半導体チップパッケージングテストソケットのグローバル市場展望 2023年-2029年:バーンインソケット、テストソケット

■ 英語タイトル:Semiconductor Chip Packaging Test Socket Market, Global Outlook and Forecast 2023-2029

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★グローバルリサーチ資料[半導体チップパッケージングテストソケットのグローバル市場展望 2023年-2029年:バーンインソケット、テストソケット]についてメールでお問い合わせはこちら
*** レポート概要(サマリー)***

当調査レポートは次の情報を含め、世界の半導体チップパッケージングテストソケット市場規模と予測を収録しています。・世界の半導体チップパッケージングテストソケット市場:売上、2018年-2023年、2024年-2029年
・世界の半導体チップパッケージングテストソケット市場:販売量、2018年-2023年、2024年-2029年
・世界のトップ5企業、2022年

世界の半導体チップパッケージングテストソケット市場は2022年に000Mドルと評価され、予測期間中に000%のCAGRで2029年までに000Mドルに達すると予測されています。米国市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「バーンインソケット」セグメントは今後6年間、000%のCAGRで2029年までに000Mドルに成長すると予測されています。

半導体チップパッケージングテストソケットのグローバル主要企業は、Yamaichi Electronics、 LEENO、 Cohu、 ISC、 Smiths Interconnect、 Enplas、 Sensata Technologies、 Johnstech、 Yokowo、 WinWay Technology、 Loranger、 Plastronics、 OKins Electronics、 Qualmax、 Ironwood Electronics、 3M、 M Specialties、 Aries Electronics、 Emulation Technology、 Seiken Co., Ltd.、 TESPRO、 MJC、 Essai (Advantest)、 Rika Denshi、 Robson Technologies、 Test Tooling、 Exatron、 JF Technology、 Gold Technologies、 Ardent Conceptsなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。

MARKET MONITOR GLOBAL(MMG)は、半導体チップパッケージングテストソケットのメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。

【セグメント別市場分析】

世界の半導体チップパッケージングテストソケット市場:タイプ別、2018年-2023年、2024年-2029年
世界の半導体チップパッケージングテストソケット市場:タイプ別市場シェア、2022年
・バーンインソケット、テストソケット

世界の半導体チップパッケージングテストソケット市場:用途別、2018年-2023年、2024年-2029年
世界の半導体チップパッケージングテストソケット市場:用途別市場シェア、2022年
・チップ設計工場、IDMエンタープライズ、ウェーハファウンドリ、パッケージング&テスト工場、その他

世界の半導体チップパッケージングテストソケット市場:地域・国別、2018年-2023年、2024年-2029年
世界の半導体チップパッケージングテストソケット市場:地域別市場シェア、2022年
・北米:アメリカ、カナダ、メキシコ
・ヨーロッパ:ドイツ、フランス、イギリス、イタリア、ロシア
・アジア:中国、日本、韓国、東南アジア、インド
・南米:ブラジル、アルゼンチン
・中東・アフリカ:トルコ、イスラエル、サウジアラビア、UAE

【競合分析】

また、当レポートは主要な市場参加者の分析を提供します。
・主要企業における半導体チップパッケージングテストソケットのグローバル売上、2018年-2023年
・主要企業における半導体チップパッケージングテストソケットのグローバル売上シェア、2022年
・主要企業における半導体チップパッケージングテストソケットのグローバル販売量、2018年-2023年
・主要企業における半導体チップパッケージングテストソケットのグローバル販売量シェア、2022年

さらに、当レポートは主要企業のプロファイルを提示します。
Yamaichi Electronics、 LEENO、 Cohu、 ISC、 Smiths Interconnect、 Enplas、 Sensata Technologies、 Johnstech、 Yokowo、 WinWay Technology、 Loranger、 Plastronics、 OKins Electronics、 Qualmax、 Ironwood Electronics、 3M、 M Specialties、 Aries Electronics、 Emulation Technology、 Seiken Co., Ltd.、 TESPRO、 MJC、 Essai (Advantest)、 Rika Denshi、 Robson Technologies、 Test Tooling、 Exatron、 JF Technology、 Gold Technologies、 Ardent Concepts

