カテゴリ： Allied Market Research, IT/電子, 世界

クワッドフラットリード無しパッケージ（QFN）のグローバル市場（2021～2031）：エアキャビティQFN、プラスチックモールドQFN、その他

■ 英語タイトル：Quad-Flat-No-Lead Packaging Market By Type (Air-cavity QFN, Plastic-moulded QFN, Others), By Moulding Method (Punched, Sawn), By Terminal Pads (Fully Exposed Terminal Ends, Pull-back Terminal Ends, Side Wettable Flank Terminal Ends), By Industry Vertical (Consumer Electronics, Industrial, Automotive, Computing/Networking, Communications): Global Opportunity Analysis and Industry Forecast, 2021-2031

調査会社Allied Market Research社が発行したリサーチレポート（データ管理コード：ALD23MC138）■ 発行会社/調査会社：Allied Market Research
■ 商品コード：ALD23MC138
■ 発行日：2023年1月
■ 調査対象地域：グローバル
■ 産業分野：半導体
■ ページ数：293
■ レポート言語：英語
■ レポート形式：PDF
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★グローバルリサーチ資料[クワッドフラットリード無しパッケージ（QFN）のグローバル市場（2021～2031）：エアキャビティQFN、プラスチックモールドQFN、その他]についてメールでお問い合わせはこちら
*** レポート概要（サマリー）***

Allied Market Research社の調査資料では、2021年には4億ドルであった世界のクワッドフラットリード無しパッケージ（QFN）市場規模が2031年には11億ドルへ及び、2022年から2031年の間にCAGR 8.8％増加すると推測されています。本調査資料では、クワッドフラットリード無しパッケージ（QFN）の世界市場を広く調査・分析し、イントロダクション、エグゼクティブサマリー、市場概要、種類別（エアキャビティQFN、プラスチックモールドQFN、その他）分析、成形方法別（パンチング、ソーン）分析、端子パッド別（完全露出端子、プルバック端子、サイドウェッタブルフランク端子）分析、産業別（家電、工業、自動車、コンピューティング/ネットワーク、通信）分析、地域別（北米、ヨーロッパ、アジア太平洋、中南米/中東・アフリカ）分析、競争状況、企業情報などを整理しました。並びに、本資料に記載されている企業として、Amkor Technology, Inc.、Texas Instruments Incorporated、Microchip Technology Inc.、STATS ChipPAC Pte Ltd、ASE、NXP Semiconductors、JCET Group、Powertech Technology Inc.、Tianshui Huatian Technology Co.,Ltd、ChipMOS TECHNOLOGIES INC.などが含まれています。
・イントロダクション
・エグゼクティブサマリー
・市場概要
・世界のクワッドフラットリード無しパッケージ（QFN）市場規模：種類別
- エアキャビティQFNの市場規模
- プラスチックモールドQFNの市場規模
- その他クワッドフラットリード無しパッケージ（QFN）の市場規模
・世界のクワッドフラットリード無しパッケージ（QFN）市場規模：成形方法別
- パンチング成形法クワッドフラットリード無しパッケージ（QFN）の市場規模
- ソーン成形法クワッドフラットリード無しパッケージ（QFN）の市場規模
・世界のクワッドフラットリード無しパッケージ（QFN）市場規模：端子パッド別
- 完全露出端子における市場規模
- プルバック端子における市場規模
- サイドウェッタブルフランク端子における市場規模
・世界のクワッドフラットリード無しパッケージ（QFN）市場規模：産業別
- 家電における市場規模
- 工業における市場規模
- コンピューティング/ネットワークにおける市場規模
- 通信における市場規模
・世界のクワッドフラットリード無しパッケージ（QFN）市場規模：地域別
- 北米のクワッドフラットリード無しパッケージ（QFN）市場規模
- ヨーロッパのクワッドフラットリード無しパッケージ（QFN）市場規模
- アジア太平洋のクワッドフラットリード無しパッケージ（QFN）市場規模
- 中南米/中東・アフリカのクワッドフラットリード無しパッケージ（QFN）市場規模
・競争状況
・企業情報

