type (2017-2022) & (Units)
Table 71. North America Dicing Machine for Semiconductor Wafers Sales by Type (2023-2028) & (Units)
Table 72. North America Dicing Machine for Semiconductor Wafers Sales by Application (2017-2022) & (Units)
Table 73. North America Dicing Machine for Semiconductor Wafers Sales by Application (2023-2028) & (Units)
Table 74. Europe Dicing Machine for Semiconductor Wafers Sales by Country (2017-2022) & (Units)
Table 75. Europe Dicing Machine for Semiconductor Wafers Sales by Country (2023-2028) & (Units)
Table 76. Europe Dicing Machine for Semiconductor Wafers Revenue by Country (2017-2022) & (USD Million)
Table 77. Europe Dicing Machine for Semiconductor Wafers Revenue by Country (2023-2028) & (USD Million)
Table 78. Europe Dicing Machine for Semiconductor Wafers Sales by Type (2017-2022) & (Units)
Table 79. Europe Dicing Machine for Semiconductor Wafers Sales by Type (2023-2028) & (Units)
Table 80. Europe Dicing Machine for Semiconductor Wafers Sales by Application (2017-2022) & (Units)
Table 81. Europe Dicing Machine for Semiconductor Wafers Sales by Application (2023-2028) & (Units)
Table 82. Asia-Pacific Dicing Machine for Semiconductor Wafers Sales by Region (2017-2022) & (Units)
Table 83. Asia-Pacific Dicing Machine for Semiconductor Wafers Sales by Region (2023-2028) & (Units)
Table 84. Asia-Pacific Dicing Machine for Semiconductor Wafers Revenue by Region (2017-2022) & (USD Million)
Table 85. Asia-Pacific Dicing Machine for Semiconductor Wafers Revenue by Region (2023-2028) & (USD Million)
Table 86. Asia-Pacific Dicing Machine for Semiconductor Wafers Sales by Type (2017-2022) & (Units)
Table 87. Asia-Pacific Dicing Machine for Semiconductor Wafers Sales by Type (2023-2028) & (Units)
Table 88. Asia-Pacific Dicing Machine for Semiconductor Wafers Sales by Application (2017-2022) & (Units)
Table 89. Asia-Pacific Dicing Machine for Semiconductor Wafers Sales by Application (2023-2028) & (Units)
Table 90. South America Dicing Machine for Semiconductor Wafers Sales by Country (2017-2022) & (Units)
Table 91. South America Dicing Machine for Semiconductor Wafers Sales by Country (2023-2028) & (Units)
Table 92. South America Dicing Machine for Semiconductor Wafers Revenue by Country (2017-2022) & (USD Million)
Table 93. South America Dicing Machine for Semiconductor Wafers Revenue by Country (2023-2028) & (USD Million)
Table 94. South America Dicing Machine for Semiconductor Wafers Sales by Type (2017-2022) & (Units)
Table 95. South America Dicing Machine for Semiconductor Wafers Sales by Type (2023-2028) & (Units)
Table 96. South America Dicing Machine for Semiconductor Wafers Sales by Application (2017-2022) & (Units)
Table 97. South America Dicing Machine for Semiconductor Wafers Sales by Application (2023-2028) & (Units)
Table 98. Middle East & Africa Dicing Machine for Semiconductor Wafers Sales by Region (2017-2022) & (Units)
Table 99. Middle East & Africa Dicing Machine for Semiconductor Wafers Sales by Region (2023-2028) & (Units)
Table 100. Middle East & Africa Dicing Machine for Semiconductor Wafers Revenue by Region (2017-2022) & (USD Million)
Table 101. Middle East & Africa Dicing Machine for Semiconductor Wafers Revenue by Region (2023-2028) & (USD Million)
Table 102. Middle East & Africa Dicing Machine for Semiconductor Wafers Sales by Type (2017-2022) & (Units)
Table 103. Middle East & Africa Dicing Machine for Semiconductor Wafers Sales by Type (2023-2028) & (Units)
Table 104. Middle East & Africa Dicing Machine for Semiconductor Wafers Sales by Application (2017-2022) & (Units)
Table 105. Middle East & Africa Dicing Machine for Semiconductor Wafers Sales by Application (2023-2028) & (Units)
Table 106. Dicing Machine for Semiconductor Wafers Raw Material
Table 107. Key Manufacturers of Dicing Machine for Semiconductor Wafers Raw Materials
Table 108. Direct Channel Pros & Cons
Table 109. Indirect Channel Pros & Cons
Table 110. Dicing Machine for Semiconductor Wafers Typical Distributors
Table 111. Dicing Machine for Semiconductor Wafers Typical Customers
List of Figures
Figure 1. Dicing Machine for Semiconductor Wafers Picture
Figure 2. Global Dicing Machine for Semiconductor Wafers Revenue Market Share by Type in 2021
Figure 3. Dicing Saws
Figure 4. Laser Saws
Figure 5. Global Dicing Machine for Semiconductor Wafers Revenue Market Share by Application in 2021
Figure 6. IDM
Figure 7. Wafer Foundry
Figure 8. OSAT
Figure 9. Global Dicing Machine for Semiconductor Wafers Revenue, (USD Million) & (Units): 2017 & 2021 & 2028
Figure 10. Global Dicing Machine for Semiconductor Wafers Revenue and Forecast (2017-2028) & (USD Million)
Figure 11. Global Dicing Machine for Semiconductor Wafers Sales (2017-2028) & (Units)
Figure 12. Global Dicing Machine for Semiconductor Wafers Price (2017-2028) & (US$/Unit)
Figure 13. Global Dicing Machine for Semiconductor Wafers Production Capacity (2017-2028) & (Units)
Figure 14. Global Dicing Machine for Semiconductor Wafers Production Capacity by Geographic Region: 2022 VS 2028
Figure 15. Dicing Machine for Semiconductor Wafers Market Drivers
Figure 16. Dicing Machine for Semiconductor Wafers Market Restraints
Figure 17. Dicing Machine for Semiconductor Wafers Market Trends
Figure 18. Global Dicing Machine for Semiconductor Wafers Sales Market Share by Manufacturer in 2021
Figure 19. Global Dicing Machine for Semiconductor Wafers Revenue Market Share by Manufacturer in 2021
Figure 20. Dicing Machine for Semiconductor Wafers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) in 2021