*************************************************************

・調査・分析レポートの概要
半導体チップパッケージングテストソケット市場の定義
市場セグメント
世界の半導体チップパッケージングテストソケット市場概要
当レポートの特徴・ベネフィット
調査手法と情報源

・世界の半導体チップパッケージングテストソケット市場規模
世界の半導体チップパッケージングテストソケット市場規模:2022年 VS 2029年
世界の半導体チップパッケージングテストソケット市場規模と予測 2018年-2029年

・競争状況
グローバルトップ企業
売上ベースでのグローバルトップ企業
企業別グローバルでの半導体チップパッケージングテストソケットの売上
グローバルトップ3およびトップ5企業、2022年売上ベース
グローバル企業の半導体チップパッケージングテストソケット製品タイプ
グローバルにおけるティア1、ティア2、ティア3企業

・タイプ別市場分析
タイプ区分:バーンインソケット、テストソケット
半導体チップパッケージングテストソケットのタイプ別グローバル売上・予測

・用途別市場分析
用途区分:チップ設計工場、IDMエンタープライズ、ウェーハファウンドリ、パッケージング&テスト工場、その他
半導体チップパッケージングテストソケットの用途別グローバル売上・予測

・地域別市場分析
地域別半導体チップパッケージングテストソケット市場規模 2022年と2029年
地域別半導体チップパッケージングテストソケット売上・予測
北米市場:アメリカ、カナダ、メキシコ
ヨーロッパ市場:ドイツ、フランス、イギリス、イタリア、ロシア
アジア市場:中国、日本、韓国、東南アジア、インド
南米市場:ブラジル、アルゼンチン
中東・アフリカ市場:トルコ、イスラエル、サウジアラビア、UAE

・主要企業のプロファイル(企業概要、事業概要、主要製品、売上、ニュースなど)
Yamaichi Electronics、 LEENO、 Cohu、 ISC、 Smiths Interconnect、 Enplas、 Sensata Technologies、 Johnstech、 Yokowo、 WinWay Technology、 Loranger、 Plastronics、 OKins Electronics、 Qualmax、 Ironwood Electronics、 3M、 M Specialties、 Aries Electronics、 Emulation Technology、 Seiken Co., Ltd.、 TESPRO、 MJC、 Essai (Advantest)、 Rika Denshi、 Robson Technologies、 Test Tooling、 Exatron、 JF Technology、 Gold Technologies、 Ardent Concepts
...

A test socket is a custom-designed electro-mechanical interface that delivers extremely clean electrical signal paths to connect the chip to the ATE.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Chip Packaging Test Socket, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Chip Packaging Test Socket. This report contains market size and forecasts of Semiconductor Chip Packaging Test Socket in global, including the following market information:
Global Semiconductor Chip Packaging Test Socket Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Semiconductor Chip Packaging Test Socket Market Sales, 2018-2023, 2024-2029, (K Units)
Global top five Semiconductor Chip Packaging Test Socket companies in 2022 (%)
The global Semiconductor Chip Packaging Test Socket market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Burn-in Socket Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Semiconductor Chip Packaging Test Socket include Yamaichi Electronics, LEENO, Cohu, ISC, Smiths Interconnect, Enplas, Sensata Technologies, Johnstech and Yokowo, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Semiconductor Chip Packaging Test Socket manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Chip Packaging Test Socket Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Semiconductor Chip Packaging Test Socket Market Segment Percentages, by Type, 2022 (%)
Burn-in Socket
Test Socket
Global Semiconductor Chip Packaging Test Socket Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Semiconductor Chip Packaging Test Socket Market Segment Percentages, by Application, 2022 (%)
Chip Design Factory
IDM Enterprises
Wafer Foundry
Packaging and Testing Plant
Others
Global Semiconductor Chip Packaging Test Socket Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Semiconductor Chip Packaging Test Socket Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Chip Packaging Test Socket revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Semiconductor Chip Packaging Test Socket revenues share in global market, 2022 (%)
Key companies Semiconductor Chip Packaging Test Socket sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Semiconductor Chip Packaging Test Socket sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Yamaichi Electronics
LEENO
Cohu
ISC
Smiths Interconnect
Enplas
Sensata Technologies
Johnstech
Yokowo
WinWay Technology
Loranger
Plastronics
OKins Electronics
Qualmax
Ironwood Electronics
3M
M Specialties
Aries Electronics
Emulation Technology
Seiken Co., Ltd.
TESPRO
MJC
Essai (Advantest)
Rika Denshi
Robson Technologies
Test Tooling
Exatron
JF Technology
Gold Technologies
Ardent Concepts
Outline of Major Chapters:
Chapter 1: Introduces the definition of Semiconductor Chip Packaging Test Socket, market overview.
Chapter 2: Global Semiconductor Chip Packaging Test Socket market size in revenue and volume.
Chapter 3: Detailed analysis of Semiconductor Chip Packaging Test Socket manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Semiconductor Chip Packaging Test Socket in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Semiconductor Chip Packaging Test Socket capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

