カテゴリ： IT/電子, LP Information, 世界

放射線硬化型電子デバイス・部品のグローバル市場予測2023-2029

■ 英語タイトル：Global Radiation Hardened Electronic Devices and Components Market Growth 2023-2029
	■ 発行会社/調査会社：LP Information ■ 商品コード：LP23JU3188 ■ 発行日：2023年5月 ■ 調査対象地域：グローバル、日本、アメリカ、ヨーロッパ、アジア、中国など ■ 産業分野：電子＆半導体 ■ ページ数：115 ■ レポート言語：英語 ■ レポート形式：PDF ■ 納品方式：Eメール（受注後2-3営業日）

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*** レポート概要（サマリー）***

LP Informationの最新刊調査レポート「放射線硬化型電子デバイス・部品のグローバル市場」は、過去の販売実績から2022年の世界の放射線硬化型電子デバイス・部品の総販売量を検討し、2023年から2029年の予測される放射線硬化型電子デバイス・部品の販売量を地域別・市場分野別に包括的に分析しています。本調査レポートでは、地域別、市場分野別、サブセクター別の放射線硬化型電子デバイス・部品の市場規模を掲載し、XXX百万米ドル規模の世界の放射線硬化型電子デバイス・部品市場の詳細な分析を提供します。本インサイトレポートは、世界の放射線硬化型電子デバイス・部品業界を包括的に分析し、製品セグメント、企業情報、売上、市場シェア、最新動向、M&A活動に関する主要トレンドを明らかにしています。
また、本レポートでは、加速する世界の放射線硬化型電子デバイス・部品市場における各社の独自のポジションをより深く理解するために、放射線硬化型電子デバイス・部品製品ポートフォリオ、能力、市場参入戦略、市場でのポジション、海外展開に焦点を当て、主要なグローバル企業の戦略を分析しています。

世界の放射線硬化型電子デバイス・部品市場規模は、2022年のXXX百万米ドルから2029年にはXXX百万米ドルに成長すると予測され、2023年から2029年までの年平均成長率は000%と予測されます。放射線硬化型電子デバイス・部品の米国市場は、2022年のXXX百万米ドルから2029年にはXXX百万米ドルに増加し、2023年から2029年までのCAGRは000％と予測されています。放射線硬化型電子デバイス・部品の中国市場は、2023年から2029年までの年平均000％成長率で、2022年のXXX百万米ドルから2029年にはXXX百万米ドルに増加すると推定されます。放射線硬化型電子デバイス・部品のヨーロッパ市場は、2023年から2029年にかけて年平均000％成長率で、2022年のXXX百万米ドルから2029年にはXXX百万米ドルに増加すると推定されています。

放射線硬化型電子デバイス・部品の世界主要メーカーとしては、Honeywell International Inc.、 BAE Systems、 STMicroelectronics、 Microchip Technology Inc.、 Renesas Electronics Corporation、 Infineon Technologies AG、 Texas Instruments、 Xilinx、 Analog Devices, Inc.、 Cobham Limited、 Data Device Corporation(DDC)、 Solid State Devices, Inc.、 Micropac Industries, Inc.、 Anaren、 Maxwell Technologies Inc.、 Microsemiなどを掲載しており、売上の面では、世界の2大企業が2022年にほぼ000％のシェアを占めています。

本レポートでは、製品タイプ、用途、主要メーカー、主要地域、国別の放射線硬化型電子デバイス・部品市場の包括的な概要、市場シェア、成長機会などの情報を提供しています。

【市場セグメンテーション】

この調査では放射線硬化型電子デバイス・部品市場をセグメンテーションし、種類別 (シリコン、炭化ケイ素、窒化ガリウム、水素化アモルファスシリコン)、用途別 (航空宇宙、軍事、原子力、医療、家電、その他)、および地域別 (アジア太平洋、南北アメリカ、ヨーロッパ、および中東・アフリカ) の市場規模を予測しています。

