CHAPTER 1:INTRODUCTION
1.1.Report description
1.2.Key market segments
1.3.Key benefits to the stakeholders
1.4.Research Methodology
1.4.1.Secondary research
1.4.2.Primary research
1.4.3.Analyst tools and models
CHAPTER 2:EXECUTIVE SUMMARY
2.1.Key findings of the study
2.2.CXO Perspective
CHAPTER 3:MARKET OVERVIEW
3.1.Market definition and scope
3.2.Key findings
3.2.1.Top investment pockets
3.3.Porter’s five forces analysis
3.4.Top player positioning
3.5.Market dynamics
3.5.1.Drivers
3.5.2.Restraints
3.5.3.Opportunities
3.6.COVID-19 Impact Analysis on the market
CHAPTER 4: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS
4.1 Overview
4.1.1 Market size and forecast
4.2 Sawing
4.2.1 Key market trends, growth factors and opportunities
4.2.2 Market size and forecast, by region
4.2.3 Market analysis by country
4.3 Sorting
4.3.1 Key market trends, growth factors and opportunities
4.3.2 Market size and forecast, by region
4.3.3 Market analysis by country
4.4 Testing
4.4.1 Key market trends, growth factors and opportunities
4.4.2 Market size and forecast, by region
4.4.3 Market analysis by country
4.5 Assembly
4.5.1 Key market trends, growth factors and opportunities
4.5.2 Market size and forecast, by region
4.5.3 Market analysis by country
CHAPTER 5: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE
5.1 Overview
5.1.1 Market size and forecast
5.2 Ball grid array
5.2.1 Key market trends, growth factors and opportunities
5.2.2 Market size and forecast, by region
5.2.3 Market analysis by country
5.3 Chip scale package
5.3.1 Key market trends, growth factors and opportunities
5.3.2 Market size and forecast, by region
5.3.3 Market analysis by country
5.4 Multi-package
5.4.1 Key market trends, growth factors and opportunities
5.4.2 Market size and forecast, by region
5.4.3 Market analysis by country
5.5 Stacked die
5.5.1 Key market trends, growth factors and opportunities
5.5.2 Market size and forecast, by region
5.5.3 Market analysis by country
5.6 Quad and dual
5.6.1 Key market trends, growth factors and opportunities
5.6.2 Market size and forecast, by region
5.6.3 Market analysis by country
CHAPTER 6: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION
6.1 Overview
6.1.1 Market size and forecast
6.2 Automotive
6.2.1 Key market trends, growth factors and opportunities
6.2.2 Market size and forecast, by region
6.2.3 Market analysis by country
6.3 Consumer electronics
6.3.1 Key market trends, growth factors and opportunities
6.3.2 Market size and forecast, by region
6.3.3 Market analysis by country
6.4 Industrial
6.4.1 Key market trends, growth factors and opportunities
6.4.2 Market size and forecast, by region
6.4.3 Market analysis by country
6.5 Telecommunication
6.5.1 Key market trends, growth factors and opportunities
6.5.2 Market size and forecast, by region
6.5.3 Market analysis by country
6.6 Aerospace and defense
6.6.1 Key market trends, growth factors and opportunities
6.6.2 Market size and forecast, by region
6.6.3 Market analysis by country
6.7 Medical and healthcare
6.7.1 Key market trends, growth factors and opportunities
6.7.2 Market size and forecast, by region
6.7.3 Market analysis by country
6.8 Logistics and transportation
6.8.1 Key market trends, growth factors and opportunities
6.8.2 Market size and forecast, by region
6.8.3 Market analysis by country
CHAPTER 7: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY REGION
7.1 Overview
7.1.1 Market size and forecast
7.2 North America
7.2.1 Key trends and opportunities
7.2.2 North America Market size and forecast, by Process
7.2.3 North America Market size and forecast, by Packaging Type
7.2.4 North America Market size and forecast, by Application
7.2.5 North America Market size and forecast, by country
7.2.5.1 U.S.
7.2.5.1.1 Market size and forecast, by Process
7.2.5.1.2 Market size and forecast, by Packaging Type
7.2.5.1.3 Market size and forecast, by Application
7.2.5.2 Canada
7.2.5.2.1 Market size and forecast, by Process
7.2.5.2.2 Market size and forecast, by Packaging Type
7.2.5.2.3 Market size and forecast, by Application
7.2.5.3 Mexico
7.2.5.3.1 Market size and forecast, by Process
7.2.5.3.2 Market size and forecast, by Packaging Type
7.2.5.3.3 Market size and forecast, by Application
7.3 Europe
7.3.1 Key trends and opportunities
7.3.2 Europe Market size and forecast, by Process
7.3.3 Europe Market size and forecast, by Packaging Type
7.3.4 Europe Market size and forecast, by Application
7.3.5 Europe Market size and forecast, by country
7.3.5.1 UK
7.3.5.1.1 Market size and forecast, by Process
7.3.5.1.2 Market size and forecast, by Packaging Type
7.3.5.1.3 Market size and forecast, by Application
7.3.5.2 Germany
7.3.5.2.1 Market size and forecast, by Process
7.3.5.2.2 Market size and forecast, by Packaging Type
7.3.5.2.3 Market size and forecast, by Application
7.3.5.3 France
7.3.5.3.1 Market size and forecast, by Process
7.3.5.3.2 Market size and forecast, by Packaging Type
7.3.5.3.3 Market size and forecast, by Application
7.3.5.4 Italy
7.3.5.4.1 Market size and forecast, by Process
7.3.5.4.2 Market size and forecast, by Packaging Type
7.3.5.4.3 Market size and forecast, by Application
7.3.5.5 Russia
7.3.5.5.1 Market size and forecast, by Process