世界のクワッドフラットリード無しパッケージ（QFN）市場は、2021年の4億ドルから2031年には11億ドルに成長し、2022年から2031年までの年平均成長率は8.8%になると予測されています。

クワッドフラットノーリード（QFN）のようなノーリード・パッケージは、ICデバイスでますます一般的になっています。このパッケージタイプは当初、携帯型コンシューマーエレクトロニクス用の低フォームファクター容器として誕生しました。さらに、同種のパッケージよりも全体的に安価で、基板スペースが少なくて済み、熱管理性に優れ、電気的性能も高い可能性があります。QFNパッケージの使用は、熱疲労耐性に対する長期的な基板レベルの信頼性基準が民生用途よりも厳しい電気通信業界や自動車業界で最近増加しています。これらの要因により、民生用電子機器アプリケーションにおけるクワッドフラットリード無しパッケージ（QFN）の市場シェアが高まると予想されます。

クワッドフラットリード無しパッケージ（QFN）は、ノンリードパッケージ特有の高い熱膨張係数、低いはんだスタンドオフ、非対応の周辺相互接続のため、はんだの熱疲労による故障が大きな懸念材料となっています。このようなパッケージは、はんだアセンブリにも困難をもたらし、広範なレベルの信頼性にさらに大きな影響を及ぼす可能性があります。パッケージング業界はボディの大型化、ファインピッチ化、多ピン化を進めており、これらはすべてクワッドフラットリード無しパッケージ（QFN）市場規模に信頼性リスクと組立上の問題をもたらします。

マイクロリードフィルム（MLF）パッケージング技術の進歩は、柔軟なリード設計により、パワー分野におけるソリューション提供能力を拡大することができました。パワーQFN(PQFN)はMLF技術のバージョンで、複数の融着リードで多数の露出パッドを提供します。PQFNパッケージングソリューションは、コンパクトなサイズを維持しながら、パワーMOSFET（金属-酸化膜-半導体電界効果トランジスタ）設計に必要な熱性能を提供します。これは、銅（Cu）クリップと熱の統合能力を組み合わせることで達成されます。あらゆるタイプの携帯機器、ハンドヘルド機器、電子充電機器が、この方法を急速に採用しています。焼結ペーストとはんだダイアタッチには、PQFNソリューションの熱性能をさらに拡張する効果があります。精密に製造されたPQFNデバイスの熱放散は特に堅牢です。15Aのドレイン電流と150ボルトのドレイン-ソース間電圧を維持できるデバイスは、内蔵ヒートスラグと外部ヒートシンクによってサポートされます。Cuリードフレームと鉛フリーはんだの使用は、このパッケージング・ソリューションの重要な構成要素であり、要求の厳しいハイパワー・ニーズのデバイスに必要なオン抵抗性能を可能にします。

COVID-19のパンデミックは、世界中の様々なビジネスが停止し、深刻な経済的損失につながるいくつかの不確実性をもたらしました。米国、中国、インドなどさまざまな国で輸出入規制が敷かれ、市場に大きな打撃を与えました。民生用電子機器に使用されるクワッドフラットノーリードの需要は、パンデミック時に減少しました。携帯電話の販売台数は、顧客の嗜好が低価格の携帯電話にシフトしたため大幅に減少し、市場成長の妨げになりました。

本レポートでは、Amkor Technology, Inc., Texas Instruments Incorporated, Microchip Technology Inc., STATS ChipPAC Pte Ltd, ASE, NXP Semiconductors, JCET Group, Powertech Technology Inc.

〈ステークホルダーにとっての主なメリット〉
・2021年から2031年までのクワッドフラットリード無しパッケージ（QFN）市場分析の市場セグメント、現在の動向、予測、ダイナミクスを定量的に分析し、市場の有力な機会を特定します。
・主要な促進要因、阻害要因、機会に関する情報とともに市場調査を提供します。
・ポーターのファイブフォース分析により、バイヤーとサプライヤーの潜在力を明らかにし、ステークホルダーが利益重視のビジネス決定を下し、サプライヤーとバイヤーのネットワークを強化できるようにします。
・クワッドフラットリード無しパッケージ（QFN）市場のセグメンテーションを詳細に分析することで、市場機会を見極めることができます。
・各地域の主要国を世界市場への収益貢献度に応じてマッピングしています。
・市場プレイヤーのポジショニングはベンチマーキングを容易にし、市場プレイヤーの現在のポジションを明確に理解することができます。
・地域別および世界のクワッドフラットリード無しパッケージ（QFN）市場動向、主要企業、市場セグメント、応用分野、市場成長戦略の分析を含みます。