*** レポート目次(コンテンツ)***

1 Introduction to Research & Analysis Reports
1.1 Semiconductor Chip Packaging Test Socket Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Semiconductor Chip Packaging Test Socket Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Semiconductor Chip Packaging Test Socket Overall Market Size
2.1 Global Semiconductor Chip Packaging Test Socket Market Size: 2022 VS 2029
2.2 Global Semiconductor Chip Packaging Test Socket Revenue, Prospects & Forecasts: 2018-2029
2.3 Global Semiconductor Chip Packaging Test Socket Sales: 2018-2029
3 Company Landscape
3.1 Top Semiconductor Chip Packaging Test Socket Players in Global Market
3.2 Top Global Semiconductor Chip Packaging Test Socket Companies Ranked by Revenue
3.3 Global Semiconductor Chip Packaging Test Socket Revenue by Companies
3.4 Global Semiconductor Chip Packaging Test Socket Sales by Companies
3.5 Global Semiconductor Chip Packaging Test Socket Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 Semiconductor Chip Packaging Test Socket Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers Semiconductor Chip Packaging Test Socket Product Type
3.8 Tier 1, Tier 2 and Tier 3 Semiconductor Chip Packaging Test Socket Players in Global Market
3.8.1 List of Global Tier 1 Semiconductor Chip Packaging Test Socket Companies
3.8.2 List of Global Tier 2 and Tier 3 Semiconductor Chip Packaging Test Socket Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global Semiconductor Chip Packaging Test Socket Market Size Markets, 2022 & 2029
4.1.2 Burn-in Socket
4.1.3 Test Socket
4.2 By Type – Global Semiconductor Chip Packaging Test Socket Revenue & Forecasts
4.2.1 By Type – Global Semiconductor Chip Packaging Test Socket Revenue, 2018-2023
4.2.2 By Type – Global Semiconductor Chip Packaging Test Socket Revenue, 2024-2029
4.2.3 By Type – Global Semiconductor Chip Packaging Test Socket Revenue Market Share, 2018-2029
4.3 By Type – Global Semiconductor Chip Packaging Test Socket Sales & Forecasts
4.3.1 By Type – Global Semiconductor Chip Packaging Test Socket Sales, 2018-2023
4.3.2 By Type – Global Semiconductor Chip Packaging Test Socket Sales, 2024-2029
4.3.3 By Type – Global Semiconductor Chip Packaging Test Socket Sales Market Share, 2018-2029
4.4 By Type – Global Semiconductor Chip Packaging Test Socket Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global Semiconductor Chip Packaging Test Socket Market Size, 2022 & 2029
5.1.2 Chip Design Factory
5.1.3 IDM Enterprises
5.1.4 Wafer Foundry
5.1.5 Packaging and Testing Plant
5.1.6 Others
5.2 By Application – Global Semiconductor Chip Packaging Test Socket Revenue & Forecasts
5.2.1 By Application – Global Semiconductor Chip Packaging Test Socket Revenue, 2018-2023
5.2.2 By Application – Global Semiconductor Chip Packaging Test Socket Revenue, 2024-2029
5.2.3 By Application – Global Semiconductor Chip Packaging Test Socket Revenue Market Share, 2018-2029
5.3 By Application – Global Semiconductor Chip Packaging Test Socket Sales & Forecasts
5.3.1 By Application – Global Semiconductor Chip Packaging Test Socket Sales, 2018-2023
5.3.2 By Application – Global Semiconductor Chip Packaging Test Socket Sales, 2024-2029
5.3.3 By Application – Global Semiconductor Chip Packaging Test Socket Sales Market Share, 2018-2029
5.4 By Application – Global Semiconductor Chip Packaging Test Socket Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region – Global Semiconductor Chip Packaging Test Socket Market Size, 2022 & 2029
6.2 By Region – Global Semiconductor Chip Packaging Test Socket Revenue & Forecasts
6.2.1 By Region – Global Semiconductor Chip Packaging Test Socket Revenue, 2018-2023
6.2.2 By Region – Global Semiconductor Chip Packaging Test Socket Revenue, 2024-2029
6.2.3 By Region – Global Semiconductor Chip Packaging Test Socket Revenue Market Share, 2018-2029
6.3 By Region – Global Semiconductor Chip Packaging Test Socket Sales & Forecasts
6.3.1 By Region – Global Semiconductor Chip Packaging Test Socket Sales, 2018-2023
6.3.2 By Region – Global Semiconductor Chip Packaging Test Socket Sales, 2024-2029
