CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO Perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.3. Porter’s five forces analysis
3.3.1. Moderate to high bargaining power of suppliers
3.3.2. High to moderate threat of new entrants
3.3.3. Moderate to high threat of substitutes
3.3.4. Low to high intensity of rivalry
3.3.5. Moderate to high bargaining power of buyers
3.4. Market dynamics
3.4.1. Drivers
3.4.1.1. Increase in adoption of wireless technology based devices
3.4.1.2. Rise in demand of the modern system-on-chip (SoC) design
3.4.1.3. Growing adoption of IoT and AI applications
3.4.2. Restraints
3.4.2.1. Intellectual property (IP) security concerns
3.4.3. Opportunities
3.4.3.1. Surge in demand for consumer electronics
3.4.3.2. Technological advancement
CHAPTER 4: SEMICONDUCTOR IP MARKET, BY DESIGN IP
4.1. Overview
4.1.1. Market size and forecast
4.2. Processor IP
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market share analysis by country
4.3. Interface IP
4.3.1. Key market trends, growth factors and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market share analysis by country
4.4. Memory IP
4.4.1. Key market trends, growth factors and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market share analysis by country
CHAPTER 5: SEMICONDUCTOR IP MARKET, BY IP SOURCE
5.1. Overview
5.1.1. Market size and forecast
5.2. Licensing
5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market share analysis by country
5.3. Royalty
5.3.1. Key market trends, growth factors and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market share analysis by country
CHAPTER 6: SEMICONDUCTOR IP MARKET, BY IP CORE
6.1. Overview
6.1.1. Market size and forecast
6.2. Soft IP
6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market share analysis by country
6.3. Hard IP
6.3.1. Key market trends, growth factors and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market share analysis by country
CHAPTER 7: SEMICONDUCTOR IP MARKET, BY APPLICATION
7.1. Overview
7.1.1. Market size and forecast
7.2. Consumer Electronics
7.2.1. Key market trends, growth factors and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market share analysis by country
7.3. Telecom
7.3.1. Key market trends, growth factors and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market share analysis by country
7.4. Automotive
7.4.1. Key market trends, growth factors and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market share analysis by country
7.5. Others
7.5.1. Key market trends, growth factors and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market share analysis by country
CHAPTER 8: SEMICONDUCTOR IP MARKET, BY REGION
8.1. Overview
8.1.1. Market size and forecast By Region
8.2. North America
8.2.1. Key market trends, growth factors and opportunities
8.2.2. Market size and forecast, by Design IP
8.2.3. Market size and forecast, by IP Source
8.2.4. Market size and forecast, by IP Core
8.2.5. Market size and forecast, by Application
8.2.6. Market size and forecast, by country
8.2.6.1. U.S.
8.2.6.1.1. Market size and forecast, by Design IP
8.2.6.1.2. Market size and forecast, by IP Source
8.2.6.1.3. Market size and forecast, by IP Core
8.2.6.1.4. Market size and forecast, by Application
8.2.6.2. Canada
8.2.6.2.1. Market size and forecast, by Design IP
8.2.6.2.2. Market size and forecast, by IP Source
8.2.6.2.3. Market size and forecast, by IP Core
8.2.6.2.4. Market size and forecast, by Application
8.2.6.3. Mexico
8.2.6.3.1. Market size and forecast, by Design IP
8.2.6.3.2. Market size and forecast, by IP Source
8.2.6.3.3. Market size and forecast, by IP Core
8.2.6.3.4. Market size and forecast, by Application
8.3. Europe
8.3.1. Key market trends, growth factors and opportunities
8.3.2. Market size and forecast, by Design IP
8.3.3. Market size and forecast, by IP Source
8.3.4. Market size and forecast, by IP Core
8.3.5. Market size and forecast, by Application
8.3.6. Market size and forecast, by country
8.3.6.1. UK
8.3.6.1.1. Market size and forecast, by Design IP
8.3.6.1.2. Market size and forecast, by IP Source
8.3.6.1.3. Market size and forecast, by IP Core
8.3.6.1.4. Market size and forecast, by Application
8.3.6.2. Germany
8.3.6.2.1. Market size and forecast, by Design IP
8.3.6.2.2. Market size and forecast, by IP Source
8.3.6.2.3. Market size and forecast, by IP Core
8.3.6.2.4. Market size and forecast, by Application
8.3.6.3. France
8.3.6.3.1. Market size and forecast, by Design IP
8.3.6.3.2. Market size and forecast, by IP Source
8.3.6.3.3. Market size and forecast, by IP Core
8.3.6.3.4. Market size and forecast, by Application
8.3.6.4. Spain
8.3.6.4.1. Market size and forecast, by Design IP
8.3.6.4.2. Market size and forecast, by IP Source
8.3.6.4.3. Market size and forecast, by IP Core
8.3.6.4.4. Market size and forecast, by Application
8.3.6.5. Italy
8.3.6.5.1. Market size and forecast, by Design IP
8.3.6.5.2. Market size and forecast, by IP Source
8.3.6.5.3. Market size and forecast, by IP Core