〈主要市場セグメント〉
端子パッド別
完全露出端子エンド
プルバック端子
サイドウェッタブルフランク端子エンド

産業別
家電
工業
自動車
コンピューティング／ネットワーキング
通信

種類別
エアキャビティQFN
プラスチックモールドQFN
その他

成形方法別
打ち抜き
ソーン

地域別
・北米
アメリカ
カナダ
メキシコ
・ヨーロッパ
ドイツ
イギリス
フランス
スペイン
イタリア
その他のヨーロッパ
・アジア太平洋
台湾
中国
日本
インド
韓国
その他のアジア
・LAMEA
ブラジル
アラブ首長国連邦
サウジアラビア
南アフリカ
その他のLAMEA地域

〈主要市場プレイヤー〉
Amkor Technology, Inc.
Texas Instruments Incorporated
Microchip Technology Inc.
STATS ChipPAC Pte Ltd
ASE
NXP Semiconductors
JCET Group
Powertech Technology Inc.
Tianshui Huatian Technology Co.,Ltd
ChipMOS TECHNOLOGIES INC.

世界の市場調査レポート販売サイト（H&Iグローバルリサーチ株式会社運営）
*** レポート目次（コンテンツ）***

CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research Methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO Perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.3. Porter’s five forces analysis
3.4. Market dynamics
3.4.1. Drivers
3.4.2. Restraints
3.4.3. Opportunities
3.5. COVID-19 Impact Analysis on the market
3.6. Key Regulation Analysis
3.7. Market Share Analysis
3.8. Patent Landscape
3.9. Regulatory Guidelines
3.10. Value Chain Analysis
CHAPTER 4: QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE
4.1. Overview
4.1.1. Market size and forecast
4.2. Air-cavity QFN
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market share analysis by country
4.3. Plastic-moulded QFN
4.3.1. Key market trends, growth factors and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market share analysis by country
4.4. Others
4.4.1. Key market trends, growth factors and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market share analysis by country
CHAPTER 5: QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD
5.1. Overview
5.1.1. Market size and forecast
5.2. Punched
5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market share analysis by country
5.3. Sawn
5.3.1. Key market trends, growth factors and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market share analysis by country
CHAPTER 6: QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS
6.1. Overview
6.1.1. Market size and forecast
6.2. Fully Exposed Terminal Ends
6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market share analysis by country
6.3. Pull-back Terminal Ends
6.3.1. Key market trends, growth factors and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market share analysis by country
6.4. Side Wettable Flank Terminal Ends
6.4.1. Key market trends, growth factors and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market share analysis by country
CHAPTER 7: QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL
7.1. Overview
7.1.1. Market size and forecast
7.2. Consumer Electronics
7.2.1. Key market trends, growth factors and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market share analysis by country
7.3. Industrial
7.3.1. Key market trends, growth factors and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market share analysis by country
7.4. Automotive
7.4.1. Key market trends, growth factors and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market share analysis by country
7.5. Computing/Networking
7.5.1. Key market trends, growth factors and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market share analysis by country
7.6. Communications
7.6.1. Key market trends, growth factors and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market share analysis by country
CHAPTER 8: QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY REGION
8.1. Overview
8.1.1. Market size and forecast By Region
8.2. North America
8.2.1. Key trends and opportunities
8.2.2. Market size and forecast, by Type
8.2.3. Market size and forecast, by Moulding Method
8.2.4. Market size and forecast, by Terminal Pads
8.2.5. Market size and forecast, by Industry Vertical
8.2.6. Market size and forecast, by country
8.2.6.1. U.S.
8.2.6.1.1. Key market trends, growth factors and opportunities
8.2.6.1.2. Market size and forecast, by Type
8.2.6.1.3. Market size and forecast, by Moulding Method