7.3.5.5.2 Market size and forecast, by Packaging Type
7.3.5.5.3 Market size and forecast, by Application
7.3.5.6 Sweden
7.3.5.6.1 Market size and forecast, by Process
7.3.5.6.2 Market size and forecast, by Packaging Type
7.3.5.6.3 Market size and forecast, by Application
7.3.5.7 Netherlands
7.3.5.7.1 Market size and forecast, by Process
7.3.5.7.2 Market size and forecast, by Packaging Type
7.3.5.7.3 Market size and forecast, by Application
7.3.5.8 Rest of Europe
7.3.5.8.1 Market size and forecast, by Process
7.3.5.8.2 Market size and forecast, by Packaging Type
7.3.5.8.3 Market size and forecast, by Application
7.4 Asia-Pacific
7.4.1 Key trends and opportunities
7.4.2 Asia-Pacific Market size and forecast, by Process
7.4.3 Asia-Pacific Market size and forecast, by Packaging Type
7.4.4 Asia-Pacific Market size and forecast, by Application
7.4.5 Asia-Pacific Market size and forecast, by country
7.4.5.1 China
7.4.5.1.1 Market size and forecast, by Process
7.4.5.1.2 Market size and forecast, by Packaging Type
7.4.5.1.3 Market size and forecast, by Application
7.4.5.2 India
7.4.5.2.1 Market size and forecast, by Process
7.4.5.2.2 Market size and forecast, by Packaging Type
7.4.5.2.3 Market size and forecast, by Application
7.4.5.3 Japan
7.4.5.3.1 Market size and forecast, by Process
7.4.5.3.2 Market size and forecast, by Packaging Type
7.4.5.3.3 Market size and forecast, by Application
7.4.5.4 South Korea
7.4.5.4.1 Market size and forecast, by Process
7.4.5.4.2 Market size and forecast, by Packaging Type
7.4.5.4.3 Market size and forecast, by Application
7.4.5.5 Rest of Europe
7.4.5.5.1 Market size and forecast, by Process
7.4.5.5.2 Market size and forecast, by Packaging Type
7.4.5.5.3 Market size and forecast, by Application
7.5 LAMEA
7.5.1 Key trends and opportunities
7.5.2 LAMEA Market size and forecast, by Process
7.5.3 LAMEA Market size and forecast, by Packaging Type
7.5.4 LAMEA Market size and forecast, by Application
7.5.5 LAMEA Market size and forecast, by country
7.5.5.1 Latin America
7.5.5.1.1 Market size and forecast, by Process
7.5.5.1.2 Market size and forecast, by Packaging Type
7.5.5.1.3 Market size and forecast, by Application
7.5.5.2 Middle East
7.5.5.2.1 Market size and forecast, by Process
7.5.5.2.2 Market size and forecast, by Packaging Type
7.5.5.2.3 Market size and forecast, by Application
7.5.5.3 Africa
7.5.5.3.1 Market size and forecast, by Process
7.5.5.3.2 Market size and forecast, by Packaging Type
7.5.5.3.3 Market size and forecast, by Application
CHAPTER 8: COMPANY LANDSCAPE
8.1. Introduction
8.2. Top winning strategies
8.3. Product Mapping of Top 10 Player
8.4. Competitive Dashboard
8.5. Competitive Heatmap
8.6. Key developments
CHAPTER 9: COMPANY PROFILES
9.1 ADVANCED SILICON S.A.
9.1.1 Company overview
9.1.2 Company snapshot
9.1.3 Operating business segments
9.1.4 Product portfolio
9.1.5 Business performance
9.1.6 Key strategic moves and developments
9.2 ALPHACORE INC.
9.2.1 Company overview
9.2.2 Company snapshot
9.2.3 Operating business segments
9.2.4 Product portfolio
9.2.5 Business performance
9.2.6 Key strategic moves and developments
9.3 AMKOR TECHNOLOGY, INC
9.3.1 Company overview
9.3.2 Company snapshot
9.3.3 Operating business segments
9.3.4 Product portfolio
9.3.5 Business performance
9.3.6 Key strategic moves and developments
9.4 DEVICE ENGINEERING INC.
9.4.1 Company overview
9.4.2 Company snapshot
9.4.3 Operating business segments
9.4.4 Product portfolio
9.4.5 Business performance
9.4.6 Key strategic moves and developments
9.5 HIDENSITY GROUP (HMT MICROELECTRONIC AG)
9.5.1 Company overview
9.5.2 Company snapshot
9.5.3 Operating business segments
9.5.4 Product portfolio
9.5.5 Business performance
9.5.6 Key strategic moves and developments
9.6 PRESTO ENGINEERING GROUP
9.6.1 Company overview
9.6.2 Company snapshot
9.6.3 Operating business segments
9.6.4 Product portfolio
9.6.5 Business performance
9.6.6 Key strategic moves and developments
9.7 Sencio BV
9.7.1 Company overview
9.7.2 Company snapshot
9.7.3 Operating business segments
9.7.4 Product portfolio
9.7.5 Business performance
9.7.6 Key strategic moves and developments
9.8 SHORTLINK GROUP
9.8.1 Company overview
9.8.2 Company snapshot
9.8.3 Operating business segments
9.8.4 Product portfolio
9.8.5 Business performance
9.8.6 Key strategic moves and developments
9.9 SIFIVE, INC. (OPENFIVE)
9.9.1 Company overview
9.9.2 Company snapshot
9.9.3 Operating business segments
9.9.4 Product portfolio
9.9.5 Business performance
9.9.6 Key strategic moves and developments
9.10 LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING)
9.10.1 Company overview
9.10.2 Company snapshot
9.10.3 Operating business segments
9.10.4 Product portfolio
9.10.5 Business performance
9.10.6 Key strategic moves and developments
TABLE 1. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 2. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR SAWING, BY REGION, 2021-2031 ($MILLION)
TABLE 3. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR SAWING, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 4. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR SORTING, BY REGION, 2021-2031 ($MILLION)