8.3.6.5.4. Market size and forecast, by Application
8.3.6.6. Rest of Europe
8.3.6.6.1. Market size and forecast, by Design IP
8.3.6.6.2. Market size and forecast, by IP Source
8.3.6.6.3. Market size and forecast, by IP Core
8.3.6.6.4. Market size and forecast, by Application
8.4. Asia-Pacific
8.4.1. Key market trends, growth factors and opportunities
8.4.2. Market size and forecast, by Design IP
8.4.3. Market size and forecast, by IP Source
8.4.4. Market size and forecast, by IP Core
8.4.5. Market size and forecast, by Application
8.4.6. Market size and forecast, by country
8.4.6.1. China
8.4.6.1.1. Market size and forecast, by Design IP
8.4.6.1.2. Market size and forecast, by IP Source
8.4.6.1.3. Market size and forecast, by IP Core
8.4.6.1.4. Market size and forecast, by Application
8.4.6.2. Japan
8.4.6.2.1. Market size and forecast, by Design IP
8.4.6.2.2. Market size and forecast, by IP Source
8.4.6.2.3. Market size and forecast, by IP Core
8.4.6.2.4. Market size and forecast, by Application
8.4.6.3. India
8.4.6.3.1. Market size and forecast, by Design IP
8.4.6.3.2. Market size and forecast, by IP Source
8.4.6.3.3. Market size and forecast, by IP Core
8.4.6.3.4. Market size and forecast, by Application
8.4.6.4. South Korea
8.4.6.4.1. Market size and forecast, by Design IP
8.4.6.4.2. Market size and forecast, by IP Source
8.4.6.4.3. Market size and forecast, by IP Core
8.4.6.4.4. Market size and forecast, by Application
8.4.6.5. Rest of Asia-Pacific
8.4.6.5.1. Market size and forecast, by Design IP
8.4.6.5.2. Market size and forecast, by IP Source
8.4.6.5.3. Market size and forecast, by IP Core
8.4.6.5.4. Market size and forecast, by Application
8.5. LAMEA
8.5.1. Key market trends, growth factors and opportunities
8.5.2. Market size and forecast, by Design IP
8.5.3. Market size and forecast, by IP Source
8.5.4. Market size and forecast, by IP Core
8.5.5. Market size and forecast, by Application
8.5.6. Market size and forecast, by country
8.5.6.1. Latin America
8.5.6.1.1. Market size and forecast, by Design IP
8.5.6.1.2. Market size and forecast, by IP Source
8.5.6.1.3. Market size and forecast, by IP Core
8.5.6.1.4. Market size and forecast, by Application
8.5.6.2. Middle East
8.5.6.2.1. Market size and forecast, by Design IP
8.5.6.2.2. Market size and forecast, by IP Source
8.5.6.2.3. Market size and forecast, by IP Core
8.5.6.2.4. Market size and forecast, by Application
8.5.6.3. Africa
8.5.6.3.1. Market size and forecast, by Design IP
8.5.6.3.2. Market size and forecast, by IP Source
8.5.6.3.3. Market size and forecast, by IP Core
8.5.6.3.4. Market size and forecast, by Application
CHAPTER 9: COMPETITIVE LANDSCAPE
9.1. Introduction
9.2. Top winning strategies
9.3. Product mapping of top 10 player
9.4. Competitive dashboard
9.5. Competitive heatmap
9.6. Top player positioning, 2022
CHAPTER 10: COMPANY PROFILES
10.1. Faraday Technology Corporation
10.1.1. Company overview
10.1.2. Key executives
10.1.3. Company snapshot
10.1.4. Operating business segments
10.1.5. Product portfolio
10.1.6. Business performance
10.1.7. Key strategic moves and developments
10.2. Arm Limited
10.2.1. Company overview
10.2.2. Key executives
10.2.3. Company snapshot
10.2.4. Operating business segments
10.2.5. Product portfolio
10.2.6. Business performance
10.3. VeriSilicon
10.3.1. Company overview
10.3.2. Key executives
10.3.3. Company snapshot
10.3.4. Operating business segments
10.3.5. Product portfolio
10.4. Synopsys, Inc.
10.4.1. Company overview
10.4.2. Key executives
10.4.3. Company snapshot
10.4.4. Operating business segments
10.4.5. Product portfolio
10.4.6. Business performance
10.4.7. Key strategic moves and developments
10.5. ALPHAWAVE SEMI
10.5.1. Company overview
10.5.2. Key executives
10.5.3. Company snapshot
10.5.4. Operating business segments
10.5.5. Product portfolio
10.5.6. Business performance
10.5.7. Key strategic moves and developments
10.6. ARTERIS, INC
10.6.1. Company overview
10.6.2. Key executives
10.6.3. Company snapshot
10.6.4. Operating business segments
10.6.5. Product portfolio
10.6.6. Business performance
10.6.7. Key strategic moves and developments
10.7. CEVA Inc.
10.7.1. Company overview
10.7.2. Key executives
10.7.3. Company snapshot
10.7.4. Operating business segments
10.7.5. Product portfolio
10.7.6. Business performance
10.7.7. Key strategic moves and developments
10.8. Cadence Design Systems, Inc.
10.8.1. Company overview
10.8.2. Key executives
10.8.3. Company snapshot
10.8.4. Operating business segments
10.8.5. Product portfolio
10.8.6. Business performance
10.9. Frontgrade Gaisler
10.9.1. Company overview
10.9.2. Key executives
10.9.3. Company snapshot
10.9.4. Operating business segments
10.9.5. Product portfolio
10.10. Rambus Inc.
10.10.1. Company overview
10.10.2. Key executives
10.10.3. Company snapshot
10.10.4. Operating business segments
10.10.5. Product portfolio
10.10.6. Business performance
10.10.7. Key strategic moves and developments
*** 免責事項 ***
https://www.globalresearch.co.jp/disclaimer/