8.2.6.1.4. Market size and forecast, by Terminal Pads
8.2.6.1.5. Market size and forecast, by Industry Vertical
8.2.6.2. Canada
8.2.6.2.1. Key market trends, growth factors and opportunities
8.2.6.2.2. Market size and forecast, by Type
8.2.6.2.3. Market size and forecast, by Moulding Method
8.2.6.2.4. Market size and forecast, by Terminal Pads
8.2.6.2.5. Market size and forecast, by Industry Vertical
8.2.6.3. Mexico
8.2.6.3.1. Key market trends, growth factors and opportunities
8.2.6.3.2. Market size and forecast, by Type
8.2.6.3.3. Market size and forecast, by Moulding Method
8.2.6.3.4. Market size and forecast, by Terminal Pads
8.2.6.3.5. Market size and forecast, by Industry Vertical
8.3. Europe
8.3.1. Key trends and opportunities
8.3.2. Market size and forecast, by Type
8.3.3. Market size and forecast, by Moulding Method
8.3.4. Market size and forecast, by Terminal Pads
8.3.5. Market size and forecast, by Industry Vertical
8.3.6. Market size and forecast, by country
8.3.6.1. Germany
8.3.6.1.1. Key market trends, growth factors and opportunities
8.3.6.1.2. Market size and forecast, by Type
8.3.6.1.3. Market size and forecast, by Moulding Method
8.3.6.1.4. Market size and forecast, by Terminal Pads
8.3.6.1.5. Market size and forecast, by Industry Vertical
8.3.6.2. UK
8.3.6.2.1. Key market trends, growth factors and opportunities
8.3.6.2.2. Market size and forecast, by Type
8.3.6.2.3. Market size and forecast, by Moulding Method
8.3.6.2.4. Market size and forecast, by Terminal Pads
8.3.6.2.5. Market size and forecast, by Industry Vertical
8.3.6.3. France
8.3.6.3.1. Key market trends, growth factors and opportunities
8.3.6.3.2. Market size and forecast, by Type
8.3.6.3.3. Market size and forecast, by Moulding Method
8.3.6.3.4. Market size and forecast, by Terminal Pads
8.3.6.3.5. Market size and forecast, by Industry Vertical
8.3.6.4. Spain
8.3.6.4.1. Key market trends, growth factors and opportunities
8.3.6.4.2. Market size and forecast, by Type
8.3.6.4.3. Market size and forecast, by Moulding Method
8.3.6.4.4. Market size and forecast, by Terminal Pads
8.3.6.4.5. Market size and forecast, by Industry Vertical
8.3.6.5. Italy
8.3.6.5.1. Key market trends, growth factors and opportunities
8.3.6.5.2. Market size and forecast, by Type
8.3.6.5.3. Market size and forecast, by Moulding Method
8.3.6.5.4. Market size and forecast, by Terminal Pads
8.3.6.5.5. Market size and forecast, by Industry Vertical
8.3.6.6. Rest of Europe
8.3.6.6.1. Key market trends, growth factors and opportunities
8.3.6.6.2. Market size and forecast, by Type
8.3.6.6.3. Market size and forecast, by Moulding Method
8.3.6.6.4. Market size and forecast, by Terminal Pads
8.3.6.6.5. Market size and forecast, by Industry Vertical
8.4. Asia-Pacific
8.4.1. Key trends and opportunities
8.4.2. Market size and forecast, by Type
8.4.3. Market size and forecast, by Moulding Method
8.4.4. Market size and forecast, by Terminal Pads
8.4.5. Market size and forecast, by Industry Vertical
8.4.6. Market size and forecast, by country
8.4.6.1. Taiwan
8.4.6.1.1. Key market trends, growth factors and opportunities
8.4.6.1.2. Market size and forecast, by Type
8.4.6.1.3. Market size and forecast, by Moulding Method
8.4.6.1.4. Market size and forecast, by Terminal Pads
8.4.6.1.5. Market size and forecast, by Industry Vertical
8.4.6.2. China
8.4.6.2.1. Key market trends, growth factors and opportunities
8.4.6.2.2. Market size and forecast, by Type
8.4.6.2.3. Market size and forecast, by Moulding Method
8.4.6.2.4. Market size and forecast, by Terminal Pads
8.4.6.2.5. Market size and forecast, by Industry Vertical
8.4.6.3. Japan
8.4.6.3.1. Key market trends, growth factors and opportunities
8.4.6.3.2. Market size and forecast, by Type
8.4.6.3.3. Market size and forecast, by Moulding Method
8.4.6.3.4. Market size and forecast, by Terminal Pads
8.4.6.3.5. Market size and forecast, by Industry Vertical