・種類別区分：シリコン、炭化ケイ素、窒化ガリウム、水素化アモルファスシリコン

・用途別区分：航空宇宙、軍事、原子力、医療、家電、その他

・地域別区分
南北アメリカ（米国、カナダ、メキシコ、ブラジル）
アジア太平洋（中国、日本、韓国、東南アジア、インド、オーストラリア）
ヨーロッパ（ドイツ、フランス、イギリス、イタリア、ロシア）
中東・アフリカ（エジプト、南アフリカ、イスラエル、トルコ、GCC諸国）

【本レポートで扱う主な質問】

・世界の放射線硬化型電子デバイス・部品市場の10年間の市場状況・展望は？
・世界および地域別に見た放射線硬化型電子デバイス・部品市場成長の要因は何か？
・放射線硬化型電子デバイス・部品の市場機会はエンドマーケットの規模によってどのように変化するのか？
・放射線硬化型電子デバイス・部品のタイプ別、用途別の内訳は？
・新型コロナウイルスとロシア・ウクライナ戦争の影響は？

********* 目次 *********

レポートの範囲
・市場の紹介
・分析対象期間
・調査の目的
・調査手法
・調査プロセスおよびデータソース
・経済指標
・通貨

エグゼクティブサマリー
・世界市場の概要：放射線硬化型電子デバイス・部品の年間販売量2018-2029、地域別現状・将来分析
・放射線硬化型電子デバイス・部品の種類別セグメント：シリコン、炭化ケイ素、窒化ガリウム、水素化アモルファスシリコン
・放射線硬化型電子デバイス・部品の種類別販売量：2018-2023年の販売量、売上、市場シェア、販売価格
・放射線硬化型電子デバイス・部品の用途別セグメント：航空宇宙、軍事、原子力、医療、家電、その他
・放射線硬化型電子デバイス・部品の用途別販売量：2018-2023年の販売量、売上、市場シェア、販売価格

企業別世界の放射線硬化型電子デバイス・部品市場
・企業別のグローバル放射線硬化型電子デバイス・部品市場データ：2018-2023年の年間販売量、市場シェア
・企業別の放射線硬化型電子デバイス・部品の年間売上：2018-2023年の売上、市場シェア
・企業別の放射線硬化型電子デバイス・部品販売価格
・主要企業の放射線硬化型電子デバイス・部品生産地域、販売地域、製品タイプ
・市場集中度分析
・新製品および潜在的な参加者
・合併と買収、拡大

放射線硬化型電子デバイス・部品の地域別レビュー
・地域別の放射線硬化型電子デバイス・部品市場規模2018-2023：年間販売量、売上
・主要国別の放射線硬化型電子デバイス・部品市場規模2018-2023：年間販売量、売上
・南北アメリカの放射線硬化型電子デバイス・部品販売の成長
・アジア太平洋の放射線硬化型電子デバイス・部品販売の成長
・ヨーロッパの放射線硬化型電子デバイス・部品販売の成長
・中東・アフリカの放射線硬化型電子デバイス・部品販売の成長

南北アメリカ市場
・南北アメリカの国別の放射線硬化型電子デバイス・部品販売量、売上（2018-2023）
・南北アメリカの放射線硬化型電子デバイス・部品の種類別販売量
・南北アメリカの放射線硬化型電子デバイス・部品の用途別販売量
・米国市場
・カナダ市場
・メキシコ市場
・ブラジル市場

アジア太平洋市場
・アジア太平洋の国別の放射線硬化型電子デバイス・部品販売量、売上（2018-2023）
・アジア太平洋の放射線硬化型電子デバイス・部品の種類別販売量
・アジア太平洋の放射線硬化型電子デバイス・部品の用途別販売量
・中国市場
・日本市場
・韓国市場
・東南アジア市場
・インド市場
・オーストラリア市場
・台湾市場

ヨーロッパ市場
・ヨーロッパの国別の放射線硬化型電子デバイス・部品販売量、売上（2018-2023）
・ヨーロッパの放射線硬化型電子デバイス・部品の種類別販売量
・ヨーロッパの放射線硬化型電子デバイス・部品の用途別販売量
・ドイツ市場
・フランス市場
・イギリス市場
・イタリア市場
・ロシア市場