6.3.3 By Region – Global Semiconductor Chip Packaging Test Socket Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country – North America Semiconductor Chip Packaging Test Socket Revenue, 2018-2029
6.4.2 By Country – North America Semiconductor Chip Packaging Test Socket Sales, 2018-2029
6.4.3 US Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.4.4 Canada Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.4.5 Mexico Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.5 Europe
6.5.1 By Country – Europe Semiconductor Chip Packaging Test Socket Revenue, 2018-2029
6.5.2 By Country – Europe Semiconductor Chip Packaging Test Socket Sales, 2018-2029
6.5.3 Germany Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.5.4 France Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.5.5 U.K. Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.5.6 Italy Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.5.7 Russia Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.5.8 Nordic Countries Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.5.9 Benelux Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.6 Asia
6.6.1 By Region – Asia Semiconductor Chip Packaging Test Socket Revenue, 2018-2029
6.6.2 By Region – Asia Semiconductor Chip Packaging Test Socket Sales, 2018-2029
6.6.3 China Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.6.4 Japan Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.6.5 South Korea Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.6.6 Southeast Asia Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.6.7 India Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.7 South America
6.7.1 By Country – South America Semiconductor Chip Packaging Test Socket Revenue, 2018-2029
6.7.2 By Country – South America Semiconductor Chip Packaging Test Socket Sales, 2018-2029
6.7.3 Brazil Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.7.4 Argentina Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa Semiconductor Chip Packaging Test Socket Revenue, 2018-2029
6.8.2 By Country – Middle East & Africa Semiconductor Chip Packaging Test Socket Sales, 2018-2029
6.8.3 Turkey Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.8.4 Israel Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.8.5 Saudi Arabia Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
6.8.6 UAE Semiconductor Chip Packaging Test Socket Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 Yamaichi Electronics
7.1.1 Yamaichi Electronics Company Summary
7.1.2 Yamaichi Electronics Business Overview
7.1.3 Yamaichi Electronics Semiconductor Chip Packaging Test Socket Major Product Offerings
7.1.4 Yamaichi Electronics Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.1.5 Yamaichi Electronics Key News & Latest Developments
7.2 LEENO
7.2.1 LEENO Company Summary
7.2.2 LEENO Business Overview
7.2.3 LEENO Semiconductor Chip Packaging Test Socket Major Product Offerings
7.2.4 LEENO Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.2.5 LEENO Key News & Latest Developments
7.3 Cohu
7.3.1 Cohu Company Summary
7.3.2 Cohu Business Overview
7.3.3 Cohu Semiconductor Chip Packaging Test Socket Major Product Offerings
7.3.4 Cohu Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.3.5 Cohu Key News & Latest Developments
7.4 ISC
7.4.1 ISC Company Summary
7.4.2 ISC Business Overview
7.4.3 ISC Semiconductor Chip Packaging Test Socket Major Product Offerings
7.4.4 ISC Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.4.5 ISC Key News & Latest Developments
7.5 Smiths Interconnect
7.5.1 Smiths Interconnect Company Summary
7.5.2 Smiths Interconnect Business Overview
7.5.3 Smiths Interconnect Semiconductor Chip Packaging Test Socket Major Product Offerings
7.5.4 Smiths Interconnect Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.5.5 Smiths Interconnect Key News & Latest Developments
7.6 Enplas
7.6.1 Enplas Company Summary
7.6.2 Enplas Business Overview
7.6.3 Enplas Semiconductor Chip Packaging Test Socket Major Product Offerings
7.6.4 Enplas Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.6.5 Enplas Key News & Latest Developments
7.7 Sensata Technologies