8.4.6.4. India
8.4.6.4.1. Key market trends, growth factors and opportunities
8.4.6.4.2. Market size and forecast, by Type
8.4.6.4.3. Market size and forecast, by Moulding Method
8.4.6.4.4. Market size and forecast, by Terminal Pads
8.4.6.4.5. Market size and forecast, by Industry Vertical
8.4.6.5. South Korea
8.4.6.5.1. Key market trends, growth factors and opportunities
8.4.6.5.2. Market size and forecast, by Type
8.4.6.5.3. Market size and forecast, by Moulding Method
8.4.6.5.4. Market size and forecast, by Terminal Pads
8.4.6.5.5. Market size and forecast, by Industry Vertical
8.4.6.6. Rest Of Asia
8.4.6.6.1. Key market trends, growth factors and opportunities
8.4.6.6.2. Market size and forecast, by Type
8.4.6.6.3. Market size and forecast, by Moulding Method
8.4.6.6.4. Market size and forecast, by Terminal Pads
8.4.6.6.5. Market size and forecast, by Industry Vertical
8.5. LAMEA
8.5.1. Key trends and opportunities
8.5.2. Market size and forecast, by Type
8.5.3. Market size and forecast, by Moulding Method
8.5.4. Market size and forecast, by Terminal Pads
8.5.5. Market size and forecast, by Industry Vertical
8.5.6. Market size and forecast, by country
8.5.6.1. Brazil
8.5.6.1.1. Key market trends, growth factors and opportunities
8.5.6.1.2. Market size and forecast, by Type
8.5.6.1.3. Market size and forecast, by Moulding Method
8.5.6.1.4. Market size and forecast, by Terminal Pads
8.5.6.1.5. Market size and forecast, by Industry Vertical
8.5.6.2. United Arab Emirates
8.5.6.2.1. Key market trends, growth factors and opportunities
8.5.6.2.2. Market size and forecast, by Type
8.5.6.2.3. Market size and forecast, by Moulding Method
8.5.6.2.4. Market size and forecast, by Terminal Pads
8.5.6.2.5. Market size and forecast, by Industry Vertical
8.5.6.3. Saudi Arabia
8.5.6.3.1. Key market trends, growth factors and opportunities
8.5.6.3.2. Market size and forecast, by Type
8.5.6.3.3. Market size and forecast, by Moulding Method
8.5.6.3.4. Market size and forecast, by Terminal Pads
8.5.6.3.5. Market size and forecast, by Industry Vertical
8.5.6.4. South Africa
8.5.6.4.1. Key market trends, growth factors and opportunities
8.5.6.4.2. Market size and forecast, by Type
8.5.6.4.3. Market size and forecast, by Moulding Method
8.5.6.4.4. Market size and forecast, by Terminal Pads
8.5.6.4.5. Market size and forecast, by Industry Vertical
8.5.6.5. Rest of LAMEA
8.5.6.5.1. Key market trends, growth factors and opportunities
8.5.6.5.2. Market size and forecast, by Type
8.5.6.5.3. Market size and forecast, by Moulding Method
8.5.6.5.4. Market size and forecast, by Terminal Pads
8.5.6.5.5. Market size and forecast, by Industry Vertical
CHAPTER 9: COMPETITIVE LANDSCAPE
9.1. Introduction
9.2. Top winning strategies
9.3. Product Mapping of Top 10 Player
9.4. Competitive Dashboard
9.5. Competitive Heatmap
9.6. Top player positioning, 2021
CHAPTER 10: COMPANY PROFILES
10.1. Amkor Technology, Inc.
10.1.1. Company overview
10.1.2. Key Executives
10.1.3. Company snapshot
10.2. Texas Instruments Incorporated
10.2.1. Company overview
10.2.2. Key Executives
10.2.3. Company snapshot
10.3. Microchip Technology Inc.
10.3.1. Company overview
10.3.2. Key Executives
10.3.3. Company snapshot
10.4. STATS ChipPAC Pte Ltd
10.4.1. Company overview
10.4.2. Key Executives
10.4.3. Company snapshot
10.5. ASE
10.5.1. Company overview
10.5.2. Key Executives
10.5.3. Company snapshot
10.6. NXP Semiconductors
10.6.1. Company overview
10.6.2. Key Executives
10.6.3. Company snapshot
10.7. JCET Group
10.7.1. Company overview
10.7.2. Key Executives
10.7.3. Company snapshot
10.8. Powertech Technology Inc.
10.8.1. Company overview
10.8.2. Key Executives
10.8.3. Company snapshot
10.9. Tianshui Huatian Technology Co.,Ltd
10.9.1. Company overview
10.9.2. Key Executives
10.9.3. Company snapshot
10.10. ChipMOS TECHNOLOGIES INC.
10.10.1. Company overview
10.10.2. Key Executives
10.10.3. Company snapshot