TABLE 5. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR SORTING, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 6. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR TESTING, BY REGION, 2021-2031 ($MILLION)
TABLE 7. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR TESTING, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 8. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR ASSEMBLY, BY REGION, 2021-2031 ($MILLION)
TABLE 9. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR ASSEMBLY, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 10. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 11. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR BALL GRID ARRAY, BY REGION, 2021-2031 ($MILLION)
TABLE 12. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR BALL GRID ARRAY, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 13. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR CHIP SCALE PACKAGE, BY REGION, 2021-2031 ($MILLION)
TABLE 14. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR CHIP SCALE PACKAGE, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 15. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR MULTI-PACKAGE, BY REGION, 2021-2031 ($MILLION)
TABLE 16. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR MULTI-PACKAGE, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 17. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR STACKED DIE, BY REGION, 2021-2031 ($MILLION)
TABLE 18. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR STACKED DIE, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 19. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR QUAD AND DUAL, BY REGION, 2021-2031 ($MILLION)
TABLE 20. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR QUAD AND DUAL, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 21. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 22. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR AUTOMOTIVE, BY REGION, 2021-2031 ($MILLION)
TABLE 23. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR AUTOMOTIVE, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 24. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR CONSUMER ELECTRONICS, BY REGION, 2021-2031 ($MILLION)
TABLE 25. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 26. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR INDUSTRIAL, BY REGION, 2021-2031 ($MILLION)
TABLE 27. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR INDUSTRIAL, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 28. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR TELECOMMUNICATION, BY REGION, 2021-2031 ($MILLION)
TABLE 29. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR TELECOMMUNICATION, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 30. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR AEROSPACE AND DEFENSE, BY REGION, 2021-2031 ($MILLION)
TABLE 31. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR AEROSPACE AND DEFENSE, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 32. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR MEDICAL AND HEALTHCARE, BY REGION, 2021-2031 ($MILLION)
TABLE 33. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR MEDICAL AND HEALTHCARE, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 34. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR LOGISTICS AND TRANSPORTATION, BY REGION, 2021-2031 ($MILLION)
TABLE 35. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR LOGISTICS AND TRANSPORTATION, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 36. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY REGION, 2021-2031 ($MILLION)
TABLE 37. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 38. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 39. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 40. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 41. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 42. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 43. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 44. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 45. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 46. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 47. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 48. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 49. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 50. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 51. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 52. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 53. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 54. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 55. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 56. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 57. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 58. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 59. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 60. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 61. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 62. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 63. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 64. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 65. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 66. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 67. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 68. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 69. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 70. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 71. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 72. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 73. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 74. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 75. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 76. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 77. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 78. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 79. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 80. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 81. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 82. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 83. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 84. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 85. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 86. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 87. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 88. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 89. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 90. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 91. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 92. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 93. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 94. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 95. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 96. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 97. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 98. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 99. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 100. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 101. LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 102. LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 103. LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 104. MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 105. MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 106. MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 107. AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 108. AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 109. AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 110.ADVANCED SILICON S.A.: COMPANY SNAPSHOT
TABLE 111.ADVANCED SILICON S.A.: OPERATING SEGMENTS
TABLE 112.ADVANCED SILICON S.A.: PRODUCT PORTFOLIO
TABLE 113.ADVANCED SILICON S.A.: NET SALES,
TABLE 114.ADVANCED SILICON S.A.: KEY STRATERGIES
TABLE 115.ALPHACORE INC.: COMPANY SNAPSHOT
TABLE 116.ALPHACORE INC.: OPERATING SEGMENTS
TABLE 117.ALPHACORE INC.: PRODUCT PORTFOLIO
TABLE 118.ALPHACORE INC.: NET SALES,
TABLE 119.ALPHACORE INC.: KEY STRATERGIES
TABLE 120.AMKOR TECHNOLOGY, INC: COMPANY SNAPSHOT
TABLE 121.AMKOR TECHNOLOGY, INC: OPERATING SEGMENTS
TABLE 122.AMKOR TECHNOLOGY, INC: PRODUCT PORTFOLIO
TABLE 123.AMKOR TECHNOLOGY, INC: NET SALES,
TABLE 124.AMKOR TECHNOLOGY, INC: KEY STRATERGIES
TABLE 125.DEVICE ENGINEERING INC.: COMPANY SNAPSHOT
TABLE 126.DEVICE ENGINEERING INC.: OPERATING SEGMENTS
TABLE 127.DEVICE ENGINEERING INC.: PRODUCT PORTFOLIO
TABLE 128.DEVICE ENGINEERING INC.: NET SALES,
TABLE 129.DEVICE ENGINEERING INC.: KEY STRATERGIES
TABLE 130.HIDENSITY GROUP (HMT MICROELECTRONIC AG): COMPANY SNAPSHOT
TABLE 131.HIDENSITY GROUP (HMT MICROELECTRONIC AG): OPERATING SEGMENTS
TABLE 132.HIDENSITY GROUP (HMT MICROELECTRONIC AG): PRODUCT PORTFOLIO
TABLE 133.HIDENSITY GROUP (HMT MICROELECTRONIC AG): NET SALES,
TABLE 134.HIDENSITY GROUP (HMT MICROELECTRONIC AG): KEY STRATERGIES
TABLE 135.PRESTO ENGINEERING GROUP: COMPANY SNAPSHOT
TABLE 136.PRESTO ENGINEERING GROUP: OPERATING SEGMENTS
TABLE 137.PRESTO ENGINEERING GROUP: PRODUCT PORTFOLIO
TABLE 138.PRESTO ENGINEERING GROUP: NET SALES,
TABLE 139.PRESTO ENGINEERING GROUP: KEY STRATERGIES
TABLE 140.SENCIO BV: COMPANY SNAPSHOT
TABLE 141.SENCIO BV: OPERATING SEGMENTS
TABLE 142.SENCIO BV: PRODUCT PORTFOLIO
TABLE 143.SENCIO BV: NET SALES,
TABLE 144.SENCIO BV: KEY STRATERGIES
TABLE 145.SHORTLINK GROUP: COMPANY SNAPSHOT
TABLE 146.SHORTLINK GROUP: OPERATING SEGMENTS
TABLE 147.SHORTLINK GROUP: PRODUCT PORTFOLIO
TABLE 148.SHORTLINK GROUP: NET SALES,
TABLE 149.SHORTLINK GROUP: KEY STRATERGIES
TABLE 150.SIFIVE, INC. (OPENFIVE): COMPANY SNAPSHOT
TABLE 151.SIFIVE, INC. (OPENFIVE): OPERATING SEGMENTS
TABLE 152.SIFIVE, INC. (OPENFIVE): PRODUCT PORTFOLIO
TABLE 153.SIFIVE, INC. (OPENFIVE): NET SALES,
TABLE 154.SIFIVE, INC. (OPENFIVE): KEY STRATERGIES
TABLE 155.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): COMPANY SNAPSHOT
TABLE 156.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): OPERATING SEGMENTS
TABLE 157.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): PRODUCT PORTFOLIO
TABLE 158.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): NET SALES,
TABLE 159.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): KEY STRATERGIES
*** 免責事項 ***
https://www.globalresearch.co.jp/disclaimer/