中東・アフリカ市場
・中東・アフリカの国別の放射線硬化型電子デバイス・部品販売量、売上（2018-2023）
・中東・アフリカの放射線硬化型電子デバイス・部品の種類別販売量
・中東・アフリカの放射線硬化型電子デバイス・部品の用途別販売量
・エジプト市場
・南アフリカ市場
・イスラエル市場
・トルコ市場
・GCC諸国市場

市場の成長要因、課題、動向
・市場の成長要因および成長機会分析
・市場の課題およびリスク
・市場動向

製造コスト構造分析
・原材料とサプライヤー
・放射線硬化型電子デバイス・部品の製造コスト構造分析
・放射線硬化型電子デバイス・部品の製造プロセス分析
・放射線硬化型電子デバイス・部品の産業チェーン構造

マーケティング、販売業者および顧客
・販売チャンネル：直接販売チャンネル、間接販売チャンネル
・放射線硬化型電子デバイス・部品の主要なグローバル販売業者
・放射線硬化型電子デバイス・部品の主要なグローバル顧客

地域別の放射線硬化型電子デバイス・部品市場予測レビュー
・地域別の放射線硬化型電子デバイス・部品市場規模予測（2024-2029）
・南北アメリカの国別予測
・アジア太平洋の国別予測
・ヨーロッパの国別予測
・放射線硬化型電子デバイス・部品の種類別市場規模予測
・放射線硬化型電子デバイス・部品の用途別市場規模予測

主要企業分析
Honeywell International Inc.、 BAE Systems、 STMicroelectronics、 Microchip Technology Inc.、 Renesas Electronics Corporation、 Infineon Technologies AG、 Texas Instruments、 Xilinx、 Analog Devices, Inc.、 Cobham Limited、 Data Device Corporation(DDC)、 Solid State Devices, Inc.、 Micropac Industries, Inc.、 Anaren、 Maxwell Technologies Inc.、 Microsemi
・企業情報
・放射線硬化型電子デバイス・部品製品
・放射線硬化型電子デバイス・部品販売量、売上、価格、粗利益（2018-2023）
・主要ビジネス概要
・最新動向

調査結果および結論

Radiation Hardened Electronic Devices and Components involve production of electronic components by hardening through radiation.
LPI (LP Information)’ newest research report, the “Radiation Hardened Electronic Devices and Components Industry Forecast” looks at past sales and reviews total world Radiation Hardened Electronic Devices and Components sales in 2022, providing a comprehensive analysis by region and market sector of projected Radiation Hardened Electronic Devices and Components sales for 2023 through 2029. With Radiation Hardened Electronic Devices and Components sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Radiation Hardened Electronic Devices and Components industry.
This Insight Report provides a comprehensive analysis of the global Radiation Hardened Electronic Devices and Components landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Radiation Hardened Electronic Devices and Components portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Radiation Hardened Electronic Devices and Components market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Radiation Hardened Electronic Devices and Components and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Radiation Hardened Electronic Devices and Components.
The global Radiation Hardened Electronic Devices and Components market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.
United States market for Radiation Hardened Electronic Devices and Components is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
China market for Radiation Hardened Electronic Devices and Components is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Europe market for Radiation Hardened Electronic Devices and Components is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Global key Radiation Hardened Electronic Devices and Components players cover Honeywell International Inc., BAE Systems, STMicroelectronics, Microchip Technology Inc., Renesas Electronics Corporation, Infineon Technologies AG, Texas Instruments, Xilinx and Analog Devices, Inc., etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.
This report presents a comprehensive overview, market shares, and growth opportunities of Radiation Hardened Electronic Devices and Components market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
by Materials
Silicon
Silicon Carbide
Gallium Nitride
Hydrogenated Amorphous Silicon
by Products
Analog And Mixed Signal/ Digital Electronic Devices
Discrete Semiconductors
Optoelectronics
Power Management
Sensors
Memory
Others
Segmentation by application
Aerospace
Military
Nuclear
Medical
Consumer Electronics
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company’s coverage, product portfolio, its market penetration.
Honeywell International Inc.
BAE Systems
STMicroelectronics
Microchip Technology Inc.
Renesas Electronics Corporation
Infineon Technologies AG
Texas Instruments
Xilinx
Analog Devices, Inc.
Cobham Limited
Data Device Corporation(DDC)
Solid State Devices, Inc.
Micropac Industries, Inc.
Anaren
Maxwell Technologies Inc.
Microsemi
Key Questions Addressed in this Report
What is the 10-year outlook for the global Radiation Hardened Electronic Devices and Components market?
What factors are driving Radiation Hardened Electronic Devices and Components market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Radiation Hardened Electronic Devices and Components market opportunities vary by end market size?
How does Radiation Hardened Electronic Devices and Components break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?