LIST OF TABLES
TABLE 01. GLOBAL QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 02. QUAD-FLAT-NO-LEAD PACKAGING MARKET FOR AIR-CAVITY QFN, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 03. QUAD-FLAT-NO-LEAD PACKAGING MARKET FOR PLASTIC-MOULDED QFN, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 04. QUAD-FLAT-NO-LEAD PACKAGING MARKET FOR OTHERS, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 05. GLOBAL QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 06. QUAD-FLAT-NO-LEAD PACKAGING MARKET FOR PUNCHED, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 07. QUAD-FLAT-NO-LEAD PACKAGING MARKET FOR SAWN, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 08. GLOBAL QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 09. QUAD-FLAT-NO-LEAD PACKAGING MARKET FOR FULLY EXPOSED TERMINAL ENDS, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 10. QUAD-FLAT-NO-LEAD PACKAGING MARKET FOR PULL-BACK TERMINAL ENDS, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 11. QUAD-FLAT-NO-LEAD PACKAGING MARKET FOR SIDE WETTABLE FLANK TERMINAL ENDS, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 12. GLOBAL QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 13. QUAD-FLAT-NO-LEAD PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 14. QUAD-FLAT-NO-LEAD PACKAGING MARKET FOR INDUSTRIAL, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 15. QUAD-FLAT-NO-LEAD PACKAGING MARKET FOR AUTOMOTIVE, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 16. QUAD-FLAT-NO-LEAD PACKAGING MARKET FOR COMPUTING/NETWORKING, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 17. QUAD-FLAT-NO-LEAD PACKAGING MARKET FOR COMMUNICATIONS, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 18. QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY REGION, 2021-2031 (REVENUE, $MILLION)
TABLE 19. NORTH AMERICA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 20. NORTH AMERICA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 21. NORTH AMERICA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 22. NORTH AMERICA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 23. NORTH AMERICA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
TABLE 24. U.S. QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 25. U.S. QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 26. U.S. QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 27. U.S. QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 28. CANADA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 29. CANADA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 30. CANADA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 31. CANADA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 32. MEXICO QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 33. MEXICO QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 34. MEXICO QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 35. MEXICO QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 36. EUROPE QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 37. EUROPE QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 38. EUROPE QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 39. EUROPE QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 40. EUROPE QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
TABLE 41. GERMANY QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 42. GERMANY QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 43. GERMANY QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 44. GERMANY QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 45. UK QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 46. UK QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 47. UK QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 48. UK QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 49. FRANCE QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 50. FRANCE QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 51. FRANCE QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 52. FRANCE QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 53. SPAIN QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 54. SPAIN QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 55. SPAIN QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 56. SPAIN QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 57. ITALY QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 58. ITALY QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 59. ITALY QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 60. ITALY QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 61. REST OF EUROPE QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 62. REST OF EUROPE QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 63. REST OF EUROPE QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 64. REST OF EUROPE QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 65. ASIA-PACIFIC QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 66. ASIA-PACIFIC QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 67. ASIA-PACIFIC QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 68. ASIA-PACIFIC QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 69. ASIA-PACIFIC QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