7.7.1 Sensata Technologies Company Summary
7.7.2 Sensata Technologies Business Overview
7.7.3 Sensata Technologies Semiconductor Chip Packaging Test Socket Major Product Offerings
7.7.4 Sensata Technologies Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.7.5 Sensata Technologies Key News & Latest Developments
7.8 Johnstech
7.8.1 Johnstech Company Summary
7.8.2 Johnstech Business Overview
7.8.3 Johnstech Semiconductor Chip Packaging Test Socket Major Product Offerings
7.8.4 Johnstech Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.8.5 Johnstech Key News & Latest Developments
7.9 Yokowo
7.9.1 Yokowo Company Summary
7.9.2 Yokowo Business Overview
7.9.3 Yokowo Semiconductor Chip Packaging Test Socket Major Product Offerings
7.9.4 Yokowo Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.9.5 Yokowo Key News & Latest Developments
7.10 WinWay Technology
7.10.1 WinWay Technology Company Summary
7.10.2 WinWay Technology Business Overview
7.10.3 WinWay Technology Semiconductor Chip Packaging Test Socket Major Product Offerings
7.10.4 WinWay Technology Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.10.5 WinWay Technology Key News & Latest Developments
7.11 Loranger
7.11.1 Loranger Company Summary
7.11.2 Loranger Semiconductor Chip Packaging Test Socket Business Overview
7.11.3 Loranger Semiconductor Chip Packaging Test Socket Major Product Offerings
7.11.4 Loranger Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.11.5 Loranger Key News & Latest Developments
7.12 Plastronics
7.12.1 Plastronics Company Summary
7.12.2 Plastronics Semiconductor Chip Packaging Test Socket Business Overview
7.12.3 Plastronics Semiconductor Chip Packaging Test Socket Major Product Offerings
7.12.4 Plastronics Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.12.5 Plastronics Key News & Latest Developments
7.13 OKins Electronics
7.13.1 OKins Electronics Company Summary
7.13.2 OKins Electronics Semiconductor Chip Packaging Test Socket Business Overview
7.13.3 OKins Electronics Semiconductor Chip Packaging Test Socket Major Product Offerings
7.13.4 OKins Electronics Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.13.5 OKins Electronics Key News & Latest Developments
7.14 Qualmax
7.14.1 Qualmax Company Summary
7.14.2 Qualmax Business Overview
7.14.3 Qualmax Semiconductor Chip Packaging Test Socket Major Product Offerings
7.14.4 Qualmax Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.14.5 Qualmax Key News & Latest Developments
7.15 Ironwood Electronics
7.15.1 Ironwood Electronics Company Summary
7.15.2 Ironwood Electronics Business Overview
7.15.3 Ironwood Electronics Semiconductor Chip Packaging Test Socket Major Product Offerings
7.15.4 Ironwood Electronics Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.15.5 Ironwood Electronics Key News & Latest Developments
7.16 3M
7.16.1 3M Company Summary
7.16.2 3M Business Overview
7.16.3 3M Semiconductor Chip Packaging Test Socket Major Product Offerings
7.16.4 3M Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.16.5 3M Key News & Latest Developments
7.17 M Specialties
7.17.1 M Specialties Company Summary
7.17.2 M Specialties Business Overview
7.17.3 M Specialties Semiconductor Chip Packaging Test Socket Major Product Offerings
7.17.4 M Specialties Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.17.5 M Specialties Key News & Latest Developments
7.18 Aries Electronics
7.18.1 Aries Electronics Company Summary
7.18.2 Aries Electronics Business Overview
7.18.3 Aries Electronics Semiconductor Chip Packaging Test Socket Major Product Offerings
7.18.4 Aries Electronics Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.18.5 Aries Electronics Key News & Latest Developments
7.19 Emulation Technology
7.19.1 Emulation Technology Company Summary
7.19.2 Emulation Technology Business Overview
7.19.3 Emulation Technology Semiconductor Chip Packaging Test Socket Major Product Offerings
7.19.4 Emulation Technology Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.19.5 Emulation Technology Key News & Latest Developments
7.20 Seiken Co., Ltd.
7.20.1 Seiken Co., Ltd. Company Summary