*** レポート目次（コンテンツ）***

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Radiation Hardened Electronic Devices and Components Annual Sales 2018-2029
2.1.2 World Current & Future Analysis for Radiation Hardened Electronic Devices and Components by Geographic Region, 2018, 2022 & 2029
2.1.3 World Current & Future Analysis for Radiation Hardened Electronic Devices and Components by Country/Region, 2018, 2022 & 2029
2.2 Radiation Hardened Electronic Devices and Components Segment by Type
2.2.1 Silicon
2.2.2 Silicon Carbide
2.2.3 Gallium Nitride
2.2.4 Hydrogenated Amorphous Silicon
2.3 Radiation Hardened Electronic Devices and Components Sales by Type
2.3.1 Global Radiation Hardened Electronic Devices and Components Sales Market Share by Type (2018-2023)
2.3.2 Global Radiation Hardened Electronic Devices and Components Revenue and Market Share by Type (2018-2023)
2.3.3 Global Radiation Hardened Electronic Devices and Components Sale Price by Type (2018-2023)
2.4 Radiation Hardened Electronic Devices and Components Segment by Application
2.4.1 Aerospace
2.4.2 Military
2.4.3 Nuclear
2.4.4 Medical
2.4.5 Consumer Electronics
2.4.6 Others
2.5 Radiation Hardened Electronic Devices and Components Sales by Application
2.5.1 Global Radiation Hardened Electronic Devices and Components Sale Market Share by Application (2018-2023)
2.5.2 Global Radiation Hardened Electronic Devices and Components Revenue and Market Share by Application (2018-2023)
2.5.3 Global Radiation Hardened Electronic Devices and Components Sale Price by Application (2018-2023)
3 Global Radiation Hardened Electronic Devices and Components by Company
3.1 Global Radiation Hardened Electronic Devices and Components Breakdown Data by Company
3.1.1 Global Radiation Hardened Electronic Devices and Components Annual Sales by Company (2018-2023)
3.1.2 Global Radiation Hardened Electronic Devices and Components Sales Market Share by Company (2018-2023)
3.2 Global Radiation Hardened Electronic Devices and Components Annual Revenue by Company (2018-2023)
3.2.1 Global Radiation Hardened Electronic Devices and Components Revenue by Company (2018-2023)
3.2.2 Global Radiation Hardened Electronic Devices and Components Revenue Market Share by Company (2018-2023)
3.3 Global Radiation Hardened Electronic Devices and Components Sale Price by Company
3.4 Key Manufacturers Radiation Hardened Electronic Devices and Components Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Radiation Hardened Electronic Devices and Components Product Location Distribution
3.4.2 Players Radiation Hardened Electronic Devices and Components Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2018-2023)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 World Historic Review for Radiation Hardened Electronic Devices and Components by Geographic Region
4.1 World Historic Radiation Hardened Electronic Devices and Components Market Size by Geographic Region (2018-2023)
4.1.1 Global Radiation Hardened Electronic Devices and Components Annual Sales by Geographic Region (2018-2023)
4.1.2 Global Radiation Hardened Electronic Devices and Components Annual Revenue by Geographic Region (2018-2023)
4.2 World Historic Radiation Hardened Electronic Devices and Components Market Size by Country/Region (2018-2023)
4.2.1 Global Radiation Hardened Electronic Devices and Components Annual Sales by Country/Region (2018-2023)
4.2.2 Global Radiation Hardened Electronic Devices and Components Annual Revenue by Country/Region (2018-2023)
4.3 Americas Radiation Hardened Electronic Devices and Components Sales Growth
4.4 APAC Radiation Hardened Electronic Devices and Components Sales Growth
4.5 Europe Radiation Hardened Electronic Devices and Components Sales Growth
4.6 Middle East & Africa Radiation Hardened Electronic Devices and Components Sales Growth
5 Americas
5.1 Americas Radiation Hardened Electronic Devices and Components Sales by Country
5.1.1 Americas Radiation Hardened Electronic Devices and Components Sales by Country (2018-2023)
5.1.2 Americas Radiation Hardened Electronic Devices and Components Revenue by Country (2018-2023)
5.2 Americas Radiation Hardened Electronic Devices and Components Sales by Type