TABLE 70. TAIWAN QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 71. TAIWAN QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 72. TAIWAN QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 73. TAIWAN QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 74. CHINA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 75. CHINA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 76. CHINA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 77. CHINA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 78. JAPAN QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 79. JAPAN QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 80. JAPAN QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 81. JAPAN QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 82. INDIA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 83. INDIA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 84. INDIA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 85. INDIA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 86. SOUTH KOREA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 87. SOUTH KOREA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 88. SOUTH KOREA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 89. SOUTH KOREA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 90. REST OF ASIA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 91. REST OF ASIA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 92. REST OF ASIA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 93. REST OF ASIA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 94. LAMEA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 95. LAMEA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 96. LAMEA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 97. LAMEA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 98. LAMEA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
TABLE 99. BRAZIL QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 100. BRAZIL QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 101. BRAZIL QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 102. BRAZIL QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 103. UNITED ARAB EMIRATES QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 104. UNITED ARAB EMIRATES QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 105. UNITED ARAB EMIRATES QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 106. UNITED ARAB EMIRATES QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 107. SAUDI ARABIA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 108. SAUDI ARABIA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 109. SAUDI ARABIA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 110. SAUDI ARABIA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 111. SOUTH AFRICA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 112. SOUTH AFRICA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 113. SOUTH AFRICA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 114. SOUTH AFRICA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 115. REST OF LAMEA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
TABLE 116. REST OF LAMEA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY MOULDING METHOD, 2021-2031 (REVENUE, $MILLION)
TABLE 117. REST OF LAMEA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY TERMINAL PADS, 2021-2031 (REVENUE, $MILLION)
TABLE 118. REST OF LAMEA QUAD-FLAT-NO-LEAD PACKAGING MARKET, BY INDUSTRY VERTICAL, 2021-2031 (REVENUE, $MILLION)
TABLE 119. AMKOR TECHNOLOGY, INC.: KEY EXECUTIVES
TABLE 120. AMKOR TECHNOLOGY, INC.: COMPANY SNAPSHOT
TABLE 121. TEXAS INSTRUMENTS INCORPORATED: KEY EXECUTIVES
TABLE 122. TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT
TABLE 123. MICROCHIP TECHNOLOGY INC.: KEY EXECUTIVES
TABLE 124. MICROCHIP TECHNOLOGY INC.: COMPANY SNAPSHOT
TABLE 125. STATS CHIPPAC PTE LTD: KEY EXECUTIVES
TABLE 126. STATS CHIPPAC PTE LTD: COMPANY SNAPSHOT
TABLE 127. ASE: KEY EXECUTIVES
TABLE 128. ASE: COMPANY SNAPSHOT
TABLE 129. NXP SEMICONDUCTORS: KEY EXECUTIVES
TABLE 130. NXP SEMICONDUCTORS: COMPANY SNAPSHOT
TABLE 131. JCET GROUP: KEY EXECUTIVES
TABLE 132. JCET GROUP: COMPANY SNAPSHOT
TABLE 133. POWERTECH TECHNOLOGY INC.: KEY EXECUTIVES
TABLE 134. POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT
TABLE 135. TIANSHUI HUATIAN TECHNOLOGY CO.,LTD: KEY EXECUTIVES
TABLE 136. TIANSHUI HUATIAN TECHNOLOGY CO.,LTD: COMPANY SNAPSHOT
TABLE 137. CHIPMOS TECHNOLOGIES INC.: KEY EXECUTIVES
TABLE 138. CHIPMOS TECHNOLOGIES INC.: COMPANY SNAPSHOT

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