7.20.2 Seiken Co., Ltd. Business Overview
7.20.3 Seiken Co., Ltd. Semiconductor Chip Packaging Test Socket Major Product Offerings
7.20.4 Seiken Co., Ltd. Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.20.5 Seiken Co., Ltd. Key News & Latest Developments
7.21 TESPRO
7.21.1 TESPRO Company Summary
7.21.2 TESPRO Business Overview
7.21.3 TESPRO Semiconductor Chip Packaging Test Socket Major Product Offerings
7.21.4 TESPRO Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.21.5 TESPRO Key News & Latest Developments
7.22 MJC
7.22.1 MJC Company Summary
7.22.2 MJC Business Overview
7.22.3 MJC Semiconductor Chip Packaging Test Socket Major Product Offerings
7.22.4 MJC Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.22.5 MJC Key News & Latest Developments
7.23 Essai (Advantest)
7.23.1 Essai (Advantest) Company Summary
7.23.2 Essai (Advantest) Business Overview
7.23.3 Essai (Advantest) Semiconductor Chip Packaging Test Socket Major Product Offerings
7.23.4 Essai (Advantest) Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.23.5 Essai (Advantest) Key News & Latest Developments
7.24 Rika Denshi
7.24.1 Rika Denshi Company Summary
7.24.2 Rika Denshi Business Overview
7.24.3 Rika Denshi Semiconductor Chip Packaging Test Socket Major Product Offerings
7.24.4 Rika Denshi Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.24.5 Rika Denshi Key News & Latest Developments
7.25 Robson Technologies
7.25.1 Robson Technologies Company Summary
7.25.2 Robson Technologies Business Overview
7.25.3 Robson Technologies Semiconductor Chip Packaging Test Socket Major Product Offerings
7.25.4 Robson Technologies Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.25.5 Robson Technologies Key News & Latest Developments
7.26 Test Tooling
7.26.1 Test Tooling Company Summary
7.26.2 Test Tooling Business Overview
7.26.3 Test Tooling Semiconductor Chip Packaging Test Socket Major Product Offerings
7.26.4 Test Tooling Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.26.5 Test Tooling Key News & Latest Developments
7.27 Exatron
7.27.1 Exatron Company Summary
7.27.2 Exatron Business Overview
7.27.3 Exatron Semiconductor Chip Packaging Test Socket Major Product Offerings
7.27.4 Exatron Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.27.5 Exatron Key News & Latest Developments
7.28 JF Technology
7.28.1 JF Technology Company Summary
7.28.2 JF Technology Business Overview
7.28.3 JF Technology Semiconductor Chip Packaging Test Socket Major Product Offerings
7.28.4 JF Technology Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.28.5 JF Technology Key News & Latest Developments
7.29 Gold Technologies
7.29.1 Gold Technologies Company Summary
7.29.2 Gold Technologies Business Overview
7.29.3 Gold Technologies Semiconductor Chip Packaging Test Socket Major Product Offerings
7.29.4 Gold Technologies Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.29.5 Gold Technologies Key News & Latest Developments
7.30 Ardent Concepts
7.30.1 Ardent Concepts Company Summary
7.30.2 Ardent Concepts Business Overview
7.30.3 Ardent Concepts Semiconductor Chip Packaging Test Socket Major Product Offerings
7.30.4 Ardent Concepts Semiconductor Chip Packaging Test Socket Sales and Revenue in Global (2018-2023)
7.30.5 Ardent Concepts Key News & Latest Developments
8 Global Semiconductor Chip Packaging Test Socket Production Capacity, Analysis
8.1 Global Semiconductor Chip Packaging Test Socket Production Capacity, 2018-2029
8.2 Semiconductor Chip Packaging Test Socket Production Capacity of Key Manufacturers in Global Market
8.3 Global Semiconductor Chip Packaging Test Socket Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Semiconductor Chip Packaging Test Socket Supply Chain Analysis
10.1 Semiconductor Chip Packaging Test Socket Industry Value Chain
10.2 Semiconductor Chip Packaging Test Socket Upstream Market
10.3 Semiconductor Chip Packaging Test Socket Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Semiconductor Chip Packaging Test Socket Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer



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