5.3 Americas Radiation Hardened Electronic Devices and Components Sales by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Radiation Hardened Electronic Devices and Components Sales by Region
6.1.1 APAC Radiation Hardened Electronic Devices and Components Sales by Region (2018-2023)
6.1.2 APAC Radiation Hardened Electronic Devices and Components Revenue by Region (2018-2023)
6.2 APAC Radiation Hardened Electronic Devices and Components Sales by Type
6.3 APAC Radiation Hardened Electronic Devices and Components Sales by Application
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Radiation Hardened Electronic Devices and Components by Country
7.1.1 Europe Radiation Hardened Electronic Devices and Components Sales by Country (2018-2023)
7.1.2 Europe Radiation Hardened Electronic Devices and Components Revenue by Country (2018-2023)
7.2 Europe Radiation Hardened Electronic Devices and Components Sales by Type
7.3 Europe Radiation Hardened Electronic Devices and Components Sales by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Radiation Hardened Electronic Devices and Components by Country
8.1.1 Middle East & Africa Radiation Hardened Electronic Devices and Components Sales by Country (2018-2023)
8.1.2 Middle East & Africa Radiation Hardened Electronic Devices and Components Revenue by Country (2018-2023)
8.2 Middle East & Africa Radiation Hardened Electronic Devices and Components Sales by Type
8.3 Middle East & Africa Radiation Hardened Electronic Devices and Components Sales by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Radiation Hardened Electronic Devices and Components
10.3 Manufacturing Process Analysis of Radiation Hardened Electronic Devices and Components
10.4 Industry Chain Structure of Radiation Hardened Electronic Devices and Components
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Radiation Hardened Electronic Devices and Components Distributors
11.3 Radiation Hardened Electronic Devices and Components Customer
12 World Forecast Review for Radiation Hardened Electronic Devices and Components by Geographic Region
12.1 Global Radiation Hardened Electronic Devices and Components Market Size Forecast by Region
12.1.1 Global Radiation Hardened Electronic Devices and Components Forecast by Region (2024-2029)
12.1.2 Global Radiation Hardened Electronic Devices and Components Annual Revenue Forecast by Region (2024-2029)
12.2 Americas Forecast by Country
12.3 APAC Forecast by Region
12.4 Europe Forecast by Country
12.5 Middle East & Africa Forecast by Country
12.6 Global Radiation Hardened Electronic Devices and Components Forecast by Type
12.7 Global Radiation Hardened Electronic Devices and Components Forecast by Application
13 Key Players Analysis
13.1 Honeywell International Inc.
13.1.1 Honeywell International Inc. Company Information
13.1.2 Honeywell International Inc. Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.1.3 Honeywell International Inc. Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.1.4 Honeywell International Inc. Main Business Overview
13.1.5 Honeywell International Inc. Latest Developments
13.2 BAE Systems
13.2.1 BAE Systems Company Information
13.2.2 BAE Systems Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.2.3 BAE Systems Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.2.4 BAE Systems Main Business Overview
13.2.5 BAE Systems Latest Developments
13.3 STMicroelectronics
13.3.1 STMicroelectronics Company Information
13.3.2 STMicroelectronics Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.3.3 STMicroelectronics Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.3.4 STMicroelectronics Main Business Overview
13.3.5 STMicroelectronics Latest Developments
13.4 Microchip Technology Inc.
13.4.1 Microchip Technology Inc. Company Information
13.4.2 Microchip Technology Inc. Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.4.3 Microchip Technology Inc. Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.4.4 Microchip Technology Inc. Main Business Overview
13.4.5 Microchip Technology Inc. Latest Developments
13.5 Renesas Electronics Corporation