Figure 21. Top 3 Dicing Machine for Semiconductor Wafers Manufacturer (Revenue) Market Share in 2021
Figure 22. Top 6 Dicing Machine for Semiconductor Wafers Manufacturer (Revenue) Market Share in 2021
Figure 23. Global Dicing Machine for Semiconductor Wafers Sales Market Share by Region (2017-2028)
Figure 24. Global Dicing Machine for Semiconductor Wafers Revenue Market Share by Region (2017-2028)
Figure 25. North America Dicing Machine for Semiconductor Wafers Revenue (2017-2028) & (USD Million)
Figure 26. Europe Dicing Machine for Semiconductor Wafers Revenue (2017-2028) & (USD Million)
Figure 27. Asia-Pacific Dicing Machine for Semiconductor Wafers Revenue (2017-2028) & (USD Million)
Figure 28. South America Dicing Machine for Semiconductor Wafers Revenue (2017-2028) & (USD Million)
Figure 29. Middle East & Africa Dicing Machine for Semiconductor Wafers Revenue (2017-2028) & (USD Million)
Figure 30. Global Dicing Machine for Semiconductor Wafers Sales Market Share by Type (2017-2028)
Figure 31. Global Dicing Machine for Semiconductor Wafers Revenue Market Share by Type (2017-2028)
Figure 32. Global Dicing Machine for Semiconductor Wafers Price by Type (2017-2028) & (US$/Unit)
Figure 33. Global Dicing Machine for Semiconductor Wafers Sales Market Share by Application (2017-2028)
Figure 34. Global Dicing Machine for Semiconductor Wafers Revenue Market Share by Application (2017-2028)
Figure 35. Global Dicing Machine for Semiconductor Wafers Price by Application (2017-2028) & (US$/Unit)
Figure 36. North America Dicing Machine for Semiconductor Wafers Sales Market Share by Type (2017-2028)
Figure 37. North America Dicing Machine for Semiconductor Wafers Sales Market Share by Application (2017-2028)
Figure 38. North America Dicing Machine for Semiconductor Wafers Sales Market Share by Country (2017-2028)
Figure 39. North America Dicing Machine for Semiconductor Wafers Revenue Market Share by Country (2017-2028)
Figure 40. United States Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 41. Canada Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 42. Mexico Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 43. Europe Dicing Machine for Semiconductor Wafers Sales Market Share by Type (2017-2028)
Figure 44. Europe Dicing Machine for Semiconductor Wafers Sales Market Share by Application (2017-2028)
Figure 45. Europe Dicing Machine for Semiconductor Wafers Sales Market Share by Country (2017-2028)
Figure 46. Europe Dicing Machine for Semiconductor Wafers Revenue Market Share by Country (2017-2028)
Figure 47. Germany Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 48. France Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 49. United Kingdom Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 50. Russia Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 51. Italy Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 52. Asia-Pacific Dicing Machine for Semiconductor Wafers Sales Market Share by Region (2017-2028)
Figure 53. Asia-Pacific Dicing Machine for Semiconductor Wafers Sales Market Share by Application (2017-2028)
Figure 54. Asia-Pacific Dicing Machine for Semiconductor Wafers Sales Market Share by Region (2017-2028)
Figure 55. Asia-Pacific Dicing Machine for Semiconductor Wafers Revenue Market Share by Region (2017-2028)
Figure 56. China Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 57. Japan Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 58. Korea Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 59. India Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 60. Southeast Asia Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 61. Australia Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 62. South America Dicing Machine for Semiconductor Wafers Sales Market Share by Type (2017-2028)
Figure 63. South America Dicing Machine for Semiconductor Wafers Sales Market Share by Application (2017-2028)
Figure 64. South America Dicing Machine for Semiconductor Wafers Sales Market Share by Country (2017-2028)
Figure 65. South America Dicing Machine for Semiconductor Wafers Revenue Market Share by Country (2017-2028)
Figure 66. Brazil Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 67. Argentina Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 68. Middle East & Africa Dicing Machine for Semiconductor Wafers Sales Market Share by Type (2017-2028)
Figure 69. Middle East & Africa Dicing Machine for Semiconductor Wafers Sales Market Share by Application (2017-2028)
Figure 70. Middle East & Africa Dicing Machine for Semiconductor Wafers Sales Market Share by Region (2017-2028)
Figure 71. Middle East & Africa Dicing Machine for Semiconductor Wafers Revenue Market Share by Region (2017-2028)
Figure 72. Turkey Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 73. Egypt Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 74. Saudi Arabia Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 75. South Africa Dicing Machine for Semiconductor Wafers Revenue and Growth Rate (2017-2028) & (USD Million)
Figure 76. Manufacturing Cost Structure Analysis of Dicing Machine for Semiconductor Wafers in 2021
Figure 77. Manufacturing Process Analysis of Dicing Machine for Semiconductor Wafers
Figure 78. Dicing Machine for Semiconductor Wafers Industrial Chain
Figure 79. Sales Channel: Direct Channel vs Indirect Channel
Figure 80. Methodology
Figure 81. Research Process and Data Source


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