13.5.1 Renesas Electronics Corporation Company Information
13.5.2 Renesas Electronics Corporation Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.5.3 Renesas Electronics Corporation Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.5.4 Renesas Electronics Corporation Main Business Overview
13.5.5 Renesas Electronics Corporation Latest Developments
13.6 Infineon Technologies AG
13.6.1 Infineon Technologies AG Company Information
13.6.2 Infineon Technologies AG Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.6.3 Infineon Technologies AG Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.6.4 Infineon Technologies AG Main Business Overview
13.6.5 Infineon Technologies AG Latest Developments
13.7 Texas Instruments
13.7.1 Texas Instruments Company Information
13.7.2 Texas Instruments Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.7.3 Texas Instruments Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.7.4 Texas Instruments Main Business Overview
13.7.5 Texas Instruments Latest Developments
13.8 Xilinx
13.8.1 Xilinx Company Information
13.8.2 Xilinx Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.8.3 Xilinx Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.8.4 Xilinx Main Business Overview
13.8.5 Xilinx Latest Developments
13.9 Analog Devices, Inc.
13.9.1 Analog Devices, Inc. Company Information
13.9.2 Analog Devices, Inc. Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.9.3 Analog Devices, Inc. Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.9.4 Analog Devices, Inc. Main Business Overview
13.9.5 Analog Devices, Inc. Latest Developments
13.10 Cobham Limited
13.10.1 Cobham Limited Company Information
13.10.2 Cobham Limited Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.10.3 Cobham Limited Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.10.4 Cobham Limited Main Business Overview
13.10.5 Cobham Limited Latest Developments
13.11 Data Device Corporation(DDC)
13.11.1 Data Device Corporation(DDC) Company Information
13.11.2 Data Device Corporation(DDC) Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.11.3 Data Device Corporation(DDC) Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.11.4 Data Device Corporation(DDC) Main Business Overview
13.11.5 Data Device Corporation(DDC) Latest Developments
13.12 Solid State Devices, Inc.
13.12.1 Solid State Devices, Inc. Company Information
13.12.2 Solid State Devices, Inc. Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.12.3 Solid State Devices, Inc. Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.12.4 Solid State Devices, Inc. Main Business Overview
13.12.5 Solid State Devices, Inc. Latest Developments
13.13 Micropac Industries, Inc.
13.13.1 Micropac Industries, Inc. Company Information
13.13.2 Micropac Industries, Inc. Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.13.3 Micropac Industries, Inc. Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.13.4 Micropac Industries, Inc. Main Business Overview
13.13.5 Micropac Industries, Inc. Latest Developments
13.14 Anaren
13.14.1 Anaren Company Information
13.14.2 Anaren Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.14.3 Anaren Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.14.4 Anaren Main Business Overview
13.14.5 Anaren Latest Developments
13.15 Maxwell Technologies Inc.
13.15.1 Maxwell Technologies Inc. Company Information
13.15.2 Maxwell Technologies Inc. Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.15.3 Maxwell Technologies Inc. Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.15.4 Maxwell Technologies Inc. Main Business Overview
13.15.5 Maxwell Technologies Inc. Latest Developments
13.16 Microsemi
13.16.1 Microsemi Company Information
13.16.2 Microsemi Radiation Hardened Electronic Devices and Components Product Portfolios and Specifications
13.16.3 Microsemi Radiation Hardened Electronic Devices and Components Sales, Revenue, Price and Gross Margin (2018-2023)
13.16.4 Microsemi Main Business Overview
13.16.5 Microsemi Latest Developments
14 Research Findings and Conclusion

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放射線硬化型電子デバイス・部品のグローバル市場予測2023-